Patent US5568683A successfully refreshed from Google Patents.
US5568683A
Expired / Lapsed
US
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Method of cooling a packaged electronic device
Assignee: APPLIED PHOTONIC DEVICES Inc
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Filing: 1995-06-07
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Granted: 1996-10-29
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Expires: 2015-06-07
Abstract
Abstract A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.
Inventors
- 👤 Chok J. Chia
- 👤 Manian Alagaratnam
- 👤 Qwai H. Low
- 👤 Seng-Sooi Lim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:15
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; F; F02; F02F; F02F7/00; H10W40/20; H10W40/22; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
157 words
A method of cooling a packaged electronic device, comprising the steps of: (a) providing the packaged electronic device; (b) providing a heatsink assembly, including: a removable heatsink unit having at least one fin and a coupling collar; and a heatspreader having a platform, at least one tab and an inner collar, said platform being attached to said inner collar and said tab being disposed along the periphery of said platform; (c) mounting said heatspreader on the packaged electronic device such that said heatspreader is in thermal contact with the packaged electronic device; and (d) removably coupling said heatsink unit to said heatspreader such that said heatspreader receives a portion of said coupling collar of said heatsink unit within said tab, and when said heatsink unit is turned, said coupling collar removably engages said platform of said heatspreader; whereby said heatsink assembly radiates heat away from the packaged electronic device, and the packaged electronic device is thereby cooled.
Claim 2
Independent Claim
157 words
A method of cooling a packaged electronic device, comprising the steps of: (a) providing the packaged electronic device; (b) providing a heatsink assembly, including: a removable heatsink unit having at least one fin and a coupling collar; and a heatspreader having a platform, at least one tab and an inner collar, said platform being attached to said inner collar and said tab being disposed along the periphery of said platform; (c) mounting said heatspreader on the packaged electronic device such that said heatspreader is in thermal contact with the packaged electronic device; and (d) removably coupling said heatsink unit to said heatspreader such that said heatspreader receives a portion of said coupling collar of said heatsink unit within said tab, and when said heatsink unit is turned, said coupling collar removably engages said platform of said heatspreader; whereby said heatsink assembly radiates heat away from the packaged electronic device, and the packaged electronic device is thereby cooled.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein step (a) comprises providing the packaged electronic device as being comprised of a plastic material.
Claim 4
Dependent Claim
31 words
The method of claim 1 wherein step (c) comprises mounting said heatspreader on the packaged electronic device such that a portion of said heatspreader is disposed within the packaged electronic device.
Claim 5
Dependent Claim
26 words
The method of claim 1 wherein step (b) comprises providing said heatsink assembly such that said coupling collar of said heatsink unit is comprised of copper.
Claim 6
Dependent Claim
25 words
The method of claim 1 wherein step (b) comprises providing said heatsink assembly such that said inner collar of said heatspreader is comprised of copper.
Claim 7
Dependent Claim
25 words
The method of claim 1 wherein step (b) comprises providing said heatsink assembly such that said fin of said heatsink unit is comprised of aluminum.
Claim 8
Dependent Claim
32 words
The method of claim 1 wherein step (b) comprises providing said heatsink assembly such that said coupling collar of said heatsink unit and said platform of said heatspreader are circular in shape.
Claim 9
Dependent Claim
19 words
The method of claim 1 wherein step (a) comprises providing the packaged electronic device as including an integrated circuit.
Claim 10
Dependent Claim
26 words
The method of claim 1, further comprising the steps of: (e) providing a circuit board; and (f) mounting the packaged electronic device on the circuit board.
Claim 11
Dependent Claim
33 words
The method of claim 1 wherein step (b) comprises providing said heatsink assembly such that said portion of said coupling collar of said heatsink unit comprises a flange having an inner coupling groove.
Claim 12
Dependent Claim
40 words
The method of claim 10 wherein step (d) comprises engaging said flange with said tab such that said inner coupling groove within said flange tightens about said platform as said heatsink unit is turned while said flange engages said tab.
Claim 13
Dependent Claim
23 words
The method of claim 10 wherein step (b) comprises providing said heatsink assembly such that said inner coupling groove has a ramp-like surface.
Claim 14
Dependent Claim
51 words
The method of claim 10 wherein step (b) comprises providing said heatsink assembly such that said coupling collar includes two of said flanges, each of said flanges having an inner coupling groove, and further wherein said heatspreader includes two tabs, each of said tabs adapted for receiving one of said flanges.
Claim 15
Dependent Claim
39 words
The method of claim 13 wherein step (b) comprises providing said heatsink assembly such that said two flanges are arranged on opposite sides of said coupling collar and said two tabs are arranged on opposite sides of said platform.
Claim 16
Independent Claim
166 words
A method of cooling a packaged electronic device, comprising the steps of: (a) providing the packaged electronic device; (b) providing a heatsink assembly for radiating heat away from the packaged electronic device, including: a removable heatsink unit having at least one fin and a coupling collar; a heatspreader having a platform, at least one tab and an inner collar, said platform being attached to said inner collar and said tab being disposed along the periphery of said platform; (c) attaching said heatspreader to and in thermal contact with the packaged electronic device; (d) inserting a portion of said coupling collar of said heatsink unit within said tab; (e) turning said heatsink unit such that said coupling collar removably engages said platform of said heatspreader, thereby removably coupling said heatsink unit to said heatspreader; and (f) exposing the packaged electronic device and said heatsink assembly to an atmosphere into which said heatsink assembly radiates heat away from the packaged electronic device, thereby cooling the packaged electronic device.
Claim 17
Independent Claim
166 words
A method of cooling a packaged electronic device, comprising the steps of: (a) providing the packaged electronic device; (b) providing a heatsink assembly for radiating heat away from the packaged electronic device, including: a removable heatsink unit having at least one fin and a coupling collar; a heatspreader having a platform, at least one tab and an inner collar, said platform being attached to said inner collar and said tab being disposed along the periphery of said platform; (c) attaching said heatspreader to and in thermal contact with the packaged electronic device; (d) inserting a portion of said coupling collar of said heatsink unit within said tab; (e) turning said heatsink unit such that said coupling collar removably engages said platform of said heatspreader, thereby removably coupling said heatsink unit to said heatspreader; and (f) exposing the packaged electronic device and said heatsink assembly to an atmosphere into which said heatsink assembly radiates heat away from the packaged electronic device, thereby cooling the packaged electronic device.
Claim 18
Dependent Claim
19 words
The method of claim 15, wherein step (a) comprises providing the packaged electronic device as comprising a plastic material.
Claim 19
Dependent Claim
20 words
The method of claim 15, wherein step (c) comprises disposing a portion of said heatspreader within the packaged electronic device.
Claim 20
Dependent Claim
20 words
The method of claim 15, wherein step (b) comprises providing said coupling collar of said heatsink unit as comprising copper.
Claim 21
Dependent Claim
19 words
The method of claim 15, wherein step (b) comprises providing said inner collar of said heatspreader as comprising copper.
Claim 22
Dependent Claim
19 words
The method of claim 15, wherein step (b) comprises providing said fin of said heatsink unit as comprising aluminum.
Claim 23
Dependent Claim
28 words
The method of claim 15, wherein step (b) comprises providing said coupling collar of said heatsink unit and said platform of said heatspreader as being circular in shape.
Claim 24
Dependent Claim
19 words
The method of claim 15, wherein step (a) comprises providing the packaged electronic device as comprising an integrated circuit.
Claim 25
Dependent Claim
20 words
The method of claim 15, further comprising the step of: (f) mounting the packaged electronic device on a circuit board.
Claim 26
Dependent Claim
29 words
The method of claim 15, wherein step (b) comprises providing said portion of said coupling collar of said heatsink unit as comprising a flange having an inner coupling groove.
Claim 27
Dependent Claim
38 words
The method of claim 24, wherein step (e) comprises turning said heatsink unit such that said flange engages said tab, and said inner coupling groove within said flange tightens about said platform while said flange engages said tab.
Claim 28
Dependent Claim
19 words
The method of claim 24, wherein step (b) comprises providing said inner coupling groove as having a ramp-like surface.
Claim 29
Dependent Claim
47 words
The method of claim 24, wherein step (b) comprises providing said coupling collar as including two of said flanges, each of said flanges having an inner coupling groove, and further wherein said heatspreader includes two tabs, each of said tabs adapted for receiving one of said flanges.
Claim 30
Dependent Claim
35 words
The method of claim 27, wherein step (b) comprises providing said two flanges as being arranged on opposite sides of said coupling collar and said two tabs are arranged on opposite sides of said platform.
References Cited (Backward Citations)
US4594643A
Cited
US4660123A
Cited
US4879632A
Cited
US4716494A
Cited
US5019940A
Cited
JPH04107985A
Cited
US5132875A
Cited
US5191511A
Cited
US5257162A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-29 | 2000-04-29 | 2000-10-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-29 | 2004-04-29 | 2004-10-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-29 | 2008-04-29 | 2008-10-29 | $7700.00 | Window Closed / Lapsed |