US5587343A
Expired / Lapsed
US
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Semiconductor sensor method
Assignee: Denso Corp
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Filing: 1995-03-08
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Granted: 1996-12-24
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Expires: 2015-03-08
Abstract
Abstract A method for fabricating a semiconductor sensor wherein deflection of a movable member is disclosed. A silicon oxide film is formed on a silicon substrate, and a movable member composed of polycrystalline silicon is formed on the silicon oxide film by means of a low-pressured chemical vapor deposition process. At this time, silane is caused to flow into an oven, and the supply of silane is stopped when a layer of polycrystalline silicon has been deposited on the silicon substrate, and a first polycrystalline silicon layer is formed. By means of stopping the supply of silane, a silicon oxide layer of a thickness of several angstroms to several tens of angstroms is formed on the first polycrystalline silicon layer by atmosphere O 2 . A second polycrystalline silicon layer of a thickness of 1 μm is formed on the silicon oxide layer by means of causing silane to flow into the oven. Patterning by dry etching or the like through a photo-lithographic process is performed to form a movable member. The silicon oxide film below the movable member is then etched.
Inventors
- 👤 Kazuhiko Kano
- 👤 Yukihiro Takeuchi
- 👤 Takamoto Watanabe
- 👤 Kenichi Ao
- 👤 Masakazu Kanosue
- 👤 Hirofumi Uenoyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 14:21
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01332; H10D64/01352; G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; G01P15/12; G01P15/124; H10D48/00; H10D48/50; H10D64/60; H10D64/66; H10D64/68; G01P2015/0805; G01P2015/0822; G01P2015/0825; G01P2015/0828
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
85 words
A method for fabricating a semiconductor sensor, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming a beam structure film on said semiconductor substrate by film deposition so as to sandwich said sacrificial layer therebetween, wherein said beam structure film formation step includes a step of interrupting said film deposition at least one time; and etching said sacrificial layer after said beam structure forming step so that said beam structure film assumes a movable state with respect to said semiconductor substrate.
Claim 2
Independent Claim
85 words
A method for fabricating a semiconductor sensor, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming a beam structure film on said semiconductor substrate by film deposition so as to sandwich said sacrificial layer therebetween, wherein said beam structure film formation step includes a step of interrupting said film deposition at least one time; and etching said sacrificial layer after said beam structure forming step so that said beam structure film assumes a movable state with respect to said semiconductor substrate.
Claim 3
Dependent Claim
38 words
A method for fabricating a semiconductor sensor according to claim 1, wherein said interrupting step includes a step of forming an internal stress relieving layer on said beam structure film surface in an interrupted state of film deposition.
Claim 4
Dependent Claim
22 words
A method for fabricating a semiconductor sensor according to claim 2, wherein said internal stress relieving layer is a natural oxidation film.
Claim 5
Dependent Claim
24 words
A method for fabricating a semiconductor sensor according to claim 2, wherein said internal stress relieving layer is formed by means of RCA washing.
Claim 6
Independent Claim
99 words
A method for fabricating a semiconductor sensor which comprises a semiconductor substrate and a movable member of a beam structure composed of a thin film disposed above said semiconductor substrate with a gap interposed therebetween, wherein a physical quantity is detected based on a displacement of said movable member accompanying exertion of said physical quantity, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming an internal stress relieving film during film formation of a movable member on said sacrificial layer; and after formation of said movable member, etching said sacrificial layer below said movable member.
Claim 7
Independent Claim
99 words
A method for fabricating a semiconductor sensor which comprises a semiconductor substrate and a movable member of a beam structure composed of a thin film disposed above said semiconductor substrate with a gap interposed therebetween, wherein a physical quantity is detected based on a displacement of said movable member accompanying exertion of said physical quantity, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming an internal stress relieving film during film formation of a movable member on said sacrificial layer; and after formation of said movable member, etching said sacrificial layer below said movable member.
Claim 8
Dependent Claim
29 words
A method for fabricating a semiconductor sensor according to claim 5, wherein said internal stress relieving film is formed a plurality of times during formation of said movable member.
Claim 9
Dependent Claim
91 words
A method for fabricating a semiconductor sensor according to claim 5, wherein said movable member is composed of a polycrystalline silicon thin film and is formed by means of a low-pressured chemical vapor deposition method, a silicon oxide film as said internal stress relieving film is formed by means of atmosphere O 2 by stopping a supply of silane after forming polycrystalline silicon to a thickness by means of supplying silane to an oven, and polycrystalline silicon is formed to a thickness by means of again supplying silane to said oven.
Claim 10
Dependent Claim
30 words
A method for fabricating a semiconductor sensor according to claim 5, wherein said internal stress relieving film is removed by means of annealing after film formation of said movable member.
Claim 11
Dependent Claim
33 words
A method for fabricating a semiconductor sensor according to claim 2, wherein said internal stress relieving layer forming step includes a step of exposing said beam structure film surface to a plasma gas.
Claim 12
Dependent Claim
33 words
A method for fabricating a semiconductor sensor according to claim 2, wherein said internal stress relieving layer forming step includes a step of annealing said beam structure film surface with a laser beam.
Claim 13
Dependent Claim
56 words
A method for fabricating a semiconductor sensor according to claim 1, wherein said film deposition in said beam structure film formation step includes steps of: depositing a film material over said semiconductor substrate interposing said sacrificial layer therebetween; stopping said deposition of said film material; and restarting deposition of said film material over said semiconductor substrate.
Claim 14
Dependent Claim
65 words
A method for fabricating a semiconductor sensor according to claim 2, wherein said film deposition in said beam structure film formation step includes steps of: depositing a film material over said semiconductor substrate interposing said sacrificial layer therebetween; stopping said deposition of said film material to form said internal stress relieving layer; and restarting deposition of said film material over said internal stress relieving layer.
Claim 15
Dependent Claim
39 words
A method for fabricating a semiconductor sensor according to claim 1, wherein said interrupting step includes interrupting said film deposition of said beam structure film so as to divide said beam structure film into films having a same thickness.
Claim 16
Dependent Claim
46 words
A method for fabricating a semiconductor sensor according to claim 2, wherein said interrupting step includes interrupting said film deposition of said beam structure film so that said internal stress relieving layer is located between films, which form said beam structure film, having a same thickness.
Claim 17
Independent Claim
97 words
A method for fabricating a semiconductor sensor, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming a beam structure film on said semiconductor substrate so as to sandwich said sacrificial layer therebetween, said beam structure film formation step including steps of: depositing a first film over said semiconductor substrate so as to interpose said sacrificial layer therebetween; stopping deposition of said first film; and depositing a second film over said first film; and etching said sacrificial layer to place said beam structure film in a movable state with respect to said semiconductor substrate.
Claim 18
Independent Claim
97 words
A method for fabricating a semiconductor sensor, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming a beam structure film on said semiconductor substrate so as to sandwich said sacrificial layer therebetween, said beam structure film formation step including steps of: depositing a first film over said semiconductor substrate so as to interpose said sacrificial layer therebetween; stopping deposition of said first film; and depositing a second film over said first film; and etching said sacrificial layer to place said beam structure film in a movable state with respect to said semiconductor substrate.
Claim 19
Dependent Claim
24 words
A method for fabricating a semiconductor sensor according to claim 15, wherein said first film and second film are composed of a same material.
Claim 20
Dependent Claim
24 words
A method for fabricating a semiconductor sensor according to claim 15, wherein said first film and second film are composed of a polycrystalline silicon.
Claim 21
Dependent Claim
40 words
A method for fabricating a semiconductor sensor according to claim 15, wherein said beam structure film formation step further includes, after said second film deposition step, patterning said deposited first and second film into a shape of said beam structure.
Claim 22
Dependent Claim
31 words
A method for fabricating a semiconductor sensor according to claim 15, wherein said film deposition stopping step includes forming an internal stress relieving layer on a surface of said first film.
Claim 23
Dependent Claim
22 words
A method for fabricating a semiconductor sensor according to claim 19, wherein said internal stress relieving layer is a natural oxidation film.
Claim 24
Dependent Claim
24 words
A method for fabricating a semiconductor sensor according to claim 19, wherein said internal stress relieving layer is formed by means of RCA washing.
Claim 25
Dependent Claim
32 words
A method for fabricating a semiconductor sensor according to claim 19, wherein said internal stress relieving layer is forming step includes exposing said surface of said first film to a plasma gas.
Claim 26
Dependent Claim
32 words
A method for fabricating a semiconductor sensor according to claim 19, wherein said internal stress relieving layer is forming step includes annealing said surface of said first film with a laser beam.
Claim 27
Dependent Claim
23 words
A method of fabricating a semiconductor sensor, according to claim 15, wherein said first film and said second film have a same thickness.
Claim 28
Independent Claim
95 words
A method of fabricating a semiconductor sensor, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming a beam structure film on said semiconductor substrate so as to sandwich said sacrificial layer therebetween, wherein said beam structure film formation step includes a step of interrupting film deposition at least one time, and wherein said interrupting step includes a step of forming an internal stress relieving layer on said beam structure film surface; and etching said sacrificial layer so that said beam structure assumes a movable state with respect to said semiconductor substrate.
Claim 29
Independent Claim
95 words
A method of fabricating a semiconductor sensor, comprising the steps of: forming a sacrificial layer on a semiconductor substrate; forming a beam structure film on said semiconductor substrate so as to sandwich said sacrificial layer therebetween, wherein said beam structure film formation step includes a step of interrupting film deposition at least one time, and wherein said interrupting step includes a step of forming an internal stress relieving layer on said beam structure film surface; and etching said sacrificial layer so that said beam structure assumes a movable state with respect to said semiconductor substrate.
Claim 30
Dependent Claim
22 words
A method for fabricating a semiconductor sensor according to claim 25, wherein said internal stress reliving layer is a natural oxidation film.
Claim 31
Dependent Claim
24 words
A method for fabricating a semiconductor sensor according to claim 25, wherein said internal stress relieving layer is formed by means of RCA washing.
Claim 32
Dependent Claim
33 words
A method for fabricating a semiconductor sensor according to claim 25, wherein said internal stress relieving layer forming step includes a step of exposing said beam structure film surface to a plasma gas.
Claim 33
Dependent Claim
33 words
A method for fabricating a semiconductor sensor according to claim 25, wherein said internal stress relieving layer forming step includes a step of annealing said beam structure film surface with a laser beam.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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