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US5550675A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor light receiving apparatus

Assignee: Renesas Electronics Corp
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Filing: 1994-09-22
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Granted: 1996-08-27
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Expires: 2014-09-22
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Abstract

Abstract It is the object of the invention to suppress noises caused by reflections of a ray of light from a light receiving surface of a photodiode chip and inner and outer surfaces of a glass in a semiconductor light receiving apparatus. A construction of a light receiving apparatus is that, a photodiode chip 4 is mounted on a carrier 2 fixed to a stem 1, and a chip 4 is sealed up by a cap 7, which is provided with an opening 7a covered with glass 8. A ray of light transmits through an opening 7a, and incidents on a light receiving surface of a chip 4. A light receiving surface of a chip 4 and an outer surface of a glass 8 are inclined to the optical axis, where directions of inclinations are different to each other. An angle of inclination of a chip 4 is selected such that reflected rays from a chip 4 does not incident on an opening 7a. Accordingly, there is no ray which returns to a light source (not shown), and generation of delayed incidences to a chip 4 can be prevented.

Inventors

  • 👤 Nobuko Komatsu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 20:46
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10F77/40; H10F77/407

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 115 words
A semiconductor light receiving apparatus, comprising: a light receiving chip mounted on a carrier and having a light axis; a cap for containing the chip and having an opening on the light axis; a transparent plate for transmitting light along the light axis, the transparent plate being sealingly fixed to the cap to close the cap's opening; and a stem for sealingly placing the cap thereon, to enclose the chip; wherein: a light receiving surface of the chip is inclined in a first direction to the light axis; and an outer surface of the transparent plate is inclined in a second direction to the light axis, which second direction is opposite to the first direction.
Claim 2
Dependent Claim 115 words
A semiconductor light receiving apparatus, comprising: a light receiving chip mounted on a carrier and having a light axis; a cap for containing the chip and having an opening on the light axis; a transparent plate for transmitting light along the light axis, the transparent plate being sealingly fixed to the cap to close the cap's opening; and a stem for sealingly placing the cap thereon, to enclose the chip; wherein: a light receiving surface of the chip is inclined in a first direction to the light axis; and an outer surface of the transparent plate is inclined in a second direction to the light axis, which second direction is opposite to the first direction.
Claim 3
Dependent Claim 27 words
The apparatus of claim 1, wherein: an inclination angle of the transparent plate's outer surface is smaller than an inclination angle of the chip's light receiving surface.
Claim 4
Dependent Claim 33 words
The apparatus of claim 1, wherein: an inclination angle of the chip's light receiving surface is determined such that reflected light from the light receiving surface is not incident on the cap's opening.
Claim 5
Dependent Claim 161 words
A semiconductor light receiving apparatus, comprising: a light receiving chip mounted on a carrier and having a light axis; a cap for containing the chip and having an opening on the light axis; a transparent plate for transmitting light along the light axis, the transparent plate being sealingly fixed to the cap to close the cap's opening; and a stem for sealingly placing the cap thereon to enclose the chip; wherein: a light receiving surface of the chip is inclined in a first direction to the light axis; an outer surface of the transparent plate is inclined in a second direction to the light axis, which second direction is opposite to the first direction; an inclination angle of the transparent plate's outer surface is smaller than an inclination angle of the chip's light receiving surface; and the chip's light receiving surface inclination angle is determined such that light reflected from the light receiving surface is not incident on the cap's opening.
Claim 6
Dependent Claim 161 words
A semiconductor light receiving apparatus, comprising: a light receiving chip mounted on a carrier and having a light axis; a cap for containing the chip and having an opening on the light axis; a transparent plate for transmitting light along the light axis, the transparent plate being sealingly fixed to the cap to close the cap's opening; and a stem for sealingly placing the cap thereon to enclose the chip; wherein: a light receiving surface of the chip is inclined in a first direction to the light axis; an outer surface of the transparent plate is inclined in a second direction to the light axis, which second direction is opposite to the first direction; an inclination angle of the transparent plate's outer surface is smaller than an inclination angle of the chip's light receiving surface; and the chip's light receiving surface inclination angle is determined such that light reflected from the light receiving surface is not incident on the cap's opening.
Claim 7
Dependent Claim 138 words
A semiconductor light receiving apparatus, comprising: a light receiving chip mounted on a carrier and having a light axis; a cap for containing the chip and having an opening on the light axis; a transparent plate for transmitting light along the light axis, the transparent plate being sealingly fixed to the cap to close the cap's opening; and a stem for sealingly placing the cap thereon to enclose the chip; wherein: a light receiving surface of the chip is inclined in a first direction to the light axis with an inclination angle which is determined such that reflected light from the light receiving surface is not incident on the cap's opening; an outer surface of the transparent plate is inclined in a second direction to the light axis; and said first direction is opposite to said second direction.
Claim 8
Dependent Claim 138 words
A semiconductor light receiving apparatus, comprising: a light receiving chip mounted on a carrier and having a light axis; a cap for containing the chip and having an opening on the light axis; a transparent plate for transmitting light along the light axis, the transparent plate being sealingly fixed to the cap to close the cap's opening; and a stem for sealingly placing the cap thereon to enclose the chip; wherein: a light receiving surface of the chip is inclined in a first direction to the light axis with an inclination angle which is determined such that reflected light from the light receiving surface is not incident on the cap's opening; an outer surface of the transparent plate is inclined in a second direction to the light axis; and said first direction is opposite to said second direction.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-08-27 2000-02-26 2000-08-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-08-27 2004-02-26 2004-08-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-08-27 2008-02-26 2008-08-27 $7700.00 Window Closed / Lapsed

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