Patent US4579880A successfully refreshed from Google Patents.
US5262000A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making micromechanical switch
Assignee: IPG Photonics Corp
•
Filing: 1990-09-07
•
Granted: 1993-11-16
•
Expires: 2010-09-07
Abstract
Abstract A micromechanical switch is formed using a first sacrificial layer formed on a substrate. A second sacrificial layer is then formed as an island on the first sacrificial layer. A switch element layer of resilient material is then formed on the second sacrificial layer, and the outline of a switch element is defined on the switch element layer. The outline of a window is then defined, and the second sacrificial layer is etched through the window using an etchant which laterally undercuts that portion of the switch element layer which is to form the switch element. The first sacrificial layer is then etched through the window defined by the etched second sacrificial layer to define a cavity beneath said portion, thereby defining the switch element.
Inventors
- 👤 Anthony D. Welbourn
- 👤 Judith C. McLaughlin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:55
CPC Classifications
H; H01; H01H; H01H1/00; H01H1/0036; G; G02; G02B; G02B26/00; G02B26/02; G02B6/00; G02B6/24; G02B6/26; G02B6/35; G02B6/3564; G02B6/3584; H01H2001/0089; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49105
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
125 words
A method of making a micromechanical switch, the method comprising the steps of: a) forming a first sacrificial layer on a substrate; b) forming a second sacrificial layer as an island on the first sacrificial layer; c) forming a switch element layer of resilient material on the second sacrificial layer; d) defining the outline of a switch element on the switch element layer; e) defining the outline of a window; f) etching an aperture in the second sacrificial layer through the window using an etchant which laterally undercuts that portion of the switch element layer which is to form the switch element; and g) etching the first sacrificial layer through the aperture in the etched second sacrificial layer to define a cavity beneath said portion.
Claim 2
Independent Claim
125 words
A method of making a micromechanical switch, the method comprising the steps of: a) forming a first sacrificial layer on a substrate; b) forming a second sacrificial layer as an island on the first sacrificial layer; c) forming a switch element layer of resilient material on the second sacrificial layer; d) defining the outline of a switch element on the switch element layer; e) defining the outline of a window; f) etching an aperture in the second sacrificial layer through the window using an etchant which laterally undercuts that portion of the switch element layer which is to form the switch element; and g) etching the first sacrificial layer through the aperture in the etched second sacrificial layer to define a cavity beneath said portion.
Claim 3
Dependent Claim
22 words
A method as claimed in claim 1, wherein the first sacrificial layer is an oxide layer formed by deposition or thermal growth.
Claim 4
Dependent Claim
19 words
A method as claimed in claim 1, wherein the second sacrificial layer is a polysilicon layer formed by deposition.
Claim 5
Dependent Claim
26 words
A method as claimed in claim 1, wherein the second sacrificial layer has a thickness which is small compared with that of the first sacrificial layer.
Claim 6
Dependent Claim
33 words
A method as claimed in claim 4, wherein the thickness of the first sacrificial layer is substantially 10 μm, and the thickness of the second sacrificial layer is between 0.5 and 2 μm.
Claim 7
Dependent Claim
30 words
A method as claimed in claim 1, further comprising the step of forming a nitride layer on the second sacrificial layer prior to the formation of the switch element layer.
Claim 8
Dependent Claim
20 words
A method as claimed in claim 6, wherein the nitride layer has a thickness of between 0.1 and 0.4 μm.
Claim 9
Dependent Claim
20 words
A method as claimed in claim 1, wherein the switch element layer is doped polysilicon which is formed by deposition.
Claim 10
Dependent Claim
21 words
A method as claimed in claim 8, wherein the thickness of the switch element layer is between 0.5 and 2 μm.
Claim 11
Dependent Claim
17 words
A method as claimed in claim 1, wherein the outline of the switch element is defined photolithographically.
Claim 12
Dependent Claim
24 words
A method as claimed in claim 6, wherein the switch element is formed by etching the switch element layer selectively to the nitride layer.
Claim 13
Dependent Claim
18 words
A method as claimed in claim 11, wherein the switch element layer is etched using a plasma etch.
Claim 14
Dependent Claim
23 words
A method as claimed in claim 11, wherein a further nitride layer is deposited following the step of etching the switch element layer.
Claim 15
Dependent Claim
21 words
A method as claimed in claim 13, wherein the further nitride layer has a thickness of between 0.1 and 0.3 μm.
Claim 16
Dependent Claim
30 words
A method as claimed in claim 13, further comprising the step of forming a layer of metal on that portion of the further nitride layer which covers the switch element.
Claim 17
Dependent Claim
21 words
A method as claimed in claim 15, further comprising the step of forming a passivating layer over the layer of metal.
Claim 18
Dependent Claim
20 words
A method as claimed in claim 1, wherein the outline of the window is formed photolithographically on the passivating layer.
Claim 19
Dependent Claim
21 words
A method as claimed in claim 17, wherein the passivating layer is etched, through the window, using a buffered HF etchant.
Claim 20
Dependent Claim
27 words
A method as claimed in claim 18, wherein both nitride layers are etched, using the etched passivating layer as a mask, using orthophosphoric acid as the etchant.
Claim 21
Dependent Claim
27 words
A method as claimed in claim 17, wherein the passivating layer and both the nitride layers are etched, through the window, by a single plasma etching step.
Claim 22
Dependent Claim
18 words
A method as claimed in claim 20, wherein the plasma etching step uses CHF 3 as the etchant.
Claim 23
Dependent Claim
44 words
A method as claimed in claim 18, further comprising the step of forming a further layer of metal over part of the passivating layer and part of the first sacrificial layer, the further layer of metal being formed prior to etching the passivating layer.
Claim 24
Dependent Claim
26 words
A method as claimed in claim 22, wherein the further layer of material is formed by electroplating and has a thickness of between 3 and μm.
Claim 25
Dependent Claim
21 words
A method as claimed in claim 1 wherein the second sacrificial layer is etched using ethylene diamine pyrocatechol as the etchant.
Claim 26
Dependent Claim
19 words
A method as claimed in claim 1, wherein the first sacrificial layer is etched using a buffered HF etchant.
Claim 27
Dependent Claim
29 words
A method as claimed in claim 1, further comprising the step of forming one or more electrodes in the substrate prior to the formation of the first sacrificial layer.
Claim 28
Dependent Claim
17 words
A micromechanical switch made by the method of claim 1 and having dimensions greater than 300 μm.
Claim 29
Independent Claim
63 words
A method of forming an operating cavity under a mechanically movable beam in a micromechanical switch, said method comprising the steps of: etching an aperture in a first sacrificial layer under said beam to expose a second sacrificial layer thereby defining the lateral extent of said cavity; and etching said second sacrificial layer through said aperture to define the depth of said cavity.
Claim 30
Independent Claim
63 words
A method of forming an operating cavity under a mechanically movable beam in a micromechanical switch, said method comprising the steps of: etching an aperture in a first sacrificial layer under said beam to expose a second sacrificial layer thereby defining the lateral extent of said cavity; and etching said second sacrificial layer through said aperture to define the depth of said cavity.
Claim 31
Dependent Claim
27 words
A micromechanical switch having a switch operating element of dimension greater than 300 μm disposed over a cavity formed in accordance with the method of claim 28.
References Cited (Backward Citations)
US4783237A
Cited
US4674180A
Cited
US4566935A
Cited
US4624741A
Cited
US4805038A
Cited
EP0330105A2
Cited
US4849070A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-15 | 1997-05-17 | 1997-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-15 | 2001-05-17 | 2001-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-15 | 2005-05-17 | 2005-11-16 | $7700.00 | Window Closed / Lapsed |