Patent US5581118A successfully refreshed from Google Patents.
US5581118A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic surface mount device
Assignee: Semiconductor Components Industries LLC
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Filing: 1995-06-23
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Granted: 1996-12-03
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Expires: 2015-06-23
Abstract
Abstract A surface mount package (10) includes a leadframe (14) facing away from the mounting surface such that the primary heat path is away from the mounting surface. The package may be a modified TO-220, wherein the tab (16) of the leadframe is bent down toward the mounting surface, and the leads (20) are bent down and under the package. Such an embodiment provides for a small footprint and is relatively easy to manufacture.
Inventors
- 👤 Lonne L. Mays
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:07
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/481; H10W70/01; H10W70/04; H10W70/048; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
88 words
A surface mount device package comprising: a first exterior surface; a second exterior surface opposite and parallel to the first exterior surface; a third exterior surface connecting the first exterior surface to the second exterior surface; a rigid metal leadframe having an extending tab, wherein the rigid metal leadframe forms at least a portion of the first exterior surface, wherein the surface mount device package is mountable on the second exterior surface and wherein electrical coupling of the surface mount device package occurs along the second exterior surface.
Claim 2
Dependent Claim
88 words
A surface mount device package comprising: a first exterior surface; a second exterior surface opposite and parallel to the first exterior surface; a third exterior surface connecting the first exterior surface to the second exterior surface; a rigid metal leadframe having an extending tab, wherein the rigid metal leadframe forms at least a portion of the first exterior surface, wherein the surface mount device package is mountable on the second exterior surface and wherein electrical coupling of the surface mount device package occurs along the second exterior surface.
Claim 3
Dependent Claim
21 words
The package of claim 1, wherein the extending tab is bent toward the second exterior surface along the third exterior surface.
Claim 4
Dependent Claim
34 words
The package of claim 1, further comprising a protrusion extending from the second exterior surface, away from the first exterior surface, the protrusion having a bottom surface substantially coplanar to a plurality of leads.
Claim 5
Dependent Claim
15 words
The package of claim 1, further comprising a heatsink attached to the rigid metal leadframe.
Claim 6
Dependent Claim
26 words
The surface mount device package of claim 1 further comprising a circuit board electrically coupled to the surface mount device package along the second exterior surface.
Claim 7
Dependent Claim
27 words
The package of claim 2, further comprising a plurality of electrical leads parallel to the second exterior surface and coplanar to an edge of the extending tab.
Claim 8
Dependent Claim
19 words
The package of claim 6, wherein at least one of the electrical leads is adjacent the second exterior surface.
Claim 9
Dependent Claim
16 words
The package of claim 6, wherein the electrical surface mount device package is a modified TO-220.
Claim 10
Dependent Claim
111 words
An electronic surface mount device package comprising: a molded package with a first side, a second side, and a mounting side, wherein the second side connects the first side to the mounting side; an exposed leadframe having an extending tab, the exposed leadframe being exposed along the first side of the molded package and the extending tab being bent along the second side of the molded package in a direction toward the mounting side, wherein electrical coupling of the electronic surface mount device package occurs along the mounting side of the molded package; and a plurality of leads lying in a plane parallel to the mounting side of the molded package.
Claim 11
Dependent Claim
111 words
An electronic surface mount device package comprising: a molded package with a first side, a second side, and a mounting side, wherein the second side connects the first side to the mounting side; an exposed leadframe having an extending tab, the exposed leadframe being exposed along the first side of the molded package and the extending tab being bent along the second side of the molded package in a direction toward the mounting side, wherein electrical coupling of the electronic surface mount device package occurs along the mounting side of the molded package; and a plurality of leads lying in a plane parallel to the mounting side of the molded package.
Claim 12
Dependent Claim
16 words
The package of claim 9, wherein the extending tab comprises an edge coplanar to the leads.
Claim 13
Dependent Claim
14 words
The package of claim 9, wherein the leads are adjacent to the mounting side.
Claim 14
Dependent Claim
16 words
The package of claim 9, wherein the electronic surface mount device package comprises a modified TO-220.
Claim 15
Dependent Claim
14 words
The package of claim 9, further comprising a heatsink attached to the exposed leadframe.
Claim 16
Dependent Claim
15 words
The package of claim 9, wherein the electronic surface mount device package contains a thyristor.
Claim 17
Dependent Claim
15 words
The package of claim 9, wherein the electronic surface mount device package contains a transistor.
Claim 18
Dependent Claim
15 words
The package of claim 9, wherein the electronic surface mount device package contains a diode.
Claim 19
Dependent Claim
16 words
The package of claim 9, wherein the electronic surface mount device package contains an analog regulator.
Claim 20
Dependent Claim
35 words
The electronic surface mount device package of claim 9 further comprising a circuit board adjacent to the mounting side of the molded package wherein the plurality of leads are electrically coupled to the circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-03 | 2000-06-03 | 2000-12-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-03 | 2004-06-03 | 2004-12-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-03 | 2008-06-03 | 2008-12-03 | $7700.00 | Window Closed / Lapsed |