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US5582772A
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Copper oxide-filled polymer die attach adhesive composition for semiconductor package
Assignee: Amkor Technology Singapore Holding Pte Ltd
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Filing: 1995-06-07
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Granted: 1996-12-10
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Expires: 2015-06-07
Abstract
Abstract There is disclosed a copper oxide-filled polymer die attach adhesive composition for semiconductor package The copper oxide-filled polymer die attach adhesive composition for semiconductor package is made of an adhesion resin mixture and an inorganic filler, wherein the inorganic filler includes copper oxide selected from a group consisting of CuO, Cu2O and the mixture thereof in an amount of approximately 0.1 to approximately 90% by weight. Optionally, silver may be contained in the composition. It is capable of maintaining electric conductivity under severe temperature cycle as well as providing bonding strength enough to prevent package crack and delamination.
Inventors
- 👤 Cheol W. Kwak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 09:53
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; C; C09; C09J; C09J11/00; C09J11/02; C09J11/04; C09J163/00; C09J9/00; C09J9/02; H10; H10W; H10W72/00; H10W72/30; C09J2203/00; C09J2203/326; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
77 words
A copper oxide-filled polymer die attach adhesive composition for a semiconductor package comprising an adhesive epoxy resin monomer, an amine-based curing agent, an epoxide or butyl carbitol acetate diluent, a silane or dicyandimine adhesion promoter, thixotropic agent, and a copper oxide inorganic filler, wherein said inorganic filler is selected from the group consisting of CuO, Cu 2 O and the mixture thereof in an amount of approximately 50 to approximately 80% by weight of the overall composition.
Claim 2
Dependent Claim
77 words
A copper oxide-filled polymer die attach adhesive composition for a semiconductor package comprising an adhesive epoxy resin monomer, an amine-based curing agent, an epoxide or butyl carbitol acetate diluent, a silane or dicyandimine adhesion promoter, thixotropic agent, and a copper oxide inorganic filler, wherein said inorganic filler is selected from the group consisting of CuO, Cu 2 O and the mixture thereof in an amount of approximately 50 to approximately 80% by weight of the overall composition.
Claim 3
Dependent Claim
30 words
The copper oxide-filled polymer die attach adhesive composition as set forth in claim 1, wherein said inorganic filler further comprises silver in an amount of 1 to 10% by weight.
Claim 4
Dependent Claim
27 words
A copper oxide-filled polymer die attach adhesive for semiconductor package which is prepared with the composition of claim 1, in a form of either paste or tape.
Claim 5
Dependent Claim
27 words
A copper oxide-filled polymer die attach adhesive for semiconductor package which is prepared with the composition of claim 2, in a form of either paste or tape.
Claim 6
Dependent Claim
78 words
A copper oxide-filled polymer die attach adhesive composition for attaching a semiconductor die to a lead frame paddle, said composition comprising organic components including an epoxy resin monomer, a curing agent, and a silane or silanol adhesion promote; and a copper oxide inorganic filler, wherein said inorganic filler is selected from the group consisting of CuO, Cu 2 O and the mixture thereof in an amount of approximately 50 to approximately 80% by weight of the overall composition.
Claim 7
Dependent Claim
78 words
A copper oxide-filled polymer die attach adhesive composition for attaching a semiconductor die to a lead frame paddle, said composition comprising organic components including an epoxy resin monomer, a curing agent, and a silane or silanol adhesion promote; and a copper oxide inorganic filler, wherein said inorganic filler is selected from the group consisting of CuO, Cu 2 O and the mixture thereof in an amount of approximately 50 to approximately 80% by weight of the overall composition.
Claim 8
Dependent Claim
37 words
The composition of claim 5 wherein the organic components of the composition comprise 70 parts by weight of said epoxy resin monomer and 30 parts by weight of said curing agent, said promoter and a thixotropic agent.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-10 | 2000-06-10 | 2000-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-10 | 2004-06-10 | 2004-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-10 | 2008-06-10 | 2008-12-10 | $7700.00 | Window Closed / Lapsed |