Coplanar X-ray photodiode assemblies

Claim 2

A coplanar, non-dielectrically isolated photodiode for X-ray detection comprising semiconductor means having an absorption face and adjoining said face: (a) a single, elongated first doped region having a first polarity and defined by planar walls extending substantially perpendicularly from said absorption face into said semiconductor means to a first depth; (b) a second doped region having a polarity opposite that of said first doped region and defined by planar walls extending substantially perpendicularly from said absorption face into said semiconductor means to a second depth that is substantially equal to or greater than said first depth; (c) a substantially undoped region extending from said absorption face into said semiconductor means so as to separate and completely surround both of said first and second regions and to create a single p-n junction between said first and second doped regions; and (d) first electrical contact means connected to said first region along said absorption face.

Claim 3

Coplanar photodiode according to claim 1 further wherein the surface area of said first doped region along said face is greater than the surface area of said second doped region along said face.

Claim 4

Coplanar photodiode according to claim 2 further wherein each elongated planar wall defining said first doped region is substantially parallel to an elongated planar wall defining said second doped region.

Claim 5

Coplanar photodiode according to claim 3 further wherein said second doped region is substantially unbiased.

Claim 6

Coplanar photodiode according to claim 1 further comprising a third doped region underlying said undoped region and having the same polarity as said second doped region.

Claim 7

Coplanar photodiode according to claim 1 wherein said first depth ranges from about 1-2 microns.

Claim 8

Coplanar photodiode according to claim 6 wherein said second depth ranges from about 2-3 microns.

Claim 9

Coplanar photodiode according to claim 3 wherein said first depth ranges from about 1-2 microns and said second depth ranges from about 2-3 microns.

Claim 10

Coplanar photodiode according to claim 1 further comprising second electrical contact means connected to said second region along said absorption face.

Claim 11

Coplanar photodiode according to claim 9 wherein said second electrical contact means comprises a narrow metal strip along the surface of said second region.

Claim 12

Coplanar photodiode according to claim 1 wherein said semiconductor means comprises a silicon wafer.

Claim 13

Coplanar photodiode according to claim 2 wherein said first region is P-doped and said second region is N-doped.

Claim 14

Coplanar photodiode according to claim 2 wherein said first region is N-doped and said second region is P-doped.

Claim 15

Coplanar photodiode according to claim 2 wherein said first doped region comprises a first surface portion centrally-located on said face.

Claim 16

Coplanar photodiode according to claim 2 wherein said first doped region comprises a first substantially rectangular band centrally located along said face and said second doped region comprises a second, larger rectangular band surrounding said first rectangular band, said first and second rectangular bands being separated by bands of said undoped region.

Claim 17

Apparatus for detecting the light produced by X-rays absorbed in a scintillating crystal, said apparatus comprising non-dielectrically isolated photodiode means comprising alternating pairs of P-doped and N-doped regions, each said pair comprising a single p-n junction, wherein said doped regions extend from a single planar surface of said photodiode means into said photodiode means and associated electrical contacts for each doped region positioned along said single planar surface, further wherein said P-doped and N-doped regions are separated by a substantially undoped region extending from said planar surface into said photodiode means so as to completely surround each said P-doped and N-doped region.

Claim 18

Apparatus for detecting the light produced by X-rays absorbed in a scintillating crystal, said apparatus comprising non-dielectrically isolated photodiode means comprising alternating pairs of P-doped and N-doped regions, each said pair comprising a single p-n junction, wherein said doped regions extend from a single planar surface of said photodiode means into said photodiode means and associated electrical contacts for each doped region positioned along said single planar surface, further wherein said P-doped and N-doped regions are separated by a substantially undoped region extending from said planar surface into said photodiode means so as to completely surround each said P-doped and N-doped region.

Claim 19

Apparatus according to claim 16 further wherein either said P-doped or N-doped regions predominate along said planar surface.

Claim 20

In an X-ray detection system comprising in combination an X-ray source; scintillating crystal means to convert X-ray radiation into light; non-dielectrically isolated photodiode means to convert light into electrical current, said crystal means and photodiode means being mutually glued along an interface therebetween; frame means for positioning the crystal and photodiode means relative to said X-ray source; electrical conductor means for collecting electrical charges generated in the photodiode means; and electrical means for converting the electrical signals from the photodiode means into measurements of X-ray detection; the improvements comprising: adjacent said interface, alternating pairs of P-doped and N-doped regions of said photodiode means, each said pair comprising a single p-n junction, wherein each of said P- and N-doped regions is separated from one another and from adjacent P-N pairs by bands of undoped material, the less-dominant of each said doped region of a pair surrounding at least a portion of the perimeter of the associated predominant-doped region and extending into the photodiode means to a depth substantially equal to or greater than the depth of said predominant-doped region, and electrical contacts associated respectively with said P- and N-doped regions and located along said interface.

Claim 21

In an X-ray detection system comprising in combination an X-ray source; scintillating crystal means to convert X-ray radiation into light; non-dielectrically isolated photodiode means to convert light into electrical current, said crystal means and photodiode means being mutually glued along an interface therebetween; frame means for positioning the crystal and photodiode means relative to said X-ray source; electrical conductor means for collecting electrical charges generated in the photodiode means; and electrical means for converting the electrical signals from the photodiode means into measurements of X-ray detection; the improvements comprising: adjacent said interface, alternating pairs of P-doped and N-doped regions of said photodiode means, each said pair comprising a single p-n junction, wherein each of said P- and N-doped regions is separated from one another and from adjacent P-N pairs by bands of undoped material, the less-dominant of each said doped region of a pair surrounding at least a portion of the perimeter of the associated predominant-doped region and extending into the photodiode means to a depth substantially equal to or greater than the depth of said predominant-doped region, and electrical contacts associated respectively with said P- and N-doped regions and located along said interface.

Claim 22

Apparatus according to claim 17 wherein each non-dominant doped region extends to a depth substantially equal to or greater than the depth of the associated predominant-doped region.

Claim 23

Apparatus according to claim 19 wherein said photodiode means comprises a plurality of individual photodiode units aligned in side-by-side relationship, each individual photodiode unit comprising a single pair of P-doped and N-doped regions.

Claim 24

Apparatus according to claim 20 further wherein each said photodiode unit comprises a planar photodiode surface having at least a band of predominant-doped region surrounded by undoped material which, in turn, is surrounded by non-dominant doped region.

Claim 25

Apparatus according to claim 21 further comprising an X-ray scintillating crystal associated with the predominant-doped region of each photodiode unit.

Claim 26

Apparatus according to claim 22 wherein each said scintillating crystal is glued to its associated photodiode unit along said surface of said photodiode unit.

Claim 27

Apparatus according to claim 23 wherein each said scintillating crystal is sized and positioned relative to its associated photodiode unit so as to substantially cover the portion of said surface between said bands of non-dominant doped region and to overlap each of said bands of non-dominant doped region.

Claim 28

Apparatus according to claim 23 wherein each said scintillating crystal is glued to its associated photodiode unit with an optical epoxy.

Claim 29

Apparatus according to claim 23 further comprising scintillating crystal positioning means on each photodiode unit.

Claim 30

Apparatus according to claim 26 wherein said scintillating crystal positioning means comprise metal deposit alignment marks on said surface.

Claim 31

Apparatus according to claim 17 wherein said non-dominant doped region is substantially unbiased.

Claim 32

Apparatus according to claim 17 wherein said P-doped and N-doped regions are formed in a layer of substantially undoped material.

Claim 33

Apparatus according to claim 29 further comprising another non-dominant doped region on the side opposite to said P-doped and N-doped regions.

Claim 34

Apparatus according to claim 19 wherein said predominant-doped region extends to a depth of about 1-2 microns and said non-dominant doped region extends to a depth of about 2-3 microns.

Claim 35

Apparatus according to claim 16 wherein said electrical contacts comprise narrow metal strips respectively along the surfaces of said P-doped and N-doped regions.

Claim 36

Apparatus according to claim 16 wherein said photodiode comprises a silicon wafer.

Claim 37

Apparatus according to claim 17 wherein said P-doped region predominates.

Claim 38

Apparatus according to claim 17 wherein said N-doped region predominates.

Claim 39

Apparatus according to claim 22 further comprising sheets of separating material positioned between adjacent scintillating crystals.

Claim 40

The X-ray detection system of claim 18 wherein said photodiode means comprises an array of individual photodiode units aligned in side-by-side relationship, each photodiode unit comprising a band of said predominant-doped region surrounded by undoped material which, in turn, is surrounded by non-dominant doped region.

Claim 41

The X-ray detection system of claim 37 wherein said crystal means comprises a scintillating crystal associated with the predominant-doped region of each photodiode unit.

Claim 42

The X-ray detection system of claim 38 further comprising sheets of separating material positioned between adjacent scintillating crystals.

Claim 43

The X-ray detection system according to claim 38 further wherein each said scintillating crystal is sized and positioned relative to its associated photodiode unit so as to substantially cover the portion of said surface between bands of non-dominant doped region and to overlap each of said bands of non-dominant doped region.