US5567880A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor accelerometer
Assignee: Hitachi Ltd
•
Filing: 1993-05-14
•
Granted: 1996-10-22
•
Expires: 2013-05-14
Abstract
Abstract A semiconductor accelerometer includes a mass portion formed at a center of a silicon plate, a frame portion formed around the circumference of the silicon plate so as to surround the mass portion and a diaphragm portion formed in the silicon plate between the mass portion and the frame portion so as to bridge the mass portion with the frame portion, one of major surfaces of the silicon plate serving as a common continuous major surface for the mass portion, frame portion and diaphragm portion. Piezoresistance elements are formed on the common continuous major surface at the diaphraqm portion and an additional Au film is formed on the common continuous major surface at the mass portion. The additional Au film constitutes in combination with the mass portion a weight which responds to an acceleration acting thereon. The mass of the additional Au film is selected in such a manner that the center of gravity of the weight is located within an area in the mass portion having a depth corresponding to the thickness of the diaphragm portion.
Inventors
- 👤 Yoshihiro Yokota
- 👤 Shotaro Naito
- 👤 Toshihiko Suzuki
- 👤 Akira Koide
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:26
CPC Classifications
G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/12; G01P15/123; G01P15/125; G01P15/18; H; H10; H10N; H10N39/00; G01P2015/0805; G01P2015/0822; G01P2015/0825; G01P2015/0828; G01P2015/084; G01P2015/0842
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
249 words
A semiconductor accelerometer comprising: a mass portion formed at a center of a silicon plate having two major surfaces; a frame portion formed around the circumference of the silicon plate so as to surround said mass portion; a diaphragm portion formed in the silicon plate between said mass portion and said frame portion so as to bridge said mass portion with said frame portion, one of said two major surfaces of the silicon plate serving as a common planar major surface for said mass portion, said frame portion and said diaphragm portion; piezoresistance elements formed on the common planar major surface at said diaphragm portion; an additional metal film having a higher density than that of the silicon plate formed on the common planar major surface at said mass portion; and a further additional metal film having a higher density than that of the silicon plate formed on said mass portion on the other of said two major surfaces of said silicon plate, said additional metal film and said further additional metal film constituting in combination with said mass portion of the silicon plate a weight which responds to an acceleration acting thereon, and the mass of said additional metal film and said further additional film being selected in such a manner that the center of gravity of the weight is located within an area in said mass portion having a depth corresponding to the thickness of said diaphragm portion and defined by an extension of said diaphragm portion.
Claim 2
Dependent Claim
249 words
A semiconductor accelerometer comprising: a mass portion formed at a center of a silicon plate having two major surfaces; a frame portion formed around the circumference of the silicon plate so as to surround said mass portion; a diaphragm portion formed in the silicon plate between said mass portion and said frame portion so as to bridge said mass portion with said frame portion, one of said two major surfaces of the silicon plate serving as a common planar major surface for said mass portion, said frame portion and said diaphragm portion; piezoresistance elements formed on the common planar major surface at said diaphragm portion; an additional metal film having a higher density than that of the silicon plate formed on the common planar major surface at said mass portion; and a further additional metal film having a higher density than that of the silicon plate formed on said mass portion on the other of said two major surfaces of said silicon plate, said additional metal film and said further additional metal film constituting in combination with said mass portion of the silicon plate a weight which responds to an acceleration acting thereon, and the mass of said additional metal film and said further additional film being selected in such a manner that the center of gravity of the weight is located within an area in said mass portion having a depth corresponding to the thickness of said diaphragm portion and defined by an extension of said diaphragm portion.
Claim 3
Dependent Claim
16 words
A semiconductor accelerometer according to claim 1, wherein said additional metal film is made of Au.
Claim 4
Dependent Claim
34 words
A semiconductor accelerometer according to claim 1, further comprising: a plurality of communicating holes formed at said diaphragm portion, said communicating holes extending between spaces separated by said diaphragm portion and said mass portion.
Claim 5
Dependent Claim
27 words
A semiconductor accelerometer according to claim 1, wherein said diaphragm portion where the piezoresistance elements are formed is reinforced by increasing the thickness of said diaphragm portion.
Claim 6
Dependent Claim
237 words
A semiconductor accelerometer comprising: a mass portion formed at a center of a silicon plate having two major surfaces; a frame portion formed around the circumference of the silicon plate so as to surround said mass portion; a supporting portion formed in the silicon plate between said mass portion and said frame portion so as to bridge said mass portion with said frame portion, one of said two major surfaces of said silicon plate serving as a common planar major surface for said mass portion, said frame portion and said supporting portion; an additional metal film having a higher density than that of the silicon plate formed on the common planar major surface at said mass portion; and a further additional metal film having a higher density than that of the silicon plate formed on said mass portion on the other of said two major surfaces of said silicon plate, said additional metal film and said further additional metal film constituting in combination with said mass portion of the silicon plate a weight which responds to an acceleration acting thereon, and the mass of said additional metal film and said further additional metal film being selected in such a manner that the center of gravity of the weight is located within an area in said mass portion having a depth corresponding to the thickness of said supporting portion and defined by an extension of said supporting portion.
Claim 7
Dependent Claim
237 words
A semiconductor accelerometer comprising: a mass portion formed at a center of a silicon plate having two major surfaces; a frame portion formed around the circumference of the silicon plate so as to surround said mass portion; a supporting portion formed in the silicon plate between said mass portion and said frame portion so as to bridge said mass portion with said frame portion, one of said two major surfaces of said silicon plate serving as a common planar major surface for said mass portion, said frame portion and said supporting portion; an additional metal film having a higher density than that of the silicon plate formed on the common planar major surface at said mass portion; and a further additional metal film having a higher density than that of the silicon plate formed on said mass portion on the other of said two major surfaces of said silicon plate, said additional metal film and said further additional metal film constituting in combination with said mass portion of the silicon plate a weight which responds to an acceleration acting thereon, and the mass of said additional metal film and said further additional metal film being selected in such a manner that the center of gravity of the weight is located within an area in said mass portion having a depth corresponding to the thickness of said supporting portion and defined by an extension of said supporting portion.
References Cited (Backward Citations)
DE3507820A1
Cited
US4706374A
Cited
US4670092A
Cited
US5195371A
Cited
JPH01285863A
Cited
US4951510A
Cited
US5095752A
Cited
EP0369352A1
Cited
US4987781A
Cited
EP0401635A2
Cited
JPH03107767A
Cited
JPH03214064A
Cited
US5239870A
Cited
US5265474A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-22 | 2000-04-22 | 2000-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-22 | 2004-04-22 | 2004-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-22 | 2008-04-22 | 2008-10-22 | $7700.00 | Window Closed / Lapsed |