US5590462A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for dissipating heat from a semiconductor package
Assignee: STMicroelectronics SRL
•
Filing: 1995-05-24
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Granted: 1997-01-07
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Expires: 2015-05-24
Abstract
Abstract A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.
Inventors
- 👤 Michael J. Hundt
- 👤 Carlo Cognetti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/25; H10W40/251; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09009; H05K2201/09072; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/0959; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
88 words
A method for attaching an integrated circuit package to a circuit board, comprising the steps of: forming a dam on a first surface of a printed circuit board, wherein the dam defines a region; forming a plurality of conductive pads on the first surface of a printed circuit board and adjacent the dam; placing a packaged integrated circuit device onto the dam to define a cavity, and bonding leads of the device to the conductive pads; injecting a thermally conductive material into the cavity to fill the cavity.
Claim 2
Independent Claim
88 words
A method for attaching an integrated circuit package to a circuit board, comprising the steps of: forming a dam on a first surface of a printed circuit board, wherein the dam defines a region; forming a plurality of conductive pads on the first surface of a printed circuit board and adjacent the dam; placing a packaged integrated circuit device onto the dam to define a cavity, and bonding leads of the device to the conductive pads; injecting a thermally conductive material into the cavity to fill the cavity.
Claim 3
Dependent Claim
13 words
The method of claim 1, wherein the injected material is an adhesive material.
Claim 4
Dependent Claim
25 words
The method of claim 1, wherein the material is injected through an opening in the circuit board from a second side opposite the first side.
Claim 5
Dependent Claim
67 words
The method of claim 1, further comprising the steps of: before the placing step, forming a through hole from the first surface of the printed circuit board, within the defined region, to a layer within the printed circuit board which has at least one conductive metallic trace; wherein the step of injecting the thermally conductive material also causes the thermally conductive material to fill the through hole.
Claim 6
Dependent Claim
22 words
The method of claim 4, further comprising the step of: before the placing step, plating the through hole with a metallic conductor.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-01-07 | 2000-07-08 | 2001-01-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-01-07 | 2004-07-08 | 2005-01-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-01-07 | 2008-07-08 | 2009-01-07 | $7700.00 | Window Closed / Lapsed |