US5614735A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor laser device
Assignee: Fuji Electric Co Ltd
•
Filing: 1995-06-05
•
Granted: 1997-03-25
•
Expires: 2015-06-05
Abstract
Abstract A lead frame 32 has projecting portions 36, 37 projecting in a right-and-left direction, like arms, from the sides of its broad end portion 32a. The projecting piece portions 36, 37 include mold region parts 36a, 37a that are molded within a flat type sealing resin member 35, and exposed piece portions 36b, 37b that are exposed to the outside from the sealing resin member 35. One of the exposed parts, 36b, has an arcuate segment 36c inscribed in a hypothetical circle drawn with radius R about the point of light emission, C, on an LD chip 1. The other exposed part 37b has an arcuate segment 37c inscribed in the hypothetical circle drawn with radius R. A semiconductor laser device having these arcuate segments can be fitted into a stepped accommodating hole of an instrument and set in place there, just as can a can type semiconductor laser device. The point of light emission, C, on the LD chip 1 is also fixed. Thus, neither a shift in the point of light emission, C, nor the peeling of resin arises. Moreover, an annular mounting aid 48 inscribed in the hypothetical circle drawn with radius R can be attached, instead of the arcuate segments 36c, 37c, to the exposed parts 36b, 37b, whereby the same effects can be obtained.
Inventors
- 👤 Shoji Kitamura
- 👤 Satoru Nagano
- 👤 Yoichi Shindo
- 👤 Katsumi Oguri
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 15:50
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/0231; H01S5/0232; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/8506; H10H20/857; H01S5/02218; H01S5/02234; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
121 words
A semiconductor laser device comprising: a laser diode chip fixed on a broad portion of a lead frame via a submount layer; a sealing resin member having the laser diode chip molded with a transparent resin; a first exposed part extending from a first side of the lead frame and projecting outwards from the sealing resin member, the first exposed part having an arcuate segment inscribed in a hypothetical circle having the point of light emission on the laser diode chip as its center; and a second exposed part extending from a second side of the lead frame and projecting outwards from the sealing resin member, the second exposed part having another arcuate segment which is inscribed in the hypothetical circle.
Claim 2
Dependent Claim
121 words
A semiconductor laser device comprising: a laser diode chip fixed on a broad portion of a lead frame via a submount layer; a sealing resin member having the laser diode chip molded with a transparent resin; a first exposed part extending from a first side of the lead frame and projecting outwards from the sealing resin member, the first exposed part having an arcuate segment inscribed in a hypothetical circle having the point of light emission on the laser diode chip as its center; and a second exposed part extending from a second side of the lead frame and projecting outwards from the sealing resin member, the second exposed part having another arcuate segment which is inscribed in the hypothetical circle.
Claim 3
Dependent Claim
18 words
The semiconductor laser device of claim 1, wherein the arcuate segments do not touch the sealing resin member.
Claim 4
Dependent Claim
91 words
A semiconductor laser device comprising; a laser diode chip fixed on a broad portion of a lead frame via a submount layer; a sealing resin member having the laser diode chip molded with a transparent resin; a pair of exposed parts extending on both sides of the lead frame and projecting outwards from the sealing resin member; and an annular mounting aid secured to the exposed parts, the annular mounting aid being inscribed in a hypothetical circle having the point of light emission on the laser diode chip as its center.
Claim 5
Dependent Claim
91 words
A semiconductor laser device comprising; a laser diode chip fixed on a broad portion of a lead frame via a submount layer; a sealing resin member having the laser diode chip molded with a transparent resin; a pair of exposed parts extending on both sides of the lead frame and projecting outwards from the sealing resin member; and an annular mounting aid secured to the exposed parts, the annular mounting aid being inscribed in a hypothetical circle having the point of light emission on the laser diode chip as its center.
Claim 6
Dependent Claim
22 words
The semiconductor laser device as claimed in claim 3 wherein the annular mounting aid is in the form of an open loop.
Claim 7
Dependent Claim
19 words
The semiconductor laser device of claim 3, wherein the annular mounting aid does not touch the sealing resin member.
Claim 8
Dependent Claim
209 words
A semiconductor light-emitting device which is configured to be mounted on a member having a hole with a cylindrical wall, comprising: a lead frame having a broad portion, a first projecting portion which extends from a first side of the broad portion, and a second projecting portion which extends from a second side of the broad portion; a semiconductor light-emitting element; means for mounting the light-emitting element on the broad portion of the lead frame; and a resin member which encloses the broad portion of the lead frame, the light-emitting element, the means for mounting, part of the first projecting portion of the lead frame, and part of the second projecting portion of the lead frame, the sealing resin member leaving another part of the first projecting portion and another part of the second projecting portion exposed, wherein the exposed part of the first projecting portion and the exposed part of the second projecting portion have first and second bent segments, respectively, the first bent segment being shaped to contact the cylindrical wall of the hole at a plurality of spaced-apart locations on the cylindrical wall and the second bent segment also being shaped to contact the cylindrical wall at a plurality of spaced-apart locations on the cylindrical wall.
Claim 9
Dependent Claim
209 words
A semiconductor light-emitting device which is configured to be mounted on a member having a hole with a cylindrical wall, comprising: a lead frame having a broad portion, a first projecting portion which extends from a first side of the broad portion, and a second projecting portion which extends from a second side of the broad portion; a semiconductor light-emitting element; means for mounting the light-emitting element on the broad portion of the lead frame; and a resin member which encloses the broad portion of the lead frame, the light-emitting element, the means for mounting, part of the first projecting portion of the lead frame, and part of the second projecting portion of the lead frame, the sealing resin member leaving another part of the first projecting portion and another part of the second projecting portion exposed, wherein the exposed part of the first projecting portion and the exposed part of the second projecting portion have first and second bent segments, respectively, the first bent segment being shaped to contact the cylindrical wall of the hole at a plurality of spaced-apart locations on the cylindrical wall and the second bent segment also being shaped to contact the cylindrical wall at a plurality of spaced-apart locations on the cylindrical wall.
Claim 10
Dependent Claim
29 words
The semiconductor light-emitting device of claim 6, wherein the lead frame is a unitary element, with the first and second projecting portions being integrally connected to the broad portion.
Claim 11
Dependent Claim
16 words
The semiconductor light-emitting device of claim 6, wherein the light-emitting element comprises a laser diode chip.
Claim 12
Dependent Claim
22 words
The semiconductor light-emitting device of claim 6, wherein neither the first bent segment nor the second bent segment touches the resin member.
Claim 13
Dependent Claim
16 words
The semiconductor light-emitting device for claim 6, wherein the first bent segment has an arcuate shape.
Claim 14
Dependent Claim
29 words
The semiconductor light-emitting device of claim 10, wherein the first bent segment has a length that is approximately equal to a fourth of the circumference of the cylindrical wall.
Claim 15
Dependent Claim
16 words
The semiconductor light-emitting device of claim 10, wherein the second bent segment has an arcuate shape.
Claim 16
Dependent Claim
52 words
The semiconductor light-emitting device of claim 12, wherein the first bent segment has a length that is approximately equal to a fourth of the circumference of the cylindrical wall and the second bent segment also has a length that is approximately equal to a fourth of the circumference of the cylindrical wall.
Claim 17
Dependent Claim
39 words
The semiconductor light-emitting device of claim 13, wherein the first bent segment extends in one of a clockwise and a counterclockwise direction and the second bent segment also extends in said one of a clockwise and a counterclockwise direction.
Claim 18
Dependent Claim
39 words
The semiconductor light-emitting device of claim 12, wherein the first bent segment extends in one of a clockwise and a counterclockwise direction and the second bent segment also extends in said one of a clockwise and a counterclockwise direction.
Claim 19
Dependent Claim
27 words
The semiconductor light-emitting element of claim 15, wherein the first bent segment has a length that is approximately equal to the length of the second bent segment.
Claim 20
Dependent Claim
180 words
A semiconductor light-emitting device, comprising: a lead frame having a broad portion, a first projecting portion which extends from a first side of the broad portion, and a second projecting portion which extends from a second side of the broad portion; a semiconductor light-emitting element; means for mounting the light-emitting element on the broad portion of the lead frame; a resin member which encloses the broad portion of the lead frame, the light-emitting element, the means for mounting, part of the first projecting portion of the lead frame, and part of the second projecting portion of the lead frame, the sealing resin member leaving another part of the first projecting portion and another part of the second projecting portion exposed, the exposed parts of the first and second projecting portions extending outwardly from the resin member and having outer ends that are spaced apart from the resin member; and a mounting aid to which the outer ends of the exposed parts of the first and second projecting portions are attached, the mounting aid being spaced apart from the resin member.
Claim 21
Dependent Claim
180 words
A semiconductor light-emitting device, comprising: a lead frame having a broad portion, a first projecting portion which extends from a first side of the broad portion, and a second projecting portion which extends from a second side of the broad portion; a semiconductor light-emitting element; means for mounting the light-emitting element on the broad portion of the lead frame; a resin member which encloses the broad portion of the lead frame, the light-emitting element, the means for mounting, part of the first projecting portion of the lead frame, and part of the second projecting portion of the lead frame, the sealing resin member leaving another part of the first projecting portion and another part of the second projecting portion exposed, the exposed parts of the first and second projecting portions extending outwardly from the resin member and having outer ends that are spaced apart from the resin member; and a mounting aid to which the outer ends of the exposed parts of the first and second projecting portions are attached, the mounting aid being spaced apart from the resin member.
Claim 22
Dependent Claim
26 words
The semiconductor light-emitting device of claim 17, wherein the broad portion of the lead frame and the first and second projecting portions lie in a plane.
Claim 23
Dependent Claim
40 words
The semiconductor light-emitting device of claim 17, wherein the mounting aid comprises an annular member having a central axis, and wherein the semiconductor light-emitting element is mounted at a location which lies along the central axis of the annular member.
Claim 24
Dependent Claim
16 words
The semiconductor light-emitting device of claim 17, wherein the light-emitting element comprises a laser diode chip.
References Cited (Backward Citations)
US4157486A
Cited
JPH02125687A
Cited
US5270555A
Cited
EP0484887A2
Cited
US5355385A
Cited
US5444726A
Cited
EP0568830A1
Cited
US5266817A
Cited
US5384471A
Cited
GB2284934A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-24 | 2000-09-23 | 2001-03-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-24 | 2004-09-23 | 2005-03-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-24 | 2008-09-23 | 2009-03-25 | $7700.00 | Window Closed / Lapsed |