IC package having replaceable backup battery

Claim 2

A premolded package as defined in claim 1, including: a replaceable battery removably disposed within said socket cavity, said replaceable battery having a first power terminal received within said battery interface cavity and engaged in electrical contact with said exposed conductive power lead and having a second power terminal, the externally projecting terminal contact portion of the other conductive power lead being releasably disposed in electrical contacting engagement with the second power terminal when said replaceable battery is loaded into said socket.

Claim 3

A premolded package as defined in claim 1, wherein said finger lead assembly includes a base plate, and one of said finger leads is electrically connected to said base plate, wherein said electronic circuit device includes a power node electrically coupled to said base plate.

Claim 4

A premolded package as defined in claim 1, said socket shoulder portion having a semi-cylindrical sidewall defining a side boundary of said socket cavity, and having a planar support surface abutting said cylindrical sidewall and defining a bottom boundary of said socket cavity, wherein said interface cavity intersects said planar support surface.

Claim 5

A premolded package as defined in claim 1, said body of non-conductive material having a notch formed on a sided edge thereof thereby defining a clearance opening through which the externally projecting terminal contact portion of said second power lead is extended for contacting engagement with a contact terminal of a backup battery.

Claim 6

A premolded package as defined in claim 1, said second power lead having an anchor tab portion extending transversely with respect to said second power lead and embedded within said body of non-conductive material.

Claim 7

A premolded package as defined in claim 1, including a conductive dimple formed on said first power lead and disposed within said battery interface cavity for electrical contacting engagement with a contact terminal of a backup battery.

Claim 8

A premolded package as defined in claim 1, wherein said finger lead assembly includes a base plate and one of said conductive finger leads is electrically connected to said base plate, wherein said electronic circuit device is an LSI integrated circuit implemented on a semiconductor chip, said integrated circuit having a plurality of input/output nodes and a plurality of wire conductors connecting said input/output nodes to said conductive finger leads, said integrated circuit chip being mounted onto said base plate.

Claim 9

A premolded package assembly having an encapsulated electronic circuit device and a socket for receiving a replaceable battery for providing electrical power to said encapsulated electronic circuit device comprising, in combination: a first body of non-conductive material having a support surface; a finger lead assembly mounted onto said support surface, said finger lead assembly having a plurality of conductive finger leads extending across said support surface, with one of said finger leads defining a negative power lead, and one of said finger leads defining a positive power lead having a terminal contact portion projecting externally of said first body of non-conductive material; a second body of non-conductive material assembled onto said first body of non-conductive material and confining said finger lead assembly therebetween, said second body of non-conductive material being intersected by a device cavity for receiving an electronic circuit device; an electronic circuit device disposed within said device cavity and having a plurality of input/output nodes electrically connected to said conductive finger leads; said second body of non-conductive material being intersected by a battery interface cavity thereby exposing one of said power leads in the interface between said first and second non-conductive bodies, and said second body of non-conductive material having shoulder portions defining a socket cavity in open alignment with said interface cavity for receiving a backup battery, wherein a first polarity contact terminal of a backup battery is insertable into said interface cavity in electrical contact with said first power lead when a backup battery is loaded into said socket cavity; and, the externally projecting terminal contact portion of said second conductive power lead being disposed for releasable electrical contacting engagement with the second polarity contact terminal of a backup battery when a backup battery is loaded into said socket cavity.

Claim 10

In an electronic circuit package of the type having a circuit device including multiple input/output nodes encapsulated within a body of non-conductive material, a plurality of connector pins mounted onto said body of non-conductive material and projecting externally thereof, and a plurality of conductive finger leads encapsulated within said body of non-conductive material electrically connecting said input/output nodes to said connector pins, the improvement comprising: a shoulder formed on said body of non-conductive material defining an external socket cavity for receiving a backup battery of the type having positive and negative polarity terminals, said body of non-conductive material being intersected by a battery interface cavity in open alignment with said battery socket cavity and exposing one of said conductive finger leads for electrically contacting engagement by a power terminal of a replaceable battery loaded within said external socket cavity; and, one of said conductive finger leads defining a second power lead having a terminal contact portion projecting externally of said body of non-conducting material, the externally projecting terminal contact portion of said second conductive power lead being disposed for releasable electrical contacting engagement with the second polarity contact terminal of a backup battery when a backup battery is loaded into said socket.

Claim 11

An integrated circuit package comprising, in combination: a first body of non-conductive material having a support surface; a finger lead assembly mounted onto said support surface, said finger lead assembly having a base plate, and a plurality of conductive finger leads extending across said support surface, with one of said finger leads defining a first power lead, and one of said finger leads defining a second power lead having a terminal contact portion projecting externally of said first body of non-conductive material; a second body of non-conductive material having a chip cavity for receiving an integrated circuit chip device, said second body being assembled onto said first body with said chip cavity providing a clearance opening about said base plate; an integrated circuit chip mounted onto said base plate and received within the clearance opening of said chip cavity, said integrated circuit chip having a plurality of input/output nodes and a plurality of wire conductors connecting said input/output nodes to said conductive finger leads; said second body of non-conductive material having a battery interface cavity providing an access opening to said first conductive power lead and having shoulder portions defining a socket cavity in open alignment with said interface cavity for receiving a backup battery, wherein a first polarity contact terminal of a backup battery is insertable into said interface cavity in electrical contact with said first power lead when a backup battery is loaded into said socket; and, the externally projecting terminal contact portion of said second conductive power lead being disposed for releasable electrical contacting engagement with the second polarity contact terminal of a backup battery when a backup battery is loaded into said socket.

Claim 12

An integrated circuit package as defined in claim 11, wherein one of said power leads is attached to said base plate, and wherein said integrated circuit chip includes a substrate which is bonded onto said base plate.

Claim 13

An integrated circuit package as defined in claims 11, one of said socket shoulder portions having a semi-cylindrical sidewall defining a side boundary of said socket cavity, and said second body of non-conductive material having a planar support surface abutting said cylindrical sidewall and defining a bottom boundary of said socket cavity, wherein said interface cavity intersects said planar support surface and said second body of non-conductive material.

Claim 14

An integrated circuit package as defined in claim 11, said second body of non-conductive material having a notch formed on a side edge thereof thereby defining a clearance opening through which the externally projecting terminal contact portion of said second power lead is extended for contacting engagement with the second polarity contact terminal of a backup battery.

Claim 15

An integrated circuit package as defined in claim 11, said second power lead having an anchor tab portion extending transversely with respect to said second power lead and embedded within said first body of non-conductive material.

Claim 16

An integrated circuit package as defined in claim 11, including a conductive dimple formed on said first power lead and disposed within said battery interface cavity for electrical contacting engagement with the first polarity contact terminal of a backup battery.

Claim 17

An integrated circuit package as defined in claim 11, wherein said first and second non-conductive bodies are assembled together with said finger lead assembly disposed therebetween, including a deposit of insulating material in said chip cavity for sealing said integrated circuit chip and the exposed finger leads within said chip cavity.

Claim 18

An integrated circuit package as defined in claim 11, including: a backup battery received within said socket, said backup battery having a first polarity contact terminal received within said battery interface cavity and engaged in electrical contact with said first conductive power lead, and having a second polarity contact terminal disposed in electrical contact engagement with the externally projecting terminal contact portion of said second conductive power lead.