US5606198A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip with electrodes on side surface
Assignee: Yamaha Corp
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Filing: 1994-10-12
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Granted: 1997-02-25
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Expires: 2014-10-12
Abstract
Abstract A semiconductor device comprising a semiconductor chip substrate, an integrated circuit formed on a surface of the semiconductor chip substrate, and metal electrodes extending from the integrated circuit to at least one of the side surfaces of the semiconductor chip substrate. Occupation area on a wiring circuit board can be reduced. Damaged chips can be exchanged easily. When it is set vertically, heat radiation efficiency can be improved.
Inventors
- 👤 Yukichi Ono
- 👤 Katsuhiko Ishida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:35
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/019; H10W20/00; H10W20/40; H10W20/41; H10W20/425; H10W72/90; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/071; H10W72/20; H10W72/29; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/921; H10W72/922; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
119 words
An electrode circuit device comprising: a semiconductor chip comprising: a semiconductor substrate having a main surface and side surfaces; an integrated circuit formed on the main surface of said semiconductor substrate; and metal electrodes formed on the substrate and extending from said integrated circuit to corresponding recesses formed in at least one of the side surfaces of said semiconductor substrate; and a wiring circuit board having a cavity accommodating said semiconductor chip on the surface thereof and wirings extending into the cavity and contacting said electrodes, said cavity having a rectangular shape and said wirings including electrode leads on at least one side surface of the cavity, said metal electrodes being contacted to said electrode leads by spring force.
Claim 2
Dependent Claim
119 words
An electrode circuit device comprising: a semiconductor chip comprising: a semiconductor substrate having a main surface and side surfaces; an integrated circuit formed on the main surface of said semiconductor substrate; and metal electrodes formed on the substrate and extending from said integrated circuit to corresponding recesses formed in at least one of the side surfaces of said semiconductor substrate; and a wiring circuit board having a cavity accommodating said semiconductor chip on the surface thereof and wirings extending into the cavity and contacting said electrodes, said cavity having a rectangular shape and said wirings including electrode leads on at least one side surface of the cavity, said metal electrodes being contacted to said electrode leads by spring force.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-25 | 2000-08-26 | 2001-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-25 | 2004-08-26 | 2005-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-25 | 2008-08-26 | 2009-02-25 | $7700.00 | Window Closed / Lapsed |