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US5585300A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making conductive amorphous-nitride barrier layer for high-dielectric-constant material electrodes

Assignee: Texas Instruments Inc
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Filing: 1994-08-01
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Granted: 1996-12-17
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Expires: 2014-08-01
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Abstract

Abstract A preferred embodiment of this invention comprises an oxidizable layer (e.g. TiN 50), an amorphous nitride barrier layer (e.g. Ti-Si-N 34) overlying the oxidizable layer, an oxygen stable layer (e.g. platinum 36) overlying the amorphous nitride layer, and a high-dielectric-constant material layer (e.g. barium strontium titanate 38) overlying the oxygen stable layer. The amorphous nitride barrier layer substantially inhibits diffusion of oxygen to the oxidizable layer, thus minimizing deleterious oxidation of the oxidizable layer.

Inventors

  • 👤 Scott R. Summerfelt

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 02:15
CPC Classifications
H; H10; H10B; H10B12/00; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10D1/692

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 53 words
A method of forming a microelectronic structure, said method comprising: (a) forming an oxidizable layer; (b) forming a ternary or greater amorphous nitride layer on said oxidizable layer; (c) forming an oxygen stable layer on said amorphous nitride layer; and (d) forming a layer of a high-dielectric-constant material on said oxygen stable layer.
Claim 2
Independent Claim 53 words
A method of forming a microelectronic structure, said method comprising: (a) forming an oxidizable layer; (b) forming a ternary or greater amorphous nitride layer on said oxidizable layer; (c) forming an oxygen stable layer on said amorphous nitride layer; and (d) forming a layer of a high-dielectric-constant material on said oxygen stable layer.
Claim 3
Dependent Claim 31 words
The method according to claim 1, said method further comprising exposing said structure to oxygen between said steps (c) and (d) to oxidize a sidewall portion of said amorphous nitride layer.
Claim 4
Dependent Claim 32 words
The method according to claim 1, said method further comprising exposing said structure to oxygen between said steps (c) and (d) to oxidize an upper surface portion of said amorphous nitride layer.
Claim 5
Dependent Claim 31 words
The method according to claim 1, said method further comprising forming an oxygen stable sidewall adjacent said amorphous nitride layer and said oxygen stable layer between said steps (c) and (d).
Claim 6
Dependent Claim 18 words
The method according to claim 1, wherein said amorphous nitride layer is partially oxidized during said step (d).
Claim 7
Dependent Claim 13 words
The method according to claim 1, wherein said amorphous nitride layer comprises Ti-Si-N.
Claim 8
Dependent Claim 25 words
The method according to claim 1, wherein said amorphous nitride layer is selected from the group consisting of: Ti-Si-N, Ta-Si-N, Ta-B-N, Ti-B-N, and combinations thereof.
Claim 9
Dependent Claim 46 words
The method according to claim 1, wherein said oxidizable layer is selected from the group consisting of: tantalum, tungsten, titanium, molybdenum, titanium nitride, zirconium nitride, titanium silicide, tantalum silicide, tungsten silicide, molybdenum silicide, tantalum carbide, titanium boride, boron carbide, silicon, germanium, carbon, GaAs, and combinations thereof.
Claim 10
Dependent Claim 50 words
The method according to claim 1, wherein said high-dielectric-constant material is selected from the group consisting of: barium strontium titanate, lead zirconate titanate, lead lanthanum titanate, lead lanthanum zirconate titanate, bismuth titanate, potassium tantalate, lead scandium tantalate, lead niobate, lead zinc niobate, potassium niobate, lead magnesium niobate, and combinations thereof.
Claim 11
Dependent Claim 13 words
The method according to claim 1, wherein said oxygen stable layer comprises platinum.
Claim 12
Dependent Claim 39 words
The method according to claim 1, wherein said oxygen stable layer is selected from the group consisting of: platinum, palladium, rhenium, rhodium, ruthenium oxide, tin oxide, indium oxide, rhenium oxide, osmium oxide, rhodium oxide, iridium oxide, and combinations thereof.
Claim 13
Dependent Claim 19 words
The method according to claim 1, said method further comprising forming an upper electrode on said high-dielectric-constant material layer.
Claim 14
Dependent Claim 31 words
The method according to claim 12, wherein said upper electrode is selected from the group consisting of: titanium nitride, ruthenium dioxide, YBaCuO platinum, palladium, rhodium, gold, iridium, silver, and combinations thereof.
Claim 15
Independent Claim 45 words
A method of forming a microelectronic structure, said method comprising: (a) forming a TiN layer; (b) forming a Ti-Si-N layer on said TiN layer; (c) forming a Pt layer on said Ti-Si-N layer; and (d) forming a barium strontium titanate layer on said Pt layer.
Claim 16
Independent Claim 45 words
A method of forming a microelectronic structure, said method comprising: (a) forming a TiN layer; (b) forming a Ti-Si-N layer on said TiN layer; (c) forming a Pt layer on said Ti-Si-N layer; and (d) forming a barium strontium titanate layer on said Pt layer.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-17 2000-06-17 2000-12-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-17 2004-06-17 2004-12-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-17 2008-06-17 2008-12-17 $7700.00 Window Closed / Lapsed

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