US5570273A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface mountable integrated circuit package with low-profile detachable module
Assignee: STMicroelectronics lnc USA
•
Filing: 1994-04-08
•
Granted: 1996-10-29
•
Expires: 2014-04-08
Abstract
Abstract A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The components may be disposed directly over the chip package or, in order to reduce the height of the package system, one or both of the components may be disposed outside of the outline of the chip package. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.
Inventors
- 👤 Harry M. Siegel
- 👤 Tom Q. Lao
- 👤 Krishnan Kelappan
- 👤 Michael J. Hundt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:58
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1092; H01; H01M; H01M50/00; H01M50/20; H01M50/204; H01M50/207; H01M50/216; H05K7/023; H10; H10W; H10W42/00; Y; Y02; Y02E; Y02E60/00; Y02E60/10
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
133 words
A system for packaging integrated circuit components, comprising: a chip package, comprising: a body containing a semiconductor device; a plurality of leads extending from said body, said leads in electrical connection with the semiconductor device, and of the type suitable for surface mounting to a circuit board; and first and second terminals in electrical connection with the semiconductor device, and extending from said body; and a component module disposed over said chip package, comprising: an auxiliary body, having a first portion containing a first auxiliary component; and first and second connectors in electrical connection with the first auxiliary component, and extending from said auxiliary body to electrically connect with said first and second terminals, respectively, of said chip package; wherein the first portion of the auxiliary body does not overlie the chip package.
Claim 2
Independent Claim
133 words
A system for packaging integrated circuit components, comprising: a chip package, comprising: a body containing a semiconductor device; a plurality of leads extending from said body, said leads in electrical connection with the semiconductor device, and of the type suitable for surface mounting to a circuit board; and first and second terminals in electrical connection with the semiconductor device, and extending from said body; and a component module disposed over said chip package, comprising: an auxiliary body, having a first portion containing a first auxiliary component; and first and second connectors in electrical connection with the first auxiliary component, and extending from said auxiliary body to electrically connect with said first and second terminals, respectively, of said chip package; wherein the first portion of the auxiliary body does not overlie the chip package.
Claim 3
Dependent Claim
15 words
The system of claim 1, wherein the body of said chip package comprises molded plastic.
Claim 4
Dependent Claim
12 words
The system of claim 1, wherein said auxiliary component comprises a battery.
Claim 5
Dependent Claim
66 words
The system of claim 1, wherein the body of said chip package comprises a lockout tab extending therefrom; and wherein the auxiliary body of said component module comprises a lockout tab extending therefrom at a location corresponding to the lockout tab extending from body of said chip package if the first connector of the component module is mated with the second terminal of the chip package.
Claim 6
Dependent Claim
21 words
The system of claim 1, wherein said first and second connectors are removably mated with said first and second terminals, respectively.
Claim 7
Dependent Claim
23 words
The system of claim 1, wherein said first and second terminals are disposed at opposite ends of said chip package from one another.
Claim 8
Dependent Claim
42 words
The system of claim 1, wherein said chip package further comprises third and fourth terminals extending from the body of said chip package; and wherein said component module further comprises third and fourth connectors mating with said third and fourth terminals, respectively.
Claim 9
Dependent Claim
21 words
The system of claim 7, wherein said first auxiliary component is a battery, electrically connected to said first and second connectors.
Claim 10
Dependent Claim
29 words
The system of claim 8, wherein said auxiliary body also comprises a second portion, said second portion containing a crystal resonator electrically connected to said third and fourth connectors.
Claim 11
Dependent Claim
20 words
The system of claim 8, wherein the second portion of said auxiliary body also does not overlie said chip package.
Claim 12
Dependent Claim
21 words
The system of claim 8, wherein the second portion of said auxiliary body containing said crystal oscillator overlies said chip package.
Claim 13
Dependent Claim
95 words
A component module adapted to be mounted to a chip package, comprising; a first auxiliary component; a body having a first portion for housing said first auxiliary component and having a second portion; and first and second connectors extending from said second portion of said body, said first and second connectors in electrical connection with said first auxiliary component and positioned on the body so that, upon mounting to the chip package, the first portion of the body does not overlie the chip package and the second portion of the body overlies the chip package.
Claim 14
Dependent Claim
95 words
A component module adapted to be mounted to a chip package, comprising; a first auxiliary component; a body having a first portion for housing said first auxiliary component and having a second portion; and first and second connectors extending from said second portion of said body, said first and second connectors in electrical connection with said first auxiliary component and positioned on the body so that, upon mounting to the chip package, the first portion of the body does not overlie the chip package and the second portion of the body overlies the chip package.
Claim 15
Dependent Claim
27 words
The component module of claim 12, further comprising: a plurality of snap members extending from said body, said snap members adapted to snap around the chip package.
Claim 16
Dependent Claim
92 words
A component module adapted to be mounted to a chip package, comprising: a battery; a body having a first portion for housing said battery and having a second portion that overlies the chip package after mounting thereto; and first and second connectors extending from said second portion of said body, said first and second connectors in electrical connection with said first auxiliary component; third and fourth connectors extending from said second portion of said body; and a crystal resonator disposed within said body in electrical connection with said third and fourth connectors.
Claim 17
Dependent Claim
92 words
A component module adapted to be mounted to a chip package, comprising: a battery; a body having a first portion for housing said battery and having a second portion that overlies the chip package after mounting thereto; and first and second connectors extending from said second portion of said body, said first and second connectors in electrical connection with said first auxiliary component; third and fourth connectors extending from said second portion of said body; and a crystal resonator disposed within said body in electrical connection with said third and fourth connectors.
Claim 18
Dependent Claim
19 words
The component module of claim 14, wherein said crystal resonator is disposed within said second portion of said body.
Claim 19
Dependent Claim
34 words
The component module of claim 14, wherein said body further comprises a third portion extending away from said second portion; and wherein said crystal resonator is disposed within said third portion of said body.
References Cited (Backward Citations)
US3501582A
Cited
US3650232A
Cited
US3762039A
Cited
US3891898A
Cited
US4107555A
Cited
US4169642A
Cited
US4149028A
Cited
US4422703A
Cited
US4646132A
Cited
DE3418363A1
Cited
US4935581A
Cited
US5131535A
Cited
USD317592S
Cited
US4920444A
Cited
US5130881A
Cited
US4868349A
Cited
US4992987A
Cited
US5119269A
Cited
EP0438905A2
Cited
US5038253A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-29 | 2000-04-29 | 2000-10-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-29 | 2004-04-29 | 2004-10-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-29 | 2008-04-29 | 2008-10-29 | $7700.00 | Window Closed / Lapsed |