Patent US5600181A successfully refreshed from Google Patents.
US5600181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetically sealed high density multi-chip package
Assignee: Lockheed Martin Corp
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Filing: 1995-05-24
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Granted: 1997-02-04
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Expires: 2015-05-24
Abstract
Abstract An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.
Inventors
- 👤 Patrick M. Scott
- 👤 Andrew Z. Glovatsky
- 👤 Michael A. Mele
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:52
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W90/00; H10W72/00; H10W72/01; H10W72/0198; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
90 words
A hermetically sealed printed wiring board assembly, comprising in combination: a printed wiring board; a plurality of circuit dies mechanically bonded to said printed wiring board; a hermetically sealed input/output connector connected to said printed wiring board; an encapsulating layer completely encapsulating said printed circuit board, said plurality of circuit dies, and an inboard portion of said connector; a metal layer covering said non-metallic encapsulating layer to provide a hermetic seal that completely encloses said printed wiring board, said plurality of circuit dies, and said inboard portion of said connector.
Claim 2
Dependent Claim
90 words
A hermetically sealed printed wiring board assembly, comprising in combination: a printed wiring board; a plurality of circuit dies mechanically bonded to said printed wiring board; a hermetically sealed input/output connector connected to said printed wiring board; an encapsulating layer completely encapsulating said printed circuit board, said plurality of circuit dies, and an inboard portion of said connector; a metal layer covering said non-metallic encapsulating layer to provide a hermetic seal that completely encloses said printed wiring board, said plurality of circuit dies, and said inboard portion of said connector.
Claim 3
Dependent Claim
19 words
A hermetically sealed printed wiring board assembly as in claim 1 wherein said encapsulating layer includes a soluble polymer.
Claim 4
Dependent Claim
20 words
A hermetically sealed printed wiring board assembly as in claim 1 wherein said encapsulating layer provides a smooth, crevice-free surface.
Claim 5
Dependent Claim
19 words
A hermetically sealed printed wiring board assembly as in claim 3 wherein said encapsulating layer includes a soluble polymer.
Claim 6
Dependent Claim
55 words
A hermetically sealed printed wiring board assembly as in claim 1 wherein said metal layer is comprised of a first metal layer deposited by a vacuum deposition process onto the surface of said encapsulating layer and a second metal layer deposited onto the surface of said first metal layer by an electro- or electroless-deposition process.
Claim 7
Dependent Claim
163 words
A hermetically sealed printed wiring board assembly, comprising in combination: a printed wiring board; a plurality of circuit dies mechanically bonded to said printed wiring board; a hermetically sealed input/output connector connected to said printed wiring board; an encapsulating layer completely encapsulating said printed circuit board, said plurality of circuit dies, and an inboard portion of said connector; a metal layer covering said non-metallic encapsulating layer to provide a hermetic seal that completely encloses said printed wiring board, said plurality of circuit dies, and said inboard portion of said connector; said hermetically sealed input/output connector being comprised of a ceramic body bonded to said printed wiring board with connection pads to said printed wiring board along an inboard edge of said ceramic body, connection pads along an outboard edge of said ceramic body, and a metal strip on an upper and a lower surface of said ceramic body intermediate said inboard edge and said outboard edge to which said metal layer is bonded.
Claim 8
Dependent Claim
163 words
A hermetically sealed printed wiring board assembly, comprising in combination: a printed wiring board; a plurality of circuit dies mechanically bonded to said printed wiring board; a hermetically sealed input/output connector connected to said printed wiring board; an encapsulating layer completely encapsulating said printed circuit board, said plurality of circuit dies, and an inboard portion of said connector; a metal layer covering said non-metallic encapsulating layer to provide a hermetic seal that completely encloses said printed wiring board, said plurality of circuit dies, and said inboard portion of said connector; said hermetically sealed input/output connector being comprised of a ceramic body bonded to said printed wiring board with connection pads to said printed wiring board along an inboard edge of said ceramic body, connection pads along an outboard edge of said ceramic body, and a metal strip on an upper and a lower surface of said ceramic body intermediate said inboard edge and said outboard edge to which said metal layer is bonded.
Claim 9
Dependent Claim
207 words
A hermetically sealed printed wiring board assembly, comprising in combination: a printed wiring board; a plurality of circuit dies mechanically bonded to said printed wiring board; a hermetically sealed input/output connector connected to said printed wiring board; an encapsulating layer completely encapsulating said printed circuit board, said plurality of circuit dies, and an inboard portion of said connector; a metal layer covering said non-metallic encapsulating layer to provide a hermetic seal that completely encloses said printed wiring board, said plurality of circuit dies, and said inboard portion of said connector, said metal layer being comprised of a first metal layer deposited by a vacuum deposition process onto the surface of said encapsulating layer and a second metal layer deposited onto the surface of said first metal layer by an electro- or electroless-deposition process; and said hermetically sealed input/output connector being comprised of a ceramic body bonded to said printed wiring board with connection pads to said printed wiring board along an inboard edge of said ceramic body, connection pads along an outboard edge of said ceramic body, and a metal strip on an upper and a lower surface of said ceramic body intermediate said inboard edge and said outboard edge to which said metal layer is bonded.
Claim 10
Dependent Claim
207 words
A hermetically sealed printed wiring board assembly, comprising in combination: a printed wiring board; a plurality of circuit dies mechanically bonded to said printed wiring board; a hermetically sealed input/output connector connected to said printed wiring board; an encapsulating layer completely encapsulating said printed circuit board, said plurality of circuit dies, and an inboard portion of said connector; a metal layer covering said non-metallic encapsulating layer to provide a hermetic seal that completely encloses said printed wiring board, said plurality of circuit dies, and said inboard portion of said connector, said metal layer being comprised of a first metal layer deposited by a vacuum deposition process onto the surface of said encapsulating layer and a second metal layer deposited onto the surface of said first metal layer by an electro- or electroless-deposition process; and said hermetically sealed input/output connector being comprised of a ceramic body bonded to said printed wiring board with connection pads to said printed wiring board along an inboard edge of said ceramic body, connection pads along an outboard edge of said ceramic body, and a metal strip on an upper and a lower surface of said ceramic body intermediate said inboard edge and said outboard edge to which said metal layer is bonded.
Claim 11
Dependent Claim
44 words
A hermetically sealed printed wiring board assembly as in claim 1 wherein said hermetically sealed input/output connector is comprised of a metallic body bonded to said printed wiring board and glass bonds securing a plurality of conductors in said metallic body and insulated therefrom.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-04 | 2000-08-05 | 2001-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-04 | 2004-08-05 | 2005-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-04 | 2008-08-05 | 2009-02-04 | $7700.00 | Window Closed / Lapsed |