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US5616448A
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Photosensitive resin composition and a process for forming a patterned polyimide film using the same
Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1996-01-26
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Granted: 1997-04-01
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Expires: 2016-01-26
Abstract
Abstract The composition comprises (A) a specified polyimide precursor and (B) at least one member selected from the group consisting of a sensitizer, a photopolymerization initiator and a combination thereof. The above process comprises applying a solution of the above photosensitive resin composition on a substrate, followed by drying to form a film; exposing the film to light, followed by developing with an aqueous alkaline solution to form a patterned film; and curing the patterned film. The composition has little ionic impurities mixed therein during the preparation of the composition; is excellent in storage stability in the state of a solution; can be developed with an aqueous alkaline solution, which does not cause the problems such as a problem to health and a problem to the treatment of waste liquids, within a short time; and exhibits a good sensitivity even when formed a thick film, thereby readily providing a patterned resinous film. Further, the cured product obtained by curing the patterned film has a superior heat resistance and excellent electrical and mechanical properties, which can be suitably used as a protective film for use in electronic parts.
Inventors
- 👤 Hideto Kato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:15
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0387
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
213 words
A photosensitive resin composition comprising: (A) a polyimide precursor having an average molecular weight of at least 10,000 comprised of a structural unit represented by the following general formula (1): ##STR27## wherein X is a tetravalent organic group having an aromatic ring, Y is an aromatic ring-containing divalent organic group or a siloxane bond-containing divalent organic group, the two Z, are each independently a hydrogen atom or an acryloxy group- or methacryloxy group-containing monovalent organic group represented by the following general formula (2): ##STR28## wherein R is a hydrogen atom or a methyl group, and the two are each, independently a hydroxyl group or an acryloxy group- or methacryloxy group-containing amino group represented by the following general formula (3): --NH--CH.sub.2 CH.sub.2 OCO--C(R')═CH.sub.2 ( 3) wherein R' is a hydrogen atom or a methyl group, provided that the content of the monovalent organic group represented by said general formula (2) accounts for at least 30 mol % of the total Z contained in the polyimide precursor and the content of the amino group represented by the general formula (3) accounts for 10 to 50 mol % of the total W contained in the polyimide precursor; and (B) one member selected from the group consisting of a sensitizer, a photopolymerization initiator, and a combination thereof.
Claim 2
Dependent Claim
213 words
A photosensitive resin composition comprising: (A) a polyimide precursor having an average molecular weight of at least 10,000 comprised of a structural unit represented by the following general formula (1): ##STR27## wherein X is a tetravalent organic group having an aromatic ring, Y is an aromatic ring-containing divalent organic group or a siloxane bond-containing divalent organic group, the two Z, are each independently a hydrogen atom or an acryloxy group- or methacryloxy group-containing monovalent organic group represented by the following general formula (2): ##STR28## wherein R is a hydrogen atom or a methyl group, and the two are each, independently a hydroxyl group or an acryloxy group- or methacryloxy group-containing amino group represented by the following general formula (3): --NH--CH.sub.2 CH.sub.2 OCO--C(R')═CH.sub.2 ( 3) wherein R' is a hydrogen atom or a methyl group, provided that the content of the monovalent organic group represented by said general formula (2) accounts for at least 30 mol % of the total Z contained in the polyimide precursor and the content of the amino group represented by the general formula (3) accounts for 10 to 50 mol % of the total W contained in the polyimide precursor; and (B) one member selected from the group consisting of a sensitizer, a photopolymerization initiator, and a combination thereof.
Claim 3
Dependent Claim
22 words
The composition of claim 1, wherein X in the general formula (1) is selected from the class consisting of the following: ##STR29##
Claim 4
Dependent Claim
178 words
The composition of claim 1, wherein Y in the general formula (1) is selected from the group consisting of ##STR30## wherein R 2 is --H, --Cl, --CONH 2 or an alkyl group having 1 to 3 carbon atoms; ##STR31## wherein R 1 is a single bond, --O--, --SO 2 --, --S--, or a substituted or unsubstituted alkylene group having 1 to 3 carbon atoms, and a plurality of R 2 are each independently as defined above; ##STR32## wherein a plurality of R 1 are each independently as defined above, and a plurality of R 2 are each independently as defined above; ##STR33## wherein R 1 is as defined above, and a plurality of R 2 are each independently as defined above; and ##STR34## wherein a plurality of R 3 are each independently an alkylene group having 3 to 4 carbon atoms, a phenylene group or a group represented by the formula: ##STR35## a plurality of R 4 are each independently an alkyl group having 1 to 3 carbon atoms, and m is an integer of 1 to 40.
Claim 5
Dependent Claim
20 words
The composition of claim 1, wherein the polyimide precursor (A) has an average molecular weight of from 20,000 to 200,000.
Claim 6
Dependent Claim
64 words
The composition of claim 1, wherein the content of the monovalent organic group represented by said general formula (2) accounts for 30 to 80 mol % of the total Z contained in the polyimide precursor and the content of the amino group represented by said general formula (3) accounts for 20 to 40 mol % of the total W contained in the polyimide precursor.
Claim 7
Dependent Claim
122 words
The composition of claim 1, wherein the polyimide precursor (A) comprises a reaction product of a compound comprised of a structural unit represented by the general formula (11): ##STR36## wherein X, Y and Z are as defined in claim 1, with a 2-isocyanatoethyl acrylate compound represented by the general formula (12): CH.sub.2 ═C(R')--COOCH.sub.2 CH.sub.2 NCO (12) wherein R' is as defined in claim 1; said compound comprised of the structural unit having the general formula (11) being a reaction product of a tetracarboxylic acid dianhydride represented by the following general formula (9): ##STR37## wherein X is as defined in claim 1, with a diamine compound represented by the general formula (10): ##STR38## wherein Y and Z are as defined in claim 1.
Claim 8
Dependent Claim
23 words
The composition of claim 1, wherein the amount of the component (B) is 0.1 to 20% by weight based on the component (A).
References Cited (Backward Citations)
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