Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate

Claim 2

An integrated circuit chip bonding system for electrically isolating and grounding a base of an integrated circuit chip to a printed circuit substrate having electrical interconnection circuit routing vias disposed beneath the integrated circuit chip, said bonding system comprising: a multi-layer film adhesive comprising: an electrically conductive upper film layer having dimension that are larger than the integrated circuit chip and that electrically contacts the base of the integrated circuit chip; and a dielectric insulating lower film layer having dimensions that are larger that the upper film layer that overlies electrical interconnection circuit routing vias disposed beneath the integrated circuit chip; conductive adhesive disposed on a portion of exterior surfaces and edges of the electrically conductive upper film layer and the dielectric insulating lower film layer that interconnects the electrically conductive upper film layer and a ground pad disposed on the substrate.

Claim 3

The bonding system of claim 1 wherein the electrically conductive upper film layer comprises an organic resin containing a thermally and electrically conductive metal filler.

Claim 4

The bonding system of claim 2 wherein the organic resin comprises epoxy.

Claim 5

The bonding system of claim 3 wherein the thermally and electrically conductive metal filler comprises silver powder.

Claim 6

The bonding system of claim 1 wherein the dielectric insulating lower film layer comprises an organic resin containing a thermally conductive dielectric filler.

Claim 7

The bonding system of claim 5 wherein the organic resin comprises epoxy.

Claim 8

The bonding system of claim 6 wherein the thermally conductive filler comprises aluminun oxide.

Claim 9

The bonding system of claim 6 wherein the thermally conductive filler comprises aluminun nitride.

Claim 10

The bonding system of claim 1 wherein the electrically conductive adhesive comprises an organic resin containing a thermally and electrically conductive metal filler.

Claim 11

The bonding system of claim 9 wherein the organic resin comprises epoxy.

Claim 12

The bonding system of claim 10 wherein the thermally and electrically conductive metal filler comprises silver powder.

Claim 13

An integrated circuit chip bonding system comprising: a printed circuit substrate having electrical interconnection circuit routing vias and a ground pad disposed thereon; an integrated circuit chip disposed on the substrate such that the electrical interconnection circuit routing vias are disposed beneath the integrated circuit chip; a multi-layer film adhesive comprising an electrically conductive upper film layer having dimensions that are larger than the integrated circuit chip disposed adjacent to and in electrical contact with the metallized base of an integrated circuit chip, and a dielectric insulating lower film layer having dimensions that are larger than the upper film layer disposed between the integrated circuit chip and the substrate; and conductive adhesive disposed on a portion of exterior surfaces and edges of the electrically conductive upper film layer and the dielectric insulating lower film layer that electrically interconnects the electrically conductive upper film layer and the ground pad disposed on the substrate.

Claim 14

An integrated circuit chip bonding system comprising: a printed circuit substrate having electrical interconnection circuit routing vias and a ground pad disposed thereon; an integrated circuit chip disposed on the substrate such that the electrical interconnection circuit routing vias are disposed beneath the integrated circuit chip; a multi-layer film adhesive comprising an electrically conductive upper film layer having dimensions that are larger than the integrated circuit chip disposed adjacent to and in electrical contact with the metallized base of an integrated circuit chip, and a dielectric insulating lower film layer having dimensions that are larger than the upper film layer disposed between the integrated circuit chip and the substrate; and conductive adhesive disposed on a portion of exterior surfaces and edges of the electrically conductive upper film layer and the dielectric insulating lower film layer that electrically interconnects the electrically conductive upper film layer and the ground pad disposed on the substrate.

Claim 15

The bonding system of claim 12 wherein the electrically conductive upper film layer comprises an organic resin containing a thermally and electrically conductive metal filler.

Claim 16

The bonding system of claim 13 wherein the organic resin comprises epoxy and the thermally and electrically conductive metal filler comprises silver powder.

Claim 17

The bonding system of claim 12 wherein the dielectric insulating lower film layer comprises an organic resin containing a thermally conductive dielectric filler.

Claim 18

The bonding system of claim 15 wherein the organic resin comprises epoxy and the thermally conductive metal filler comprises aluminum oxide.

Claim 19

The bonding system of claim 15 wherein the organic resin comprises epoxy and the thermally conductive metal filler comprises aluminum nitride.

Claim 20

The bonding system of claim 13 wherein the conductive adhesive comprises an organic resin containing a thermally and electrically conductive metal filler.

Claim 21

The bonding system of claim 18 wherein the organic resin comprises epoxy and the thermally and electrically conductive metal filler comprises silver power.