US5435876A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Grid array masking tape process
Assignee: Texas Instruments Inc
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Filing: 1993-03-29
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Granted: 1995-07-25
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Expires: 2013-03-29
Abstract
Abstract Active sites (18) on a semiconductor wafer (14) are protected from particulate and fluid contaminants (40,42)while the wafer (14) is sawed into chips (16) by a tape (62) carrying a pattern of adhesive (64) which is congruent and registerable with saw paths (15) between the active sites (18). Adhering the tape (62) to the wafer (14) encapsulates each active site (18) beneath a non-adherent protective envelope which if formed by adhesive-free portions (68) of the tape (62) as sawing occurs along the saw paths (15) and the congruent adhesive pattern (64). After sawing, the adhesive (64) is treated, as by directing UV through the tape (62), to release the tape (62) from the chips (16).
Inventors
- 👤 Rafael C. Alfaro
- 👤 David Blair
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:19
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P50/00; H10P52/00; H10P54/00; H10P72/7402; H10P72/7416; H10P72/7422; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1064; Y10T428/00; Y10T428/28; Y10T428/2839
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
161 words
A method of protecting previously formed active sites on a first surface of a fully processed semiconductor wafer from particulate and fluid contaminants produced by and used in sawing the wafer along saw paths between the sites and into chips, each of which chips contain an active site, the method comprising: (a) contacting the first surface with a first tape-like member having one side thereof an adhesive pattern which is congruent and registered with the saw paths, the adhesive pattern bordering and defining non-adhesive-containing portions, the adhesive pattern adhering to the first surface along the saw paths so that the non-adhesive-containing portions overlie and encapsulate the active sites without adhesion thereto to seal the active sites against entry of the contaminants thereinto; (b) sawing the wafer along the paths through the first member to separate the wafer into chips and the first member into segments adhering to the chips; and (c) treating the adhesive to release the segments from the chips.
Claim 2
Independent Claim
161 words
A method of protecting previously formed active sites on a first surface of a fully processed semiconductor wafer from particulate and fluid contaminants produced by and used in sawing the wafer along saw paths between the sites and into chips, each of which chips contain an active site, the method comprising: (a) contacting the first surface with a first tape-like member having one side thereof an adhesive pattern which is congruent and registered with the saw paths, the adhesive pattern bordering and defining non-adhesive-containing portions, the adhesive pattern adhering to the first surface along the saw paths so that the non-adhesive-containing portions overlie and encapsulate the active sites without adhesion thereto to seal the active sites against entry of the contaminants thereinto; (b) sawing the wafer along the paths through the first member to separate the wafer into chips and the first member into segments adhering to the chips; and (c) treating the adhesive to release the segments from the chips.
Claim 3
Dependent Claim
25 words
A method as in claim 1, wherein: the adhesive is treated through the segments of the first member to release the segments from the chips.
Claim 4
Dependent Claim
25 words
A method as in claim 2, wherein: the first member and its segments are UV-transmissive and the adhesive loses its adhesion when exposed to UV.
Claim 5
Dependent Claim
27 words
A method as in claim 3, which further comprises: separating the chips from the segments of the first member after the adhesive has been exposed to UV.
Claim 6
Dependent Claim
26 words
A method as in claim 4, wherein: separation of the chips from the segments is effected by applying negative pressure to either one or both thereof.
Claim 7
Dependent Claim
33 words
A method as in claim 4, wherein: each site includes a deformable beam which may assume one position wherein it modulates incident light and other positions wherein it does not modulate incident light.
Claim 8
Dependent Claim
50 words
A method as in claim 1, which further comprises: (d) before step (a), adhering to a second surface of the wafer opposite the first surface a second tape-like member covered with an adhesive layer; and (e) after step (b), treating the adhesive on the second member to release the chips.
Claim 9
Dependent Claim
17 words
A method as in claim 7, wherein: during step (b) the second member is sawed into segments.
Claim 10
Dependent Claim
29 words
A method as in claim 7, wherein: step (b) is effected so that the wafer is not completely sawed through and the second member is not sawed into segments.
Claim 11
Dependent Claim
43 words
A method as in claim 9, wherein: before steps (c) and (e), the partially sawed wafer is broken into chips by flexing it along the partially sawed-through saw paths, whereby the chips are retained in their original relative orientations by the second member.
Claim 12
Dependent Claim
27 words
A method as in claim 7, wherein: the adhesives are treated through the segments of the first and second members to release the segments from the chips.
Claim 13
Dependent Claim
27 words
A method as in claim 11, wherein: the first and second members and their segments are UV-transmissive and the adhesives lose their adhesion when exposed to UV.
Claim 14
Dependent Claim
29 words
A method as in claim 12, which further comprises: separating the chips from the segments of the first and second members after the adhesives have been exposed to UV.
Claim 15
Dependent Claim
26 words
A method as in claim 13, wherein: separation of the chips from the segments is effected by applying negative pressure to either one or both thereof.
Claim 16
Dependent Claim
33 words
A method as in claim 13, wherein: each site includes a deformable beam which may assume one position wherein it modulates incident light and other positions wherein it does not modulate incident light.
Claim 17
Dependent Claim
156 words
Apparatus for protecting previously formed active sites on a first surface of a fully processed semiconductor wafer from particulate and fluid contaminants produced by and used in sawing the wafer along saw paths between the sites and into chips, each of which chips contains one of the sites, the apparatus comprising: a first tape-like member having on one side thereof an adhesive pattern which is congruent and registerable with the saw paths, the adhesive pattern bordering and defining non-adhesive containing portions, the adhesive pattern being adapted to adhere to the first surface along the saw paths so that the non-adhesive-containing portions overlie and encapsulate the active sites without adhesion thereto to seal the active sites against entry of the contaminants thereinto, the adhesive being subsequently treatable so as to lose its adhesion, whereby sawing the wafer along the paths through the first member adhered thereto separates the wafer into chips and the first member into segments.
Claim 18
Dependent Claim
156 words
Apparatus for protecting previously formed active sites on a first surface of a fully processed semiconductor wafer from particulate and fluid contaminants produced by and used in sawing the wafer along saw paths between the sites and into chips, each of which chips contains one of the sites, the apparatus comprising: a first tape-like member having on one side thereof an adhesive pattern which is congruent and registerable with the saw paths, the adhesive pattern bordering and defining non-adhesive containing portions, the adhesive pattern being adapted to adhere to the first surface along the saw paths so that the non-adhesive-containing portions overlie and encapsulate the active sites without adhesion thereto to seal the active sites against entry of the contaminants thereinto, the adhesive being subsequently treatable so as to lose its adhesion, whereby sawing the wafer along the paths through the first member adhered thereto separates the wafer into chips and the first member into segments.
Claim 19
Dependent Claim
32 words
Apparatus as in claim 16, wherein: the adhesive and the member are such that the adhesive is treatable through the segments of the first member to release the segments from the chips.
Claim 20
Dependent Claim
24 words
Apparatus as in claim 17, wherein: the first member and its segments are UV-transmissive and the adhesive loses its adhesion when exposed to UV.
Claim 21
Dependent Claim
42 words
Apparatus as in claim 16, which further comprises: a second tape-like member covered with an adhesive layer, the layer being adapted to adhere to a second surface of the wafer opposite the first surface, the adhesive being treatable to lose its adhesion.
Claim 22
Dependent Claim
21 words
Apparatus as in claim 19, wherein: the second member is adapted to be sawed into segments when the wafer is sawed.
Claim 23
Dependent Claim
22 words
Apparatus as in claim 19, wherein: the second member is adapted to remain integral if the wafer is only partially sawed through.
Claim 24
Dependent Claim
29 words
Apparatus as in claim 21, wherein: if the partially sawed wafer is broken into chips, the second member is adapted to retain the chips in their original relative orientations.
Claim 25
Dependent Claim
26 words
Apparatus as in claim 19, wherein: the adhesives are treatable through the segments of the first and second members to release the segments from the chips.
Claim 26
Dependent Claim
26 words
Apparatus as in claim 23, wherein: the first and second members and their segments are UV-transmissive and the adhesives lose their adhesion when exposed to UV.
Claim 27
Dependent Claim
27 words
Apparatus as in claim 24, wherein: the chips and the segments of the first and second members are separable after the adhesives have been exposed to UV.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-24 | 1999-01-23 | 1999-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-24 | 2003-01-23 | 2003-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-24 | 2007-01-23 | 2007-07-25 | $7700.00 | Window Closed / Lapsed |