Patent US5597670A successfully refreshed from Google Patents.
US5597670A
Expired / Lapsed
US
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Exposure method and apparatus
Assignee: Canon Inc
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Filing: 1995-04-27
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Granted: 1997-01-28
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Expires: 2015-04-27
Abstract
Abstract A method of exposing a photosensitive substrate with a band-narrowed laser beam from an excimer laser includes providing a stop having an opening in a path of the laser beam; adjusting a size of the opening of the stop to substantially compensate for a change in bandwidth of the laser beam; and exposing after the adjustment the substrate with the laser beam.
Inventors
- 👤 Masato Aketagawa
- 👤 Naoto Sano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 13:52
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70483; G03F7/7055; G03F7/70575; Y; Y10; Y10S; Y10S430/00; Y10S430/146
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
59 words
A method of exposing a photosensitive substrate with a band-narrowed laser beam from an excimer laser, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the substrate with the diameter-changed laser beam.
Claim 2
Independent Claim
59 words
A method of exposing a photosensitive substrate with a band-narrowed laser beam from an excimer laser, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the substrate with the diameter-changed laser beam.
Claim 3
Dependent Claim
27 words
A method according to claim 1, wherein said changing step comprises providing a stop having an aperture of adjustable size in the path of the laser beam.
Claim 4
Dependent Claim
51 words
A method according to claim 2, wherein the excimer laser includes a resonator having a diffraction grating disposed therewithin, and wherein the size of the opening is adjusted by changing the width of the opening in a direction corresponding to a direction perpendicular to a grating line of the diffraction grating.
Claim 5
Dependent Claim
34 words
A method according to claim 2, wherein the size of the opening is adjusted by changing the width of the opening that corresponds to a smaller dimension of a cross-section of the laser beam.
Claim 6
Dependent Claim
26 words
A method according to claim 3 or 4, wherein a sectional intensity distribution of the laser beam is monitored to detect the change in the bandwidth.
Claim 7
Dependent Claim
15 words
A method according to claim 2, wherein the excimer laser comprises a KrF excimer laser.
Claim 8
Dependent Claim
31 words
A method according to claim 2, wherein the laser beam passing through the opening of the stop is directed to the substrate through a lens assembly, for exposure of the substrate.
Claim 9
Dependent Claim
29 words
A method according to claim 7, wherein the size of the opening is adjusted so as to provide a laser beam of a bandwidth not greater than 0.005 nm.
Claim 10
Dependent Claim
29 words
A method according to claim 8, wherein the size of the aperture is adjusted so as to provide a laser beam of a bandwidth not greater than 0.003 nm.
Claim 11
Dependent Claim
18 words
A method according to claim 7, wherein the lens assembly is made substantially of a single glass material.
Claim 12
Dependent Claim
17 words
A method according to claim 10, wherein the glass material includes synthetic quartz as a major component.
Claim 13
Independent Claim
83 words
A method of manufacturing semiconductor devices by exposing a photosensitive layer of a wafer to a band-narrowed laser beam from an excimer laser to print a circuit pattern on the photosensitive layer, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the wafer with the diameter-changed laser beam to print the circuit pattern on the wafer.
Claim 14
Independent Claim
83 words
A method of manufacturing semiconductor devices by exposing a photosensitive layer of a wafer to a band-narrowed laser beam from an excimer laser to print a circuit pattern on the photosensitive layer, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the wafer with the diameter-changed laser beam to print the circuit pattern on the wafer.
Claim 15
Dependent Claim
27 words
A method according to claim 12, wherein said changing step comprises providing a stop having an aperture of adjustable size in the path of the laser beam.
Claim 16
Dependent Claim
46 words
A method according to claim 13, wherein the circuit pattern is illuminated with the laser beam passing through the opening of the stop, and wherein an image of the circuit pattern is projected on the wafer by a projection lens system, for exposure of the wafer.
Claim 17
Dependent Claim
51 words
A method according to claim 14, wherein the excimer laser includes a resonator having a diffraction grating disposed therewithin, and wherein the size of the opening is adjusted by changing the width of the opening in a direction corresponding to a direction perpendicular to a grating line of the diffraction grating.
Claim 18
Dependent Claim
34 words
A method according to claim 14, wherein the size of the opening is adjusted by changing the width of the opening that corresponds to a smaller dimension of a cross-section of the laser beam.
Claim 19
Dependent Claim
26 words
A method according to claim 15 or 16, wherein a sectional intensity distribution of the laser beam is monitored to detect the change in the bandwidth.
Claim 20
Dependent Claim
18 words
A method according to claim 14, wherein the lens assembly is made substantially of a single glass material.
Claim 21
Dependent Claim
17 words
A method according to claim 18, wherein the glass material includes synthetic quartz as a major component.
Claim 22
Dependent Claim
29 words
A method according to claim 19, wherein the size of the opening is adjusted so as to provide a laser beam of a bandwidth not greater than 0.005 nm.
Claim 23
Dependent Claim
29 words
A method according to claim 20, wherein the size of the aperture is adjusted so as to provide a laser beam of a bandwidth not greater than 0.003 nm.
Claim 24
Independent Claim
55 words
A method of exposing a photosensitive substrate with a band-narrowed laser beam, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the substrate with the diameter-changed laser beam.
Claim 25
Independent Claim
55 words
A method of exposing a photosensitive substrate with a band-narrowed laser beam, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the substrate with the diameter-changed laser beam.
Claim 26
Dependent Claim
27 words
A method according to claim 22, wherein said changing step comprises providing a stop having an aperture of adjustable size in a path of the laser beam.
Claim 27
Dependent Claim
22 words
A method according to claim 22, wherein said exposing step comprises focusing the laser beam onto the substrate by a projection lens.
Claim 28
Independent Claim
68 words
A device manufacturing method including a step of exposing a photosensitive substrate with a band-narrowed laser beam to print a device pattern on the substrate, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the substrate with the diameter-changed laser beam.
Claim 29
Independent Claim
68 words
A device manufacturing method including a step of exposing a photosensitive substrate with a band-narrowed laser beam to print a device pattern on the substrate, said method comprising the steps of: detecting a change in bandwidth of the laser beam; changing the diameter of the laser beam to substantially compensate for the change in bandwidth of the laser beam; and exposing the substrate with the diameter-changed laser beam.
Claim 30
Dependent Claim
27 words
A method according to claim 25, wherein said changing step comprises providing a stop having an aperture of adjustable size in a path of the laser beam.
Claim 31
Dependent Claim
22 words
A method according to claim 25, wherein said exposing step comprises focusing the laser beam onto the substrate by a projection lens.
Claim 32
Independent Claim
58 words
A method of exposing a photosensitive substrate with a band-narrowed laser beam, said method comprising the steps of: providing a variable aperture in a path of the laser beam; detecting a change in bandwidth of the laser beam; and substantially compensating for the detected change in bandwidth of the laser beam by changing the width of the aperture.
Claim 33
Independent Claim
58 words
A method of exposing a photosensitive substrate with a band-narrowed laser beam, said method comprising the steps of: providing a variable aperture in a path of the laser beam; detecting a change in bandwidth of the laser beam; and substantially compensating for the detected change in bandwidth of the laser beam by changing the width of the aperture.
Claim 34
Independent Claim
70 words
A method of manufacturing a device by exposing a photosensitive substrate with a band-narrowed laser beam to print a device pattern on the substrate, said method comprising the steps of: providing a variable aperture in a path of the laser beam; detecting a change in bandwidth of the laser beam; and substantially compensating for the detected change in bandwidth of the laser beam by changing the width of the aperture.
Claim 35
Independent Claim
70 words
A method of manufacturing a device by exposing a photosensitive substrate with a band-narrowed laser beam to print a device pattern on the substrate, said method comprising the steps of: providing a variable aperture in a path of the laser beam; detecting a change in bandwidth of the laser beam; and substantially compensating for the detected change in bandwidth of the laser beam by changing the width of the aperture.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-01-28 | 2000-07-29 | 2001-01-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-01-28 | 2004-07-29 | 2005-01-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-01-28 | 2008-07-29 | 2009-01-28 | $7700.00 | Window Closed / Lapsed |