Patent US5581065A successfully refreshed from Google Patents.
US5581065A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sheet-framed IC carrier, method for producing the same, and IC carrier case
Assignee: Dai Nippon Printing Co Ltd
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Filing: 1994-07-28
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Granted: 1996-12-03
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Expires: 2014-07-28
Abstract
Abstract A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
Inventors
- 👤 Seiichi Nishikawa
- 👤 Hiroshi Harima
- 👤 Kazuyoshi Irisawa
- 👤 Jun Takahashi
- 👤 Akiko Moriyama
- 👤 Mayumi Inada
- 👤 Yoshikazu Fukushima
- 👤 Masaki Wakamatsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:17
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07737; G06K19/07739; G06K19/072; G06K19/07745; A; A45; A45C; A45C11/00; A45C11/18; A45C2011/188; G06K19/07701
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
202 words
A sheet-framed IC carrier comprising: a sheet frame having an aperture having a first area; a backing film having a pressure-sensitive adhesive layer on one surface, said backing film being adhered to a back surface of said sheet frame through said adhesive layer; and an IC carrier having a base and an IC module mounted on the base, said base having the same shape as said aperture and a second area less than said first area, said IC carrier being set in the aperture of said sheet frame and being secured there with said adhesive layer of said backing film, wherein the difference in area between the IC carrier base and the sheet frame aperture results in a peripheral slit of constant width extending around the entire periphery of the IC carrier between the sheet frame aperture and the IC carrier, wherein said backing film covers the entirety of said peripheral slit on said back surface of said sheet frame, and wherein the IC carrier has a main portion and an end portion and wherein only said main portion is adhered to the backing film, whereby said IC carrier can be easily peeled away from said adhesive layer of said backing film.
Claim 2
Dependent Claim
202 words
A sheet-framed IC carrier comprising: a sheet frame having an aperture having a first area; a backing film having a pressure-sensitive adhesive layer on one surface, said backing film being adhered to a back surface of said sheet frame through said adhesive layer; and an IC carrier having a base and an IC module mounted on the base, said base having the same shape as said aperture and a second area less than said first area, said IC carrier being set in the aperture of said sheet frame and being secured there with said adhesive layer of said backing film, wherein the difference in area between the IC carrier base and the sheet frame aperture results in a peripheral slit of constant width extending around the entire periphery of the IC carrier between the sheet frame aperture and the IC carrier, wherein said backing film covers the entirety of said peripheral slit on said back surface of said sheet frame, and wherein the IC carrier has a main portion and an end portion and wherein only said main portion is adhered to the backing film, whereby said IC carrier can be easily peeled away from said adhesive layer of said backing film.
Claim 3
Dependent Claim
31 words
The sheet-framed IC carrier according to claim 1, wherein a profile of the backing film is, with respect to any direction, about 2 mm larger than a profile of the aperture.
Claim 4
Dependent Claim
32 words
The sheet-framed IC carrier according to claim 1, wherein a profile of the backing film is, with respect to any direction, about 2 mm smaller than an profile of the sheet frame.
Claim 5
Dependent Claim
22 words
The sheet-framed IC carrier according to claim 1, further comprising a print on one of the sheet frame and the backing film.
Claim 6
Dependent Claim
33 words
The sheet-framed IC carrier according to claim 1, wherein the adhesive layer of the backing film has semi-permanent tackiness so as to permit multiple operations of peeling and sticking of the IC carrier.
Claim 7
Dependent Claim
22 words
The sheet-framed IC carrier according to claim 1, wherein said sheet frame comprises one of an acrylic resin and a polycarbonate resin.
Claim 8
Dependent Claim
32 words
The sheet-framed IC carrier according to claim 1, wherein the thickness of the sheet frame is about 0.76 mm and said peripheral slit is in the range of 0.1 to 5.0 mm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-03 | 2000-06-03 | 2000-12-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-03 | 2004-06-03 | 2004-12-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-03 | 2008-06-03 | 2008-12-03 | $7700.00 | Window Closed / Lapsed |