Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
98 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: an integrated circuit chip; a built-in self test circuit integrally formed within said integrated circuit chip, said built-in self test circuit performing an operational test on said integrated circuit chip; and visible indicator means coupled to said built-in self test circuit which becomes activated when said built-in self test circuit senses a failure of said intergrated circuit when power is supplied thereto, said visible indicator means being formed as an integral part of a packaging for said intergrated circuit chip.
Claim 2
Dependent Claim
98 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: an integrated circuit chip; a built-in self test circuit integrally formed within said integrated circuit chip, said built-in self test circuit performing an operational test on said integrated circuit chip; and visible indicator means coupled to said built-in self test circuit which becomes activated when said built-in self test circuit senses a failure of said intergrated circuit when power is supplied thereto, said visible indicator means being formed as an integral part of a packaging for said intergrated circuit chip.
Claim 3
Dependent Claim
38 words
The apparatus as defined by claim 1 wherein said built-in self test circuit generates an electrical output signal upon sensing said failure and wherein said visible indicator means is responsive to and becomes activated by said output signal.
Claim 4
Dependent Claim
20 words
The apparatus as defined by claim 2 wherein said visible indicator means comprises a light emitting device producing visible emissions.
Claim 5
Dependent Claim
20 words
The apparatus as defined by claim 3 wherein said light emitting device comprises a light emitting diode producing visible emissions.
Claim 6
Dependent Claim
27 words
The apparatus as defined by claim 2 wherein said visible indicator means includes material which permanently changes appearance upon being activated in response to said output signal.
Claim 7
Dependent Claim
132 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: an integrated circuit chip; a built-in self test circuit integrally formed within said integrated circuit chip, said built-in self test circuit performing an operational test on said integrated circuit chip and generating an electrical output signal upon sensing a failure of said integrated circuit chip; and visible indicator means, coupled to said built-in self test circuit and responsive to said electrical output signal, for indicating the failure of said integrated circuit chip when power is supplied thereto, said visible indicator means including fusible material which becomes activated and changes appearance in response to said electrical output signal, said fusible material being formed as an integral part of a packaging for said integrated circuit chip.
Claim 8
Dependent Claim
132 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: an integrated circuit chip; a built-in self test circuit integrally formed within said integrated circuit chip, said built-in self test circuit performing an operational test on said integrated circuit chip and generating an electrical output signal upon sensing a failure of said integrated circuit chip; and visible indicator means, coupled to said built-in self test circuit and responsive to said electrical output signal, for indicating the failure of said integrated circuit chip when power is supplied thereto, said visible indicator means including fusible material which becomes activated and changes appearance in response to said electrical output signal, said fusible material being formed as an integral part of a packaging for said integrated circuit chip.
Claim 9
Dependent Claim
105 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: a multi-intergrated circuit chip module having a plurality of intergrated circuit chips; a built-in self test circuit integrally formed within said multi-chip module, said built-in self test circuit performing an operational test on said integrated circuit chips; and visible indicator means coupled to said built-in self test circuit which becomes activated when said built-in self test circuit senses a failure of said intergrated circuit chips when power is supplied thereto, said visible indicator means being formed as an integral part of a packaging for said multi-chip module.
Claim 10
Dependent Claim
105 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: a multi-intergrated circuit chip module having a plurality of intergrated circuit chips; a built-in self test circuit integrally formed within said multi-chip module, said built-in self test circuit performing an operational test on said integrated circuit chips; and visible indicator means coupled to said built-in self test circuit which becomes activated when said built-in self test circuit senses a failure of said intergrated circuit chips when power is supplied thereto, said visible indicator means being formed as an integral part of a packaging for said multi-chip module.
Claim 11
Dependent Claim
38 words
The apparatus as defined by claim 7 wherein said built-in self test circuit generates an electrical output signal upon sensing said failure and wherein said visible indicator means is responsive to and becomes activated by said output signal.
Claim 12
Dependent Claim
20 words
The apparatus as defined by claim 8 wherein said visible indicator means comprises a light emitting device producing visible emissions.
Claim 13
Dependent Claim
20 words
The apparatus as defined by claim 9 wherein said light emitting device comprises a light emitting diode producing visible emissions.
Claim 14
Dependent Claim
27 words
The apparatus as defined by claim 8 wherein said visible indicator means includes material which permanently changes appearance upon being activated in response to said output signal.
Claim 15
Dependent Claim
136 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: a multi-chip module having a plurality of integrated circuit chips: a built-in self test circuit integrally formed within said multi-chip module, said built-in self test circuit performing an operational test on said integrated circuit chips and generating an electrical output signal upon sensing a failure of said integrated circuit chips; and visible indicator means, coupled to said built-in self test circuit and responsive to said electrical output signal, for indicating the failure of said integrated circuit chips when power is supplied thereto, said visible indicator means including fusible material which becomes activated and changes appearance in response to said electrical output signal said fusible material being formed as an integral part of a packaging for said multi-chip module.
Claim 16
Dependent Claim
136 words
A built-in self test apparatus for providing a visible indication of a failure of an electronic circuit, comprising: a multi-chip module having a plurality of integrated circuit chips: a built-in self test circuit integrally formed within said multi-chip module, said built-in self test circuit performing an operational test on said integrated circuit chips and generating an electrical output signal upon sensing a failure of said integrated circuit chips; and visible indicator means, coupled to said built-in self test circuit and responsive to said electrical output signal, for indicating the failure of said integrated circuit chips when power is supplied thereto, said visible indicator means including fusible material which becomes activated and changes appearance in response to said electrical output signal said fusible material being formed as an integral part of a packaging for said multi-chip module.