Ic card and manufacturing method therefor

Claim 2

An IC card having a thickness comprising: a molded synthetic resin circumferential frame having opposed first and second surfaces and including a periphery having a thickness extending between the first and second surfaces corresponding to the thickness of said IC card; a circuit board unitary with and integrally molded with said circumferential frame, disposed within the periphery intermediate the first and second surfaces of said frame, including opposed third and fourth surfaces, and having an opening for the passage of resin sealant to the third and fourth surfaces during encapsulation of the IC card; electric circuit means disposed on at least one of said third and fourth surfaces including an I/O portion disposed on one of said circuit board and said periphery for supplying information to and receiving information from external equipment; and a resin sealant covering the third and fourth surfaces of said circuit board, hermetically encapsulating said electric circuit means, and having a thickness no greater than the thickness of said periphery, said resin sealing being disposed within said frame to form a card-like shape.

Claim 3

An IC card according to claim 1 wherein said IC card is a non-contact type card and said I/O portion comprises communication means mounted on one of said third and fourth surfaces cf said circuit board.

Claim 4

An IC card according to claim 2 wherein said communication means comprises at least one induction coil.

Claim 5

An IC card according to claim 1 wherein said I/O portion comprises at least one electrode terminal electrically connected to said circuit, disposed on said periphery and appearing on the surface of said IC card.

Claim 6

An IC card according to claim 4 including securing means disposed on said frame for positioning and securing said frame at a predetermined position so that said circuit and said electrode terminal are accurately positioned and formed on said frame.

Claim 7

An IC card according to claim 5 wherein said securing means comprises at least two positioning holes formed in a portion of said frame sealed by said resin sealant.

Claim 8

An IC card according to claim 6 wherein said at least two positioning holes are formed proximate said periphery of said frame and do not appear on the surface of said IC card.

Claim 9

An IC card according to claim 5 wherein said securing means includes at least two positioning projections formed in said circuit board for penetrating two positioning holes in said circuit board.

Claim 10

An IC card according to claim 5 wherein said securing means comprises at least two positioning pin portions formed in said circuit board, said at least two positioning pin portions not projecting from the surface of said IC card.

Claim 11

An IC card according to claim 1 wherein said circuit means comprises EPROM ICs and a portion of said resin sealant opposite each of said EPROM ICs is a transparent resin portion which appears on the surface of said IC card.

Claim 12

An IC card according to claim 1 wherein said circuit means comprises EPROM ICs having a transparent window and including a removable cover preventing transmission of ultraviolet rays disposed over said window.

Claim 13

An IC card according to claim 1 wherein at least a portion of said resin sealant is transparent so that said circuit means and said circuit board are visible through said sealant.

Claim 14

An IC card having a thickness comprising: a molded synthetic resin circumferential frame having opposed first and second surfaces and including a periphery having a thickness extending between the first and second surfaces corresponding to the thickness of said IC card and a circuit board supporting portion unitary with and integrally molded with said circumferential frame at and within said periphery and disposed intermediate the first and second surfaces of said frame; a circuit board supported by said circuit board supporting portion, having opposed third and fourth surfaces, and having an opening for the passage of resin sealant to the third and fourth surfaces during encapsulation of the IC card; electric circuit means disposed on at least one of said third and fourth surfaces including an I/O portion for supplying information to and receiving information from external equipment; and a resin sealant covering the third and fourth surfaces of said circuit board, hermetically encapsulating said electric circuit means, and having a thickness no greater than the thickness of said periphery, said resin sealing being disposed within said frame to form a card-like shape.

Claim 15

An IC card having a thickness comprising: a molded synthetic resin circumferential frame having opposed first and second surfaces and including a periphery having a thickness extending between the first and second surfaces corresponding to the thickness of said IC card and a circuit board supporting portion unitary with and integrally molded with said circumferential frame at and within said periphery and disposed intermediate the first and second surfaces of said frame; a circuit board supported by said circuit board supporting portion, having opposed third and fourth surfaces, and having an opening for the passage of resin sealant to the third and fourth surfaces during encapsulation of the IC card; electric circuit means disposed on at least one of said third and fourth surfaces including an I/O portion for supplying information to and receiving information from external equipment; and a resin sealant covering the third and fourth surfaces of said circuit board, hermetically encapsulating said electric circuit means, and having a thickness no greater than the thickness of said periphery, said resin sealing being disposed within said frame to form a card-like shape.

Claim 16

An IC card according to claim 13 wherein said I/O portion comprises communication means mounted on one of said third and fourth surfaces of said circuit board.

Claim 17

An IC card according to claim 14 wherein said communication means comprises at least one induction coil.

Claim 18

An IC card according to claim 13 wherein said IC card is a contact type IC card and said I/O portion comprises a terminal frame portion disposed on one of said first and second surfaces of surfaces of said circuit board and extending to a surface of said IC card and at least one electrode terminal electrically connected to said circuit means, disposed on said terminal frame portion, and appearing on the surface of said IC card.

Claim 19

An IC card according to claim 16 wherein said circuit board and said terminal frame portion respectively have at least one through hole and said at least one electrode terminal is electrically connected to said circuit means via said at least one through hole.

Claim 20

An IC card according to claim 13 wherein said board supporting portion of said frame comprises at least one extending supporting portion extending inwardly within said frame and supporting said circuit board and at least one conical supporting portion disposed on said extending supporting portion opposite said board supporting said circuit board.

Claim 21

An IC card according to claim 18 wherein said frame has a length and a width and said board supporting portion is disposed intermediate the length of said frame and extending across the width of said frame.

Claim 22

An IC card according to claim 18 wherein said board supporting portion comprises a plurality of said extending supporting portions, each of which has an end disposed centrally in said frame, at least one of said ends supporting the first surface of said circuit board and at least one of said ends supporting the second surface.

Claim 23

An IC card according to claim 13 including securing means for accurately positioning said circuit board with respect to said frame comprising at least two positioning pins and positioning holes formed in said board supporting portion.

Claim 24

An IC card according to claim 13 wherein said electric circuit means comprises EPROM ICs and a portion of said resin sealant opposite each of said EPROM ICs is transparent resin which appears on the surface of said IC card.

Claim 25

An IC card according to claim 13 wherein said circuit means comprises EPROM ICs having a transparent window and including a removable cover preventing transmission of ultraviolet rays disposed over said window.

Claim 26

An IC card according to claim 13 wherein at least a portion of said resin sealant is transparent so that said circuit means and said circuit board are visible through the sealant.

Claim 27

An IC card as claimed in claim 1 wherein said resin sealant has opposed, substantially planar fifth and sixth surfaces.

Claim 28

An IC card as claimed in claim 25 wherein the fifth and sixth surfaces of said resin sealant are not coplanar with said first and second surfaces, respectively.

Claim 29

An IC card as claimed in claim 25 wherein the fifth and sixth surfaces are coplanar with said first and second surfaces, respectively.