US5597767A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Separation of wafer into die with wafer-level processing
Assignee: Texas Instruments Inc
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Filing: 1995-01-06
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Granted: 1997-01-28
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Expires: 2015-01-06
Abstract
Abstract A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).
Inventors
- 👤 Michael A. Mignardi
- 👤 Laurinda Ng
- 👤 Ronald S. Croff
- 👤 Robert McKenna
- 👤 Lawrence D. Dyer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:35
CPC Classifications
B; B81; B81C; B81C1/00; B81C1/00865; B81C1/00873; H; H10; H10P; H10P54/00; B81C2201/00; B81C2201/05; B81C2201/053; Y; Y10; Y10S; Y10S148/00; Y10S148/012; Y10S148/028
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
59 words
A method of separating a wafer into die, comprising the steps of: covering the top surface of said wafer with a protective coating; inscribing separation lines on said wafer, said separation lines representing boundaries between die; removing said protective coating; processing said wafer with at least one wafer-level process; and separating said wafer into die along said separation lines.
Claim 2
Independent Claim
59 words
A method of separating a wafer into die, comprising the steps of: covering the top surface of said wafer with a protective coating; inscribing separation lines on said wafer, said separation lines representing boundaries between die; removing said protective coating; processing said wafer with at least one wafer-level process; and separating said wafer into die along said separation lines.
Claim 3
Dependent Claim
15 words
The method of claim 1, wherein said covering step is performed with a deposited layer.
Claim 4
Dependent Claim
15 words
The method of claim 1, wherein said covering step is performed with a spun-on layer.
Claim 5
Dependent Claim
15 words
The method of claim 1, wherein said inscribing step is performed with a mechanical scribe.
Claim 6
Dependent Claim
15 words
The method of claim 1, wherein said inscribing step is performed with a laser scribe.
Claim 7
Dependent Claim
14 words
The method of claim 1, wherein said inscribing step is performed with a saw.
Claim 8
Dependent Claim
29 words
The method of claim 1, wherein said removing step is performed while said wafer is mounted on a saw frame used to hold said wafer during said inscribing step.
Claim 9
Dependent Claim
30 words
The method of claim 1, wherein said removing step is performed after said wafer has been demounted from a saw frame used to hold said wafer during said inscribing step.
Claim 10
Dependent Claim
25 words
The method of claim 1, wherein said die are those of micro-mechanical devices and wherein said processing step is performed by removing a sacrificial layer.
Claim 11
Dependent Claim
24 words
The method of claim 1, wherein said die are those of micro-mechanical devices and wherein said processing step is performed by passivating contacting surfaces.
Claim 12
Dependent Claim
15 words
The method of claim 1, wherein said processing step is performed by wafer level testing.
Claim 13
Dependent Claim
20 words
The method of claim 1, wherein said separating step is performed by breaking said wafers apart along said separation lines.
Claim 14
Dependent Claim
18 words
The method of claim 12, wherein said breaking is performed by placing said wafer on a curved surface.
Claim 15
Independent Claim
77 words
A method of separating a wafer, used for manufacturing micromechanical devices, into die, comprising the steps of: covering the top surface of said wafer with a protective coating, said die having at least one sacrificial layer under micro-mechanical elements of said die; inscribing separation lines on said wafer, said separation lines representing boundaries between die; removing said protective coating; removing said sacrificial layer using a wafer-level process; and separating said wafer into die along said separation lines.
Claim 16
Independent Claim
77 words
A method of separating a wafer, used for manufacturing micromechanical devices, into die, comprising the steps of: covering the top surface of said wafer with a protective coating, said die having at least one sacrificial layer under micro-mechanical elements of said die; inscribing separation lines on said wafer, said separation lines representing boundaries between die; removing said protective coating; removing said sacrificial layer using a wafer-level process; and separating said wafer into die along said separation lines.
Claim 17
Dependent Claim
15 words
The method of claim 14, wherein said inscribing step is performed with a mechanical scribe.
Claim 18
Dependent Claim
15 words
The method of claim 14, wherein said inscribing step is performed with a laser scribe.
Claim 19
Dependent Claim
14 words
The method of claim 1, wherein said inscribing step is performed with a saw.
Claim 20
Dependent Claim
15 words
The method of claim 1, wherein said processing step is performed by passivating contacting surfaces.
Claim 21
Dependent Claim
15 words
The method of claim 1, wherein said processing step is performed by wafer level testing.
Claim 22
Independent Claim
90 words
A method of separating a wafer, used for manufacturing digital micro-mirror devices, into die, comprising the steps of: covering the top surface of said wafer with a protective coating, said die having at least one sacrificial layer under mirror elements of said die; inscribing separation lines on said wafer, said separation lines representing boundaries between die; removing said protective coating; removing said sacrificial layer using a wafer-level process; testing said die by stepping from die-to-die as registered on said wafer; and separating said wafer into die along said separation lines.
Claim 23
Independent Claim
90 words
A method of separating a wafer, used for manufacturing digital micro-mirror devices, into die, comprising the steps of: covering the top surface of said wafer with a protective coating, said die having at least one sacrificial layer under mirror elements of said die; inscribing separation lines on said wafer, said separation lines representing boundaries between die; removing said protective coating; removing said sacrificial layer using a wafer-level process; testing said die by stepping from die-to-die as registered on said wafer; and separating said wafer into die along said separation lines.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-01-28 | 2000-07-29 | 2001-01-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-01-28 | 2004-07-29 | 2005-01-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-01-28 | 2008-07-29 | 2009-01-28 | $7700.00 | Window Closed / Lapsed |