Semiconductor device including a silicon film having an irregular surface

Claim 2

A semiconductor device using a silicon film having crystallinity, wherein an average film thickness of said silicon film is 150 to 800 Å; a surface of said silicon film has irregularities, and a level difference between a highest portion of said irregularities and a lowest portion thereof is 100 to 700 Å, and a tip of said highest portion has a roundness having a radius of curvature greater than 10 Å.

Claim 3

The semiconductor device of claim 1, wherein a metal element to promote a crystallization of silicon is contained in said silicon film in a concentration of 1×10 18 to 5×10 19 cm -3 .

Claim 4

The semiconductor device of claim 2, wherein at least one of elements selected from Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu, and Au are used as the metal element to promote the crystallization of said silicon.

Claim 5

The semiconductor device of claim 1, wherein a metal element to promote a crystallization of silicon is contained in said silicon film in a concentration of 1×10 16 to 5×10 19 cm -3 .

Claim 6

The semiconductor device of claim 4, wherein at least one of elements selected from Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu, and Au are used as the metal element to promote a crystallization of said silicon.

Claim 7

A semiconductor device using a silicon film having crystallinity, wherein an average film thickness of said silicon film is 150 to 800 Å; a surface of said silicon film has irregularities, and a height difference between a peak of said irregularities and a valley thereof is 100 to 700 Å; said silicon film has an active region in which crystal growth takes place in a direction parallel to a substrate; and a tip of said peak has a roundness having a radius of curvature greater than 10 Å.

Claim 8

A semiconductor device using a silicon film having crystallinity, wherein an average film thickness of said silicon film is 150 to 800 Å; a surface of said silicon film has irregularities, and a height difference between a peak of said irregularities and a valley thereof is 100 to 700 Å; said silicon film has an active region in which crystal growth takes place in a direction parallel to a substrate; and a tip of said peak has a roundness having a radius of curvature greater than 10 Å.

Claim 9

The semiconductor device of claim 6, wherein a metal element to promote a crystallization of silicon is contained in said silicon film in a concentration of 1×10 18 to 5×10 19 cm -3 .

Claim 10

The semiconductor device of claim 7, wherein at least one of elements selected from Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu, and Au are used as the metal element to promote the crystallization of said silicon.

Claim 11

The semiconductor device of claim 6, wherein a metal element to promote a crystallization of silicon is contained in said silicon film in a concentration of 1×10 16 to 5×10 19 cm -3 .

Claim 12

The semiconductor device of claim 9, wherein at least one of elements selected from Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt, Cu, and Au are used as the metal element to promote a crystallization of said silicon.

Claim 13

A semiconductor device using a silicon film having crystallinity, wherein an average film thickness of said silicon film is 150 to 800 Å; a surface of said silicon film has irregularities; a level difference between a highest portion of said irregularities and a lowest portion thereof is 50 to 100% of said average film thickness; and wherein a tip of said highest portion has a roundness having a radius of curvature greater than 10 Å.

Claim 14

A semiconductor device using a silicon film having crystallinity, wherein an average film thickness of said silicon film is 150 to 800 Å; a surface of said silicon film has irregularities; a level difference between a highest portion of said irregularities and a lowest portion thereof is 50 to 100% of said average film thickness; and wherein a tip of said highest portion has a roundness having a radius of curvature greater than 10 Å.

Claim 15

A semiconductor device comprising: a substrate having an insulating surface; a channel semiconductor layer formed on said insulating surface, said semiconductor layer comprising crystalline silicon; source and drain semiconductor layers between which said channel semiconductor layer extends; a gate insulating layer adjacent to said channel semiconductor layer; and a gate electrode adjacent to said semiconductor layer with said gate insulating layer interposed therebetween, wherein an average thickness of said channel semiconductor layer is 150 to 800 Å, said channel semiconductor layer has a surface roughness, a level difference between a peak of said surface roughness and a bottom thereof is 100 to 700 Å, and a tip of said peak has a roundness having a radius of curvature greater than 10 Å.

Claim 16

A semiconductor device comprising: a substrate having an insulating surface; a channel semiconductor layer formed on said insulating surface, said semiconductor layer comprising crystalline silicon; source and drain semiconductor layers between which said channel semiconductor layer extends; a gate insulating layer adjacent to said channel semiconductor layer; and a gate electrode adjacent to said semiconductor layer with said gate insulating layer interposed therebetween, wherein an average thickness of said channel semiconductor layer is 150 to 800 Å, said channel semiconductor layer has a surface roughness, a level difference between a peak of said surface roughness and a bottom thereof is 100 to 700 Å, and a tip of said peak has a roundness having a radius of curvature greater than 10 Å.

Claim 17

The semiconductor device of claim 12, wherein said channel semiconductor layer contains a catalyst for promoting a crystallization of silicon.