Patent US5607059A successfully refreshed from Google Patents.
US5607059A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface package type semiconductor package and method of producing semiconductor memory
Assignee: Hitachi Ltd
•
Filing: 1994-06-23
•
Granted: 1997-03-04
•
Expires: 2014-06-23
Abstract
Abstract In surface packaging of thin resin packages such as resin molded memory ICs cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
Inventors
- 👤 Wahei Kitamura
- 👤 Gen Murakami
- 👤 Kunihiko Nishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:19
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/06; B32B27/08; B32B27/18; B32B27/30; B32B27/304; B32B27/32; B65; B65D; B65D79/00; B65D79/02; B65D81/00; B65D81/24; B65D81/26; B65D81/266; H; H05; H05K; H05K13/00; H05K13/0084; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/413; H10W70/456; H10W70/457; H10W72/00; H10W72/50; H10W74/00; H10W74/10; H10W74/111; H10W74/121; B32B2307/00; B32B2307/70; B32B2307/724; B32B2307/7242; B32B2307/7246; B32B2311/00; B32B2311/24; B32B2323/00; B32B2323/04; B32B2327/00; B32B2327/06; B32B2439/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10S; Y10S174/00; Y10S174/08; Y10S428/00; Y10S428/922; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 91
Claim 1
Independent Claim
248 words
A packaged device comprising: a moisture-proofing bag member which is made of a laminate; and at least one surface-mount resin molded semiconductor device and a desiccant sealed in said moisture-proofing bag member, such that the desiccant absorbs moisture within the moisture-proofing bag member when the resin molded semiconductor device is sealed in the bag member, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to performing surface mounting; wherein said laminate forming the moisture-proofing bag member is made of (a) a barrier layer for sufficiently preventing intrusion of moisture into the moisture-proofing bag member when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the at least one surface-mount resin molded semiconductor device during surface mounting, (b) an inner charge-preventing layer formed inside of said barrier layer and (c) an outer charge-preventing layer formed outside of said barrier layer.
Claim 2
Dependent Claim
248 words
A packaged device comprising: a moisture-proofing bag member which is made of a laminate; and at least one surface-mount resin molded semiconductor device and a desiccant sealed in said moisture-proofing bag member, such that the desiccant absorbs moisture within the moisture-proofing bag member when the resin molded semiconductor device is sealed in the bag member, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to performing surface mounting; wherein said laminate forming the moisture-proofing bag member is made of (a) a barrier layer for sufficiently preventing intrusion of moisture into the moisture-proofing bag member when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the at least one surface-mount resin molded semiconductor device during surface mounting, (b) an inner charge-preventing layer formed inside of said barrier layer and (c) an outer charge-preventing layer formed outside of said barrier layer.
Claim 3
Dependent Claim
15 words
A packed device according to claim 1, wherein said barrier layer is an aluminum film.
Claim 4
Dependent Claim
16 words
A packaged device according to claim 1, wherein said barrier layer is made of vinylidene chloride.
Claim 5
Dependent Claim
29 words
A packaged device according to claim 1, wherein said inner charge-preventing layer is an innermost layer of said moisture-proofing bag member, and said innermost layer is made of polyethylene.
Claim 6
Dependent Claim
16 words
A packaged device according to claim 4, wherein said polyethylene contains an antistatic agent kneaded therein.
Claim 7
Dependent Claim
18 words
A packaged device according to claim 4, wherein said moisture-proofing bag member is sealed by heat-sealing said polyethylene.
Claim 8
Dependent Claim
20 words
A packaged device according to claim 6, wherein said moisture-proofing bag member is press-sealed by applying heat to said polyethylene.
Claim 9
Dependent Claim
21 words
A packaged device according to claim 6, wherein said moisture-proofing bag member is press-sealed by applying ultrasonic waves to said polyethylene.
Claim 10
Dependent Claim
15 words
A packaged device according to claim 1, wherein said moisture-proofing bag member is air-tight sealed.
Claim 11
Dependent Claim
32 words
A packaged device according to claim 1, further comprising: at least one magazine storing said surface-mount resin molded semiconductor device therein, said at least one magazine being in said moisture-proofing bag member.
Claim 12
Dependent Claim
29 words
A packaged device according to claim 10, further comprising: an interior box storing a plurality of said magazines therein, said interior box being located in said moisture-proofing bag member.
Claim 13
Dependent Claim
32 words
A packaged device according to claim 1, further comprising: at least one tray storing said surface-mount resin molded semiconductor device therein, said at least one tray being in said moisture-proofing bag member.
Claim 14
Dependent Claim
28 words
A packaged device according to claim 12, further comprising: an interior box storing a plurality of the trays therein, said interior box being in said moisture-proofing bag member.
Claim 15
Dependent Claim
18 words
A packaged device according to claim 1, further comprising: an exterior box storing said moisture-proofing bag member therein.
Claim 16
Dependent Claim
32 words
A packaged device according to claim 14, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 17
Dependent Claim
36 words
A packaged device according to claim 1, further comprising: a conveying auxiliary member, which is made of electrically conductive material, having said surface-mount resin molded semiconductor device stored therein, and being in said moisture-proofing bag member.
Claim 18
Dependent Claim
15 words
A packaged device according to claim 16, wherein said conveying auxiliary member is a magazine.
Claim 19
Dependent Claim
15 words
A packaged device according to claim 16, wherein said conveying auxiliary member is a tray.
Claim 20
Dependent Claim
18 words
A packaged device according to claim 16, further comprising: an exterior box storing said moisture-proofing bag member therein.
Claim 21
Dependent Claim
32 words
A packaged device according to claim 19, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 22
Dependent Claim
263 words
A packaged device, comprising: at least one surface-mount resin molded semiconductor device, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to performing surface mounting; a moisture-proofing bag member, which is made of multi-layered film, including (a) a barrier layer sufficiently preventing intrusion of moisture therein when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the semiconductor device during surface mounting, due to moisture having entered the semiconductor device during said time period, (b) an inner charge-preventing layer formed inside of said barrier layer, and (c) an outer charge-preventing layer formed outside of said barrier layer; a humidity indicator for detecting the humidity inside said moisture-proofing bag member; and a desiccant for absorbing moisture from within the moisture-proofing bag member when the resin molded semiconductor device is sealed within the moisture-proofing bag member; wherein said surface-mount resin molded semiconductor device, said desiccant and said humidity indicator are sealed in said moisture-proofing bag member.
Claim 23
Dependent Claim
263 words
A packaged device, comprising: at least one surface-mount resin molded semiconductor device, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to performing surface mounting; a moisture-proofing bag member, which is made of multi-layered film, including (a) a barrier layer sufficiently preventing intrusion of moisture therein when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the semiconductor device during surface mounting, due to moisture having entered the semiconductor device during said time period, (b) an inner charge-preventing layer formed inside of said barrier layer, and (c) an outer charge-preventing layer formed outside of said barrier layer; a humidity indicator for detecting the humidity inside said moisture-proofing bag member; and a desiccant for absorbing moisture from within the moisture-proofing bag member when the resin molded semiconductor device is sealed within the moisture-proofing bag member; wherein said surface-mount resin molded semiconductor device, said desiccant and said humidity indicator are sealed in said moisture-proofing bag member.
Claim 24
Dependent Claim
22 words
A packaged device according to claim 21, wherein said humidity indicator contains a material which changes color upon a change in humidity.
Claim 25
Dependent Claim
32 words
A packaged device according to claim 22, wherein said humidity indicator indicates the humidity inside said moisture-proofing bag member by means of said material which changes color upon a change in humidity.
Claim 26
Dependent Claim
50 words
A packaged device according to claim 21, further comprising: at least one magazine having said surface-mount resin molded semiconductor device stored therein, said at least one magazine being in said moisture-proofing bag member, and said humidity indicator being in between said at least one magazine and said moisture-proofing bag member.
Claim 27
Dependent Claim
34 words
A packaged device according to claim 24, further comprising: an interior box having a plurality of said magazines stored therein, said humidity indicator being located between said interior box and said moisture-proofing bag member.
Claim 28
Dependent Claim
49 words
A packaged device according to claim 21, further comprising: at least one tray having said surface-mount resin molded semiconductor device stored therein, said at least one tray being in said moisture-proofing bag member, and said humidity indicator being between said at least one tray and said moisture-proofing bag member.
Claim 29
Dependent Claim
35 words
A packaged device according to claim 26, further comprising: an interior box having a plurality of the trays stored therein, and wherein said humidity indicator is between said interior box and said moisture-proofing bag member.
Claim 30
Dependent Claim
53 words
A packaged device according to claim 21, further comprising: a conveying auxiliary member, which is made of electrically conductive material, having said surface-mount resin molded semiconductor device stored therein and being in said moisture-proofing bag member, and wherein said humidity indicator is located between said conveying auxiliary member and said moisture-proofing bag member.
Claim 31
Dependent Claim
15 words
A packaged device according to claim 28, wherein said conveying auxiliary member is a magazine.
Claim 32
Dependent Claim
15 words
A packaged device according to claim 28, wherein said conveying auxiliary member is a tray.
Claim 33
Dependent Claim
19 words
A packaged device according to claim 28, further comprising: an exterior box having said moisture-proofing bag member stored therein.
Claim 34
Dependent Claim
32 words
A packaged device according to claim 31, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 35
Dependent Claim
19 words
A packaged device according to claim 21, further comprising: an exterior box having said moisture-proofing bag member stored therein.
Claim 36
Dependent Claim
32 words
A packaged device according to claim 33, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 37
Dependent Claim
17 words
A packaged device according to claim 21, further comprising: a desiccant stored in said moisture-proofing bag member.
Claim 38
Dependent Claim
27 words
A packaged device according to claim 1, further comprising: a film layer for reinforcing mechanical strength disposed between said inner charge-preventing layer and said outer charge-preventing layer.
Claim 39
Dependent Claim
21 words
A packaged device according to claim 36, wherein said film layer for reinforcing mechanical strength is made of a polyester film.
Claim 40
Dependent Claim
259 words
A packaged device comprising: a moisture-proofing bag member formed of a multi-layered film; and at least one surface-mount resin molded semiconductor device and a desiccant sealed air-tightly in said moisture-proofing bag member, such that the desiccant absorbs moisture within the moisture-proofing bag member when the resin molded semiconductor device is sealed in the bag member, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to performing surface mounting; wherein said multi-layered film includes (a) a barrier layer for sufficiently preventing intrusion of moisture into the moisture-proofing bag member when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the at least one surface-mount molded semiconductor device during surface mounting, due to moisture having entered the at least one surface-mount resin molded semiconductor device during said time period, (b) an inner charge-preventing layer formed inside of said barrier layer and (c) an outer charge-preventing layer formed outside of said barrier layer.
Claim 41
Dependent Claim
259 words
A packaged device comprising: a moisture-proofing bag member formed of a multi-layered film; and at least one surface-mount resin molded semiconductor device and a desiccant sealed air-tightly in said moisture-proofing bag member, such that the desiccant absorbs moisture within the moisture-proofing bag member when the resin molded semiconductor device is sealed in the bag member, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to performing surface mounting; wherein said multi-layered film includes (a) a barrier layer for sufficiently preventing intrusion of moisture into the moisture-proofing bag member when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the at least one surface-mount molded semiconductor device during surface mounting, due to moisture having entered the at least one surface-mount resin molded semiconductor device during said time period, (b) an inner charge-preventing layer formed inside of said barrier layer and (c) an outer charge-preventing layer formed outside of said barrier layer.
Claim 42
Dependent Claim
16 words
A packaged device according to claim 38, wherein said barrier layer is made of vinylidene chloride.
Claim 43
Dependent Claim
29 words
A packaged device according to claim 38, wherein said inner charge-preventing layer is an innermost layer of said moisture-proofing bag member, and said innermost layer is made of polyethylene.
Claim 44
Dependent Claim
16 words
A packaged device according to claim 40, wherein said polyethylene contains an antistatic agent kneaded therein.
Claim 45
Dependent Claim
18 words
A packaged device according to claim 40, wherein said moisture-proofing bag member is sealed by heat-sealing said polyethylene.
Claim 46
Dependent Claim
18 words
A packaged device according to claim 40, wherein said moisture-proofing bag member is sealed by press-sealing said polyethylene.
Claim 47
Dependent Claim
20 words
A packaged device according to claim 43, wherein said moisture-proofing bag member is press-sealed while applying heat to said polyethylene.
Claim 48
Dependent Claim
21 words
A packaged device according to claim 43, wherein said moisture-proofing bag member is press-sealed while applying ultrasonic waves to said polyethylene.
Claim 49
Dependent Claim
32 words
A packaged device according to claim 38, further comprising: at least one magazine storing said surface-mount resin molded semiconductor device therein, said at least one magazine being in said moisture-proofing bag member.
Claim 50
Dependent Claim
29 words
A packaged device according to claim 46, further comprising: an interior box storing a plurality of said magazines therein, said interior box being located in said moisture-proofing bag member.
Claim 51
Dependent Claim
32 words
A packaged device according to claim 38, further comprising: at least one tray storing said surface-mount resin molded semiconductor device therein, said at least one tray being in said moisture-proofing bag member.
Claim 52
Dependent Claim
28 words
A packaged device according to claim 48, further comprising: an interior box storing a plurality of said trays therein, said interior box being in said moisture-proofing bag member.
Claim 53
Dependent Claim
18 words
A packaged device according to claim 38, further comprising: an exterior box storing said moisture-proofing bag member therein.
Claim 54
Dependent Claim
32 words
A packaged device according to claim 50, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 55
Dependent Claim
36 words
A packaged device according to claim 38, further comprising: a conveying auxiliary member, which is made of electrically conductive material, having said surface-mount resin molded semiconductor device stored therein, and being in said moisture-proofing bag member.
Claim 56
Dependent Claim
15 words
A packaged device according to claim 52, wherein said conveying auxiliary member is a magazine.
Claim 57
Dependent Claim
15 words
A packaged device according to claim 52, wherein said conveying auxiliary member is a tray.
Claim 58
Dependent Claim
18 words
A packaged device according to claim 52, further comprising: an exterior box storing said moisture-proofing bag member therein.
Claim 59
Dependent Claim
32 words
A packaged device according to claim 55, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 60
Dependent Claim
27 words
A packaged device according to claim 38, further comprising: a film layer for reinforcing mechanical strength disposed between said inner charge-preventing layer and said outer charge-preventing layer.
Claim 61
Dependent Claim
21 words
A packaged device according to claim 57, wherein said film layer for reinforcing mechanical strength is made of a polyester film.
Claim 62
Dependent Claim
279 words
A packaged device, comprising: a moisture-proofing bag member which is made of a laminate; and at least one surface-mount resin molded semiconductor device and a desiccant sealed in said moisture-proofing bag member, such that the desiccant absorbs moisture within the moisture-proofing bag member when the resin molded semiconductor device is sealed in the bag member, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to surface mounting; wherein said laminate is made of (a) a barrier layer for sufficiently preventing intrusion of moisture into the moisture-proofing bag member when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the at least one surface-mount resin molded semiconductor device during surface mounting, due to moisture having entered the at least one surface-mount resin molded semiconductor device during said time period, (b) an inner charge-preventing layer formed inside of said barrier layer, (c) an outer charge-preventing layer formed outside of said barrier layer, and (d) a film layer, for reinforcing mechanical strength, disposed between said inner charge-preventing layer and said outer charge-preventing layer.
Claim 63
Dependent Claim
279 words
A packaged device, comprising: a moisture-proofing bag member which is made of a laminate; and at least one surface-mount resin molded semiconductor device and a desiccant sealed in said moisture-proofing bag member, such that the desiccant absorbs moisture within the moisture-proofing bag member when the resin molded semiconductor device is sealed in the bag member, said at least one surface-mount resin molded semiconductor device being at least one semiconductor device having structure such that the at least one semiconductor device will be surface-mounted on a printed circuit board and not yet having been surface-mounted on the printed circuit board, whereby during surface mounting heat will be applied from a side of the printed circuit board having the surface-mount resin molded semiconductor device thereon, said at least one surface-mount resin molded semiconductor device including a resin molding through which moisture in air can enter the at least one resin molded semiconductor device during a time period from forming the resin molding to surface mounting; wherein said laminate is made of (a) a barrier layer for sufficiently preventing intrusion of moisture into the moisture-proofing bag member when the at least one surface-mount resin molded semiconductor device is sealed therein, during said time period, so as to avoid damage of the at least one surface-mount resin molded semiconductor device during surface mounting, due to moisture having entered the at least one surface-mount resin molded semiconductor device during said time period, (b) an inner charge-preventing layer formed inside of said barrier layer, (c) an outer charge-preventing layer formed outside of said barrier layer, and (d) a film layer, for reinforcing mechanical strength, disposed between said inner charge-preventing layer and said outer charge-preventing layer.
Claim 64
Dependent Claim
16 words
A packaged device according to claim 59, wherein said barrier layer is made of vinylidene chloride.
Claim 65
Dependent Claim
29 words
A packaged device according to claim 59, wherein said inner charge-preventing layer is an innermost layer of said moisture-proofing bag member, and said innermost layer is made of polyethylene.
Claim 66
Dependent Claim
16 words
A packaged device according to claim 61, wherein said polyethylene contains an antistatic agent kneaded therein.
Claim 67
Dependent Claim
18 words
A packaged device according to claim 61, wherein said moisture-proofing bag member is sealed by heat-sealing said polyethylene.
Claim 68
Dependent Claim
18 words
A packaged device according to claim 61, wherein said moisture-proofing bag member is sealed by press-sealing said polyethylene.
Claim 69
Dependent Claim
20 words
A packaged device according to claim 64, wherein said moisture-proofing bag member is press-sealed while applying heat to said polyethylene.
Claim 70
Dependent Claim
21 words
A packaged device according to claim 64, wherein said moisture-proofing bag member is press-sealed while applying ultrasonic waves to said polyethylene.
Claim 71
Dependent Claim
32 words
A packaged device according to claim 59, further comprising: at least one magazine storing said surface-mount resin molded semiconductor device therein, said at least one magazine being in said moisture-proofing bag member.
Claim 72
Dependent Claim
29 words
A packaged device according to claim 67, further comprising: an interior box storing a plurality of said magazines therein, said interior box being located in said moisture-proofing bag member.
Claim 73
Dependent Claim
32 words
A packaged device according to claim 59, further comprising: at least one tray storing said surface-mount resin molded semiconductor device therein, said at least one tray being in said moisture-proofing bag member.
Claim 74
Dependent Claim
28 words
A packaged device according to claim 69, further comprising: an interior box storing a plurality of said trays therein, said interior box being in said moisture-proofing bag member.
Claim 75
Dependent Claim
18 words
A packaged device according to claim 59, further comprising: an exterior box storing said moisture-proofing bag member therein.
Claim 76
Dependent Claim
32 words
A packaged device according to claim 71, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 77
Dependent Claim
36 words
A packaged device according to claim 59, further comprising: a conveying auxiliary member, which is made of electrically conductive material, having said surface-mount resin molded semiconductor device stored therein, and being in said moisture-proofing bag member.
Claim 78
Dependent Claim
15 words
A packaged device according to claim 73, wherein said conveying auxiliary member is a magazine.
Claim 79
Dependent Claim
15 words
A packaged device according to claim 73, wherein said conveying auxiliary member is a tray.
Claim 80
Dependent Claim
18 words
A packaged device according to claim 73, further comprising: an exterior box storing said moisture-proofing bag member therein.
Claim 81
Dependent Claim
32 words
A packaged device according to claim 76, wherein said surface-mount resin molded semiconductor device is directly sealed in said moisture-proofing bag member without using an interior box within the moisture-proofing bag member.
Claim 82
Dependent Claim
15 words
A packaged device according to claim 59, wherein said moisture-proofing bag member is air-tightly sealed.
Claim 83
Dependent Claim
21 words
A packaged device according to claim 59, wherein said film layer, for reinforcing mechanical strength, is made of a polyester film.
Claim 84
Dependent Claim
45 words
A packaged device according to claim 1, wherein said resin molding is made of a resin that absorbs moisture such that moisture in air around the at least one surface-mount resin molded semiconductor device would enter the at least one surface-mount resin molded semiconductor device.
Claim 85
Dependent Claim
45 words
A packaged device according to claim 21, wherein said resin molding is made of a resin that absorbs moisture such that moisture in air around the at least one surface-mount resin molded semiconductor device would enter the at least one surface-mount resin molded semiconductor device.
Claim 86
Dependent Claim
45 words
A packaged device according to claim 38, wherein said resin molding is made of a resin that absorbs moisture such that moisture in air around the at least one surface-mount resin molded semiconductor device would enter the at least one surface-mount resin molded semiconductor device.
Claim 87
Dependent Claim
45 words
A packaged device according to claim 59, wherein said resin molding is made of a resin that absorbs moisture such that moisture in air around the at least one surface-mount resin molded semiconductor device would enter the at least one surface-mount resin molded semiconductor device.
Claim 88
Dependent Claim
28 words
A packaged device according to claim 1, wherein said at least one surface-mount resin molded semiconductor device and said desiccant are temporarily sealed in said moisture-proofing bag member.
Claim 89
Dependent Claim
28 words
A packaged device according to claim 21, wherein said surface-mount resin molded semiconductor device, said desiccant and said humidity indicator are temporarily sealed in said moisture-proofing bag member.
Claim 90
Dependent Claim
28 words
A packaged device according to claim 38, wherein said at least one surface-mount resin molded semiconductor device and said desiccant are temporarily sealed in said moisture-proofing bag member.
Claim 91
Dependent Claim
28 words
A packaged device according to claim 59, wherein said at least one surface-mount resin molded semiconductor device and said desiccant are temporarily sealed in said moisture-proofing bag member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-03 | 2000-09-02 | 2001-03-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-03 | 2004-09-02 | 2005-03-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-03 | 2008-09-02 | 2009-03-04 | $7700.00 | Window Closed / Lapsed |