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Method of patterning aluminum containing group IIIb Element

Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1994-03-15
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Granted: 1996-12-03
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Expires: 2014-03-15
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Abstract

Abstract A thin film transistor according to this invention has a gate electrode comprising a lower layer of aluminum of a high purity of over 99.5% and an upper layer of aluminum containing over 0.5% silicon. Alternatively, it has a gate electrode made by adding a IIIa group element to a IIIb group element. Residues produced by the etching of the silicon-containing aluminum gate electrode are etched with a mixture solution of hydrofluoric acid, nitric acid and acetic acid. After contact holes have been formed in an interlayer insulating film, laser annealing is carried out, and metal electrodes are formed in the contact holes thereafter.

Inventors

  • 👤 Hongyong Zhang
  • 👤 Yasuhiko Takemura
  • 👤 Hideki Uochi
  • 👤 Itaru Koyama
  • 👤 Minoru Miyazaki
  • 👤 Akane Murakami
  • 👤 Toshimitsu Konuma
  • 👤 Akira Sugawara
  • 👤 Yukiko Uehara

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 11:49
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10P; H10P70/00; H10P70/20; H10P70/27; H10P70/273; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0314; H10D30/0321; H10D30/67; H10D30/6729; H10D30/6737; H10D30/6739; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01304; H10D64/01316; H10P50/00; H10P50/60; H10P50/66; H10P50/663; H10P50/667; Y; Y10; Y10S; Y10S148/00; Y10S148/051

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 49 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; patterning said aluminum film by etching; and removing a residue comprising said Group IIIb element produced by said patterning step.
Claim 2
Independent Claim 49 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; patterning said aluminum film by etching; and removing a residue comprising said Group IIIb element produced by said patterning step.
Claim 3
Dependent Claim 24 words
The method of claim 1, wherein said Group IIIb element is contained in said aluminum film at 0.05 wt % to 0.40 wt %.
Claim 4
Dependent Claim 24 words
The method of claim 1, wherein said Group IIIb element is selected from the group consisting of Sc, Y, a lanthanoid and an actinoid.
Claim 5
Independent Claim 58 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; patterning said aluminum film by etching; removing a residue comprising said Group IIIb element produced by said patterning step; and anodic oxidizing a surface of the patterned aluminum film.
Claim 6
Independent Claim 58 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; patterning said aluminum film by etching; removing a residue comprising said Group IIIb element produced by said patterning step; and anodic oxidizing a surface of the patterned aluminum film.
Claim 7
Dependent Claim 24 words
The method of claim 4, wherein said Group IIIb element is contained in said aluminum film at 0.05 wt % to 0.40 wt %.
Claim 8
Dependent Claim 24 words
The method of claim 4, wherein said Group IIIb element is selected from the group consisting of Sc, Y, a lanthanoid and an actinoid.
Claim 9
Independent Claim 54 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; forming a gate electrode by etching said aluminum film; and removing a residue comprising said Group IIIb element produced by said gate electrode forming step.
Claim 10
Independent Claim 54 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; forming a gate electrode by etching said aluminum film; and removing a residue comprising said Group IIIb element produced by said gate electrode forming step.
Claim 11
Dependent Claim 24 words
The method of claim 4, wherein said Group IIIb element is selected from the group consisting of Sc, Y, a lanthanoid and an actinoid.
Claim 12
Independent Claim 62 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; forming a gate electrode by etching said aluminum film; removing a residue comprising said Group IIIb element produced by said gate electrode forming step; and anodically oxidizing a surface of said gate electrode.
Claim 13
Independent Claim 62 words
A method of forming a transistor comprising: forming an aluminum film having a thickness of 2000 to 10000 Å and containing a Group IIIb element of the Periodic Table; forming a gate electrode by etching said aluminum film; removing a residue comprising said Group IIIb element produced by said gate electrode forming step; and anodically oxidizing a surface of said gate electrode.
Claim 14
Dependent Claim 24 words
The method of claim 9, wherein said Group IIIb element is contained in said aluminum film at 0.05 wt % to 0.40 wt %.
Claim 15
Dependent Claim 24 words
The method of claim 9, wherein said Group IIIb element is selected from the group consisting of Sc, Y, a lanthanoid and an actinoid.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-03 2000-06-03 2000-12-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-03 2004-06-03 2004-12-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-03 2008-06-03 2008-12-03 $7700.00 Window Closed / Lapsed

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