Patent US5604363A successfully refreshed from Google Patents.
US5604363A
Expired / Lapsed
US
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Semiconductor pressure sensor with package
Assignee: Mitsubishi Electric Corp
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Filing: 1995-09-05
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Granted: 1997-02-18
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Expires: 2015-09-05
Abstract
Abstract A less expensive small semiconductor pressure sensor in which a pressure sensing element is not displaced by vibration and the like and wire bonding is highly reliably effected includes a pressure sensing element having a diaphragm and a glass base die bonded to a die pad in substantially the same plane as that of an outer lead with a bonding resin. Each of two sets of hanging leads is attached to one of two opposite sides of the die pad to fix the die pad to a package base. With this arrangement, the die pad is securely bonded to the package base to prevent breakage of a metal wire caused by vibration and the like so that a less expensive and smaller semiconductor pressure sensor can be provided.
Inventors
- 👤 Motomi Ichihashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:27
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/14; G01L19/147; H; H10; H10W; H10W72/00; H10W72/30; H10W72/321; H10W72/351; H10W72/353; H10W72/354; H10W72/381; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10S; Y10S73/00; Y10S73/01; Y10S73/04
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
140 words
A semiconductor pressure sensor comprising: a pressure sensing element including a glass base and a pressure sensor chip having a diaphragm anodically bonded to said glass base; a package accommodating said pressure sensing element and including a package cover and a package base supporting said pressure sensing element; an outer lead held between said package base and said package cover; a first bonding resin bonding said package base, said package cover, and said outer lead together; a die pad on which said pressure sensing element is mounted, fixed to said package base, and coplanar with said outer lead; a second bonding resin bonding said pressure sensing element, said die pad, and said package base together; a metal wire electrically connecting said pressure sensing element to said outer lead; and a thick film substrate to which said outer lead is mounted.
Claim 2
Dependent Claim
140 words
A semiconductor pressure sensor comprising: a pressure sensing element including a glass base and a pressure sensor chip having a diaphragm anodically bonded to said glass base; a package accommodating said pressure sensing element and including a package cover and a package base supporting said pressure sensing element; an outer lead held between said package base and said package cover; a first bonding resin bonding said package base, said package cover, and said outer lead together; a die pad on which said pressure sensing element is mounted, fixed to said package base, and coplanar with said outer lead; a second bonding resin bonding said pressure sensing element, said die pad, and said package base together; a metal wire electrically connecting said pressure sensing element to said outer lead; and a thick film substrate to which said outer lead is mounted.
Claim 3
Dependent Claim
28 words
The semiconductor pressure sensor according to claim 1 including hanging leads fixing said die pad to said package base and attached to opposite sides of said die pad.
Claim 4
Dependent Claim
21 words
The semiconductor pressure sensor according to claim 1 wherein said glass base has a thickness of no more than 1 mm.
Claim 5
Dependent Claim
28 words
The semiconductor pressure sensor according to claim 1 wherein said second bonding resin between said pressure sensing element and sad die pad is relatively thick to absorb vibrations.
Claim 6
Dependent Claim
92 words
A semiconductor pressure sensor comprising: a pressure sensing element including a glass base and a pressure sensor chip having a diaphragm anodically bonded to said glass base; a thick film substrate supporting said pressure sensing element; a package cover disposed on said thick film substrate covering said pressure sensing element; a first bonding resin bonding said package cover to said thick film substrate; a second bonding resin bonding said pressure sensing element to said thick film substrate; and a metal wire electrically connecting said pressure sensing element to said thick film substrate.
Claim 7
Dependent Claim
92 words
A semiconductor pressure sensor comprising: a pressure sensing element including a glass base and a pressure sensor chip having a diaphragm anodically bonded to said glass base; a thick film substrate supporting said pressure sensing element; a package cover disposed on said thick film substrate covering said pressure sensing element; a first bonding resin bonding said package cover to said thick film substrate; a second bonding resin bonding said pressure sensing element to said thick film substrate; and a metal wire electrically connecting said pressure sensing element to said thick film substrate.
Claim 8
Dependent Claim
21 words
The semiconductor pressure sensor according to claim 5 wherein said glass base has a thickness of no more than 1 mm.
Claim 9
Dependent Claim
24 words
A semiconductor pressure sensor according to claim 5 wherein said pressure sensor chip includes a pressure detecting circuit and at least two amplifier circuits.
Claim 10
Dependent Claim
21 words
The semiconductor pressure sensor according to claim 2 wherein said glass base has a thickness of no more than 1 mm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-18 | 2000-08-19 | 2001-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-18 | 2004-08-19 | 2005-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-18 | 2008-08-19 | 2009-02-18 | $7700.00 | Window Closed / Lapsed |