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US5585649A Expired / Lapsed US ⏱️ 0.0 years remaining

Compound semiconductor devices and methods of making compound semiconductor devices

Assignee: Toshiba Corp
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Filing: 1995-03-14
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Granted: 1996-12-17
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Expires: 2015-03-14
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Abstract

Abstract A compound semiconductor device with an improved internal current blocking structure. The semiconductor device includes an n-clad layer of II-VI compound semiconductor, a p-clad layer of II-VI compound semiconductor, an active layer of II-VI compound semiconductor between the n-clad and p-clad layers, a very thin current blocking layer of n-type II-VI compound semiconductor on the p-clad layer and providing an opening, a p-contact layer of p-type II-VI compound semiconductor on the p-clad layer and the current blocking layer at the opening, and a p-side electrode on the p-contact layer.

Inventors

  • 👤 Masayuki Ishikawa
  • 👤 Yukie Nishikawa
  • 👤 Masaaki Onomura
  • 👤 Shinji Saito
  • 👤 Peter J. Parbrook
  • 👤 Genichi Hatakoshi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 11:49
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/30; H01S5/32; H01S5/327; H01S5/20; H01S5/22; H01S5/2205; H01S5/2211; H01S5/223; H01S5/2231; H10; H10H; H10H20/00; H10H20/80; H10H20/81; H10H20/816; H10H20/8162; H10H20/822; H10H20/823; H10H20/824; H10H20/825; H10H20/83; H10H20/832

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 107 words
A semiconductor device providing a current blocking structure, comprising: a first semiconductor layer of a first conductive type of one of II-VI compound semiconductors and N-containing III-V compound semiconductors; a second semiconductor layer of a second conductive type of one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the first semiconductor layer the second semiconductor layer having an aperture for partially leaving a surface of the first semiconductor layer exposed; and a third layer of the first conductive type semiconductor comprising one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the first semiconductor layer and contacting the second semiconductor layer through the aperture.
Claim 2
Dependent Claim 107 words
A semiconductor device providing a current blocking structure, comprising: a first semiconductor layer of a first conductive type of one of II-VI compound semiconductors and N-containing III-V compound semiconductors; a second semiconductor layer of a second conductive type of one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the first semiconductor layer the second semiconductor layer having an aperture for partially leaving a surface of the first semiconductor layer exposed; and a third layer of the first conductive type semiconductor comprising one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the first semiconductor layer and contacting the second semiconductor layer through the aperture.
Claim 3
Dependent Claim 21 words
The semiconductor device according to claim 1, wherein a thickness of the second semiconductor layer is about 700 nm or less.
Claim 4
Dependent Claim 24 words
The semiconductor device according to claim 1, wherein a thickness of the second semiconductor layer is from about 100 nm to about 450 nm.
Claim 5
Dependent Claim 21 words
The semiconductor device according to claim 1, wherein the first conductive type is p-type and the second conductive type is n-type.
Claim 6
Dependent Claim 23 words
The semiconductor device according to claim 1, wherein the first semiconductor layer provides a hollow at a portion covered with the third layer.
Claim 7
Dependent Claim 33 words
The semiconductor contact structure according claim 5, wherein the second semiconductor layer has a depression, and the third semiconductor layer contacts the second semiconductor layer at the hollow of the first semiconductor layer.
Claim 8
Dependent Claim 16 words
The semiconductor contact structure according to claim 6, wherein the depression and the hollow are coextensive.
Claim 9
Dependent Claim 21 words
The semiconductor contact structure according to claim 8, wherein the depression and the hollow are formed in a single etching step.
Claim 10
Dependent Claim 36 words
The semiconductor device according to claim 1, wherein the first semiconductor layer comprises the II-VI compound semiconductor, and the second semiconductor layer comprises the II-VI compound semiconductor, and the third layer comprises the II-VI compound semiconductor.
Claim 11
Dependent Claim 171 words
A semiconductor laser comprising: a semiconductor substrate of n-type; an n-clad layer of II-VI compound semiconductor on the substrate; an active layer of II-VI compound semiconductor on the n-clad layer; a p-clad layer of II-VI compound semiconductor on the active layer; a current blocking layer of n-type II-VI compound semiconductor on the p-clad layer and having an opening; a buried p-contact layer of p-ZnSeS on the current blocking layer and contacting the p-clad layer through the opening of the current blocking layer; a p-contact layer of p-ZnTe on the buried p-contact layer; a first electrode in contact with the p-contact layer; and a second electrode in contact with the semiconductor substrate; and a super lattice comprising ZeSe layers, ZnSeTe layers, and ZnTe layers between the buried p-contact layer and the p-contact layer wherein the super lattice comprises a first portion of p-ZnSe layers and p-ZnSeTe layers at a side of the buried p-contact layer, and a second portion of p-ZnSeTe layers and p-ZnTe layers at a side of the p-contact layer.
Claim 12
Dependent Claim 171 words
A semiconductor laser comprising: a semiconductor substrate of n-type; an n-clad layer of II-VI compound semiconductor on the substrate; an active layer of II-VI compound semiconductor on the n-clad layer; a p-clad layer of II-VI compound semiconductor on the active layer; a current blocking layer of n-type II-VI compound semiconductor on the p-clad layer and having an opening; a buried p-contact layer of p-ZnSeS on the current blocking layer and contacting the p-clad layer through the opening of the current blocking layer; a p-contact layer of p-ZnTe on the buried p-contact layer; a first electrode in contact with the p-contact layer; and a second electrode in contact with the semiconductor substrate; and a super lattice comprising ZeSe layers, ZnSeTe layers, and ZnTe layers between the buried p-contact layer and the p-contact layer wherein the super lattice comprises a first portion of p-ZnSe layers and p-ZnSeTe layers at a side of the buried p-contact layer, and a second portion of p-ZnSeTe layers and p-ZnTe layers at a side of the p-contact layer.
Claim 13
Dependent Claim 117 words
A semiconductor device comprising: an n-clad layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors; a p-clad layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors; an active layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors between the n-clad and p-clad layers; a current blocking layer of n-type semiconductor comprising one of II-VI compound semiconductors and N-containing III-V compound semiconductors, disposed on the p-clad layer and providing an opening; a p-contact layer of p-type semiconductor comprising one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the current blocking layer and contacting the p-clad layer through the opening; and a p-side electrode on the p-contact layer.
Claim 14
Dependent Claim 117 words
A semiconductor device comprising: an n-clad layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors; a p-clad layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors; an active layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors between the n-clad and p-clad layers; a current blocking layer of n-type semiconductor comprising one of II-VI compound semiconductors and N-containing III-V compound semiconductors, disposed on the p-clad layer and providing an opening; a p-contact layer of p-type semiconductor comprising one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the current blocking layer and contacting the p-clad layer through the opening; and a p-side electrode on the p-contact layer.
Claim 15
Dependent Claim 14 words
The semiconductor device according to claim 11, wherein the active layer includes multi-quantum wells.
Claim 16
Dependent Claim 138 words
A semiconductor device comprising: a semiconductor substrate of a first conductive type; a first clad layer of the first conductive type on the semiconductor substrate; an active layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the first clad layer; a second clad layer of a second conductive type on the active layer; a current blocking layer of the first conductive type on the active layer; a current blocking layer on the first conductive type on the second clad layer and having an opening; a contact layer of a semiconductor material of the second conductive type on the current blocking layer and contacting the second clad layer through the opening of the current blocking layer; a first electrode in contact with the contact layer; and a second electrode in contact with the semiconductor substrate.
Claim 17
Dependent Claim 138 words
A semiconductor device comprising: a semiconductor substrate of a first conductive type; a first clad layer of the first conductive type on the semiconductor substrate; an active layer of one of II-VI compound semiconductors and N-containing III-V compound semiconductors on the first clad layer; a second clad layer of a second conductive type on the active layer; a current blocking layer of the first conductive type on the active layer; a current blocking layer on the first conductive type on the second clad layer and having an opening; a contact layer of a semiconductor material of the second conductive type on the current blocking layer and contacting the second clad layer through the opening of the current blocking layer; a first electrode in contact with the contact layer; and a second electrode in contact with the semiconductor substrate.
Claim 18
Dependent Claim 21 words
The semiconductor device according to claim 13, wherein a thickness of the current blocking layer is about 700 nm or less.
Claim 19
Dependent Claim 27 words
The semiconductor device according to claim 13, further comprising a cap layer of the second conductive type between the current blocking layer and the second clad layer.
Claim 20
Dependent Claim 28 words
The semiconductor device according to claim 15, wherein the second clad layer comprising a Mg-containing II-VI compound semiconductor, and the cap layer comprises a Mg-free II-VI compound semiconductor.
Claim 21
Dependent Claim 27 words
The semiconductor device according to claim 13, further comprising a semiconductor buffer layer of the first conductive type semiconductor between the substrate and the first clad layer.
Claim 22
Dependent Claim 79 words
The semiconductor device according to claim 13, wherein the contact layer comprises: a buried contact layer on the second clad layer and the current blocking layer at the opening of the current blocking layer; a top contact layer on the buried contact layer; and a super lattice layer between the top contact layer and the buried contact layer, comprising first layers of semiconductor comprising the buried contact layer and second layers of another semiconductor comprising the top contact layer.
Claim 23
Dependent Claim 14 words
The semiconductor device according to claim 13, wherein the active layer includes multi-quantum wells.

References Cited (Backward Citations)

US5027169A Cited
US5010376A Cited
US5281830A Cited
US5306924A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-17 2000-06-17 2000-12-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-17 2004-06-17 2004-12-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-17 2008-06-17 2008-12-17 $7700.00 Window Closed / Lapsed

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