Support structure for a semiconductor pressure transducer

Claim 2

A support structure for semiconductor transducer elements in a pressure transducer assembly, comprising: a plurality of semiconductive substrates arranged in a composite structure having a top substrate layer, upon which said transducer elements are disposed, and at least one lower substrate layer, wherein a first groove is disposed in said top substrate layer creating an area of reduced thickness in said top substrate layer below said transducer elements and a second groove is disposed through said at least one lower substrate layer that communicates with said first groove, thereby creating a continuous open region through said composite structure below said area of reduced thickness, said second groove being continuous thereby defining the periphery of a boss region in said at least one lower substrate layer that is coupled to said top substrate layer.

Claim 3

The support structure according to claim 1, wherein said first groove is continuous, defining the periphery of a contact region in said top substrate layer and said boss region in said at least one lower substrate layer being coupled to said contact region in said top substrate layer, whereby a force applied to said boss region is transferred to said contact region and is experience across said area of reduced thickness.

Claim 4

The support structure according to claim 1, wherein said at least one lower substrate layer has a thickness that is greater than that of said top substrate layer.

Claim 5

The support structure according to claim 1, wherein said at least one lower substrate layer is a single homogenous substrate.

Claim 6

The support structure according to claim 1, wherein said top substrate layer and said at least one lower substrate layer each have substantially the same coefficient of thermal expansion.

Claim 7

The support structure according to claim 5, wherein said top substrate layer has generally the same coefficient of thermal expansion as said transducer elements.

Claim 8

The support structure according to claim 2, wherein said first groove and said second groove are both annular in shape.

Claim 9

The support structure according to claim 1, wherein said top substrate layer and said at least one lower substrate layer are anodically bonded together.

Claim 10

The support structure according to claim 1, wherein said top substrate layer and said at least one lower substrate are silicon based.

Claim 11

A pressure sensor for measuring the pressure of a fluid in a vessel, comprising: a coupling member for engaging said vessel, said coupling member having a conduit disposed therethrough that communicates with said fluid contained with said vessel; a diaphragm structure, having a rigid region and a flexible region, joined to said coupling member, wherein said flexible region communicates with said fluid via said conduit and pressure changes within said fluid cause said flexible region to deform in relation to said rigid region; a transducer support structure coupled to said diaphragm structure between said rigid region and said flexible region, said transducer support structure including a plurality of substrate layers arranged in a composite structure having a top substrate layer and at least one lower substrate layer, wherein a first groove is disposed in said top substrate layer creating an area of reduced thickness in said top substrate layer and a second groove is disposed through said at least one lower substrate layer that communicates with said first groove, thereby creating a continuous open region through said composite structure below said area of reduced thickness wherein said open region is disposed between said rigid region and said flexible region and deformations in said flexible region relative said rigid region are experienced at said area of reduced thickness, said second groove being annular and defining the periphery of a boss region in said at least one lower substrate layer that is coupled to said top substrate layer; and at least one transducer element disposed on said top substrate layer above said area of reduced thickness wherein said at least one transducer element detects the degree of deformation experienced by said area of reduced thickness.

Claim 12

A pressure sensor for measuring the pressure of a fluid in a vessel, comprising: a coupling member for engaging said vessel, said coupling member having a conduit disposed therethrough that communicates with said fluid contained with said vessel; a diaphragm structure, having a rigid region and a flexible region, joined to said coupling member, wherein said flexible region communicates with said fluid via said conduit and pressure changes within said fluid cause said flexible region to deform in relation to said rigid region; a transducer support structure coupled to said diaphragm structure between said rigid region and said flexible region, said transducer support structure including a plurality of substrate layers arranged in a composite structure having a top substrate layer and at least one lower substrate layer, wherein a first groove is disposed in said top substrate layer creating an area of reduced thickness in said top substrate layer and a second groove is disposed through said at least one lower substrate layer that communicates with said first groove, thereby creating a continuous open region through said composite structure below said area of reduced thickness wherein said open region is disposed between said rigid region and said flexible region and deformations in said flexible region relative said rigid region are experienced at said area of reduced thickness, said second groove being annular and defining the periphery of a boss region in said at least one lower substrate layer that is coupled to said top substrate layer; and at least one transducer element disposed on said top substrate layer above said area of reduced thickness wherein said at least one transducer element detects the degree of deformation experienced by said area of reduced thickness.

Claim 13

The pressure sensor according to claim 10, wherein said first groove is annular, defining the periphery of a contact region in said top substrate layer and said boss region in said at least one lower substrate layer being coupled to said contact region in said top substrate layer, whereby a force applied to said boss region is transferred to said contact region and is experienced across said area of reduced thickness.

Claim 14

The pressure sensor according to claim 11, wherein a pushrod extends from said flexible region of said diaphragm structure, said pushrod moving reciprocally as said flexible region deforms with changes in fluid pressure, said pushrod terminating in a common plane with at least one surface of said rigid region of said diaphragm structure at ambient pressure, wherein said transducer support structure is coupled to said at least one surface of said rigid region so that said boss region of said at least one lower substrate layer is engaged by said pushrod, whereby the movement of said pushrod is experienced by said area of reduced thickness.

Claim 15

The pressure sensor according to claim 10, wherein said at least one lower substrate layer has a thickness that is greater than that of said top substrate layer.

Claim 16

The pressure sensor according to claim 10, wherein said top substrate layer and said at least one lower substrate layer each have substantially the same coefficient of thermal expansion.

Claim 17

The pressure sensor according to claim 14, wherein said at least one lower substrate layer is a single layer of semiconductive material.

Claim 18

The pressure sensor according to claim 12, wherein said rigid region and said flexible region of said diaphragm structure have a generally equivalent coefficient of thermal expansion.