US5033052A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optical semiconductor device and production method thereof
Assignee: Fujitsu Ltd
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Filing: 1989-03-22
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Granted: 1991-07-16
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Expires: 2009-03-22
Abstract
Abstract In an optical semiconductor device which comprises a mount (52a) for holding an optical semiconductor element (40) and a lens holder (54a) which holds a lens (50) for converting a beam shape of a light emitted from the optical semiconductor element (40) and is fixed to the mount (52a) and a production method thereof wherein at least one of locations for shrinkage by laser irradiation (58a) are provided at least on one of the mount (52a) and the lens holder (54a), and the relative positions of the optical semiconductor element (40) and the lens (50) are adjustable in any desired direction by a laser irradiation on the location for shrinkage by laser irradiation (58a).
Inventors
- 👤 Takayuki Masuko
- 👤 Kaoru Moriya
- 👤 Hiroki Okushima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:42
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/422; G02B6/4226; G02B6/4204; H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/02326; H01S5/005; H01S5/0225; H01S5/02251
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
90 words
An optical semiconductor device, comprising: a mount for holding an optical semiconductor element; a lens holder which holds a lens for converting a beam shape of light emitted from the optical semiconductor element and is fixed to said mount; and at least one location for shrinkage by laser irradiation provided on at least one of said mount and said lens holder, whereby relative positions of the optical semiconductor element and the lens are positively adjustable in any desired direction by laser irradiation on said location for shrinkage by laser irradiation.
Claim 2
Dependent Claim
90 words
An optical semiconductor device, comprising: a mount for holding an optical semiconductor element; a lens holder which holds a lens for converting a beam shape of light emitted from the optical semiconductor element and is fixed to said mount; and at least one location for shrinkage by laser irradiation provided on at least one of said mount and said lens holder, whereby relative positions of the optical semiconductor element and the lens are positively adjustable in any desired direction by laser irradiation on said location for shrinkage by laser irradiation.
Claim 3
Dependent Claim
78 words
The optical semiconductor device as claimed in claim 1, characterized in that said lens holder includes a raised portion which is defined by a pair of slits, said location for shrinkage by laser irradiation is provided at a base portion of said slits, and the relative positions of the optical semiconductor element and the lens are adjustable in a direction of an optical axis of the lens by laser irradiation on said location for shrinkage by laser irradiation.
Claim 4
Dependent Claim
22 words
The optical semiconductor device as claimed in claim 1, characterized in that said location for shrinkage by laser irradiation is a groove.
Claim 5
Dependent Claim
60 words
The optical semiconductor device as claimed in claim 3, characterized in that said groove has an approximate V-shape and is provided is said lens holder, and the relative positions of the optical semiconductor element and the lens are adjustable in a direction along an optical axis of the lens by laser irradiation on said location for shrinkage by laser irradiation.
Claim 6
Dependent Claim
92 words
The optical semiconductor device as claimed in claim 1, characterized in that there is further provided a hole which is provided in at least one of said mount and said lens holder and has a shape with a corner, said location for shrinkage by laser irradiation is provided at an arbitrary corner portion of said hole, and the relative positions of the optical semiconductor element and the lens are adjustable in a direction perpendicular to an optical axis of the lens by laser irradiation on said location for shrinkage by laser irradiation.
Claim 7
Dependent Claim
107 words
The optical semiconductor device as claimed in claim 1, characterized in that said lens holder comprises a plurality of plate pairs which are connected with each plate pair having plates which are connected at base portions thereof to form an approximate V-shape, said lens is fixed to one plate of an arbitrary plate pair, said location for shrinkage by laser irradiation is provided at a base portion of each plate pair, and the relative positions of the optical semiconductor element and the lens are adjustable in a direction perpendicular to an optical axis of the lens by laser irradiation on said location for shrinkage by laser irradiation.
Claim 8
Dependent Claim
51 words
The optical semiconductor device as claimed in claim 1, characterized in that there is further provided a package structure for sealing said mount and said lens holder, and said package structure has a window for laser irradiation provided at a portion in correspondence with said location for shrinkage by laser irradiation.
Claim 9
Dependent Claim
36 words
The optical semiconductor device as claimed in claim 7, characterized in that said window for laser irradiation is commonly used as a window for an outgoing light beam which is emitted from the optical semiconductor element.
Claim 10
Dependent Claim
94 words
An optical semiconductor device production method characterized in that there are included a first step of fixing a mount which holds an optical semiconductor element on a lens holder which holds a lens for converting a beam shape of light emitted from the optical semiconductor element, and a second step of irradiating a laser beam on at least one location for shrinkage by laser irradiation provided on at least one of said mount and said lens holder to positively adjust relative positions of the optical semiconductor element and the lens in any desired direction.
Claim 11
Dependent Claim
94 words
An optical semiconductor device production method characterized in that there are included a first step of fixing a mount which holds an optical semiconductor element on a lens holder which holds a lens for converting a beam shape of light emitted from the optical semiconductor element, and a second step of irradiating a laser beam on at least one location for shrinkage by laser irradiation provided on at least one of said mount and said lens holder to positively adjust relative positions of the optical semiconductor element and the lens in any desired direction.
Claim 12
Dependent Claim
85 words
The optical semiconductor device production method as claimed in claim 9, characterized in that said first step adjusts the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis of the lens and fixes said lens holder on said mount by laser welding, and said second step adjusts the relative positions of the optical semiconductor element and the lens in the direction of said optical axis by laser irradiation on said location for shrinkage by laser Irradiation.
Claim 13
Dependent Claim
86 words
The optical semiconductor device production method as claimed in claim 9, characterized in that said first step adjusts the relative positions of the optical semiconductor element and the lens in a direction of an optical axis of the lens and fixes said lens holder on said mount by a laser welding, and said second step adjusts the relative positions of the optical semiconductor element and the lens in a direction perpendicular to said optical axis by laser irradiation on said location for shrinkage by laser irradiation.
Claim 14
Dependent Claim
117 words
The optical semiconductor device production method as claimed in claim 9, characterized in that said lens holder includes a raised portion which is defined by a pair of slits, said location for shrinkage by laser irradiation is provided at a base portion of said slits, said first step adjusts the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis of the lens and fixes said lens holder on said mount by a laser welding, and said second step adjusts the relative positions of the optical semiconductor element and the lens in the direction of said optical axis by laser irradiation on said laser location for shrinkage by irradiation.
Claim 15
Dependent Claim
61 words
The optical semiconductor device production method as claimed in claim 9, characterized in that said location for shrinkage by laser irradiation is a groove provided in said lens holder, and said second step adjusts the relative positions of the optical semiconductor element and the lens in a direction of an optical axis of the lens by laser irradiation on said groove.
Claim 16
Dependent Claim
92 words
The optical semiconductor device production method as claimed in claim 9, characterized in that a hole which is provided in at least one of said mount and said lens holder and has a shape with a corner, said location for shrinkage by laser irradiation is provided at an arbitrary corner portion of said hole, and said second step adjusts the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis of the lens by laser irradiation on said location for shrinkage by laser irradiation.
Claim 17
Dependent Claim
111 words
The optical semiconductor device production method as claimed in claim 9, characterized in that said lens holder comprises a plurality of plate pairs which are connected with each plate pair having plates which are connected at base portions thereof to form an approximate V-shape, said lens is fixed to one plate of an arbitrary plate pair, said location for shrinkage by laser irradiation is provided at a base portion of each plate pair, and said second step adjusts the relative positions of the optical semiconductor element and the lens in a direction perpendicular to an optical axis of the lens by laser irradiation on said location for shrinkage by laser irradiation.
Claim 18
Dependent Claim
42 words
The optical semiconductor device production method as claimed in claims 9 to 15, characterized in that said first step includes a substep of accommodating said mount and said lens holder in a package structure which seals said mount and said lens holder.
Claim 19
Dependent Claim
59 words
The optical semiconductor device production method as claimed in claim 16, characterized in that said package structure has a window for laser irradiation provided at a portion in correspondence with said location for shrinkage by laser irradiation, and said second step includes the substep of irradiating said location for shrinkage by laser irradiation through said window for laser irradiation.
Claim 20
Dependent Claim
57 words
The optical semiconductor device production method as claimed in claim 16, characterized in that said package structure has a window for an outgoing light beam which is emitted form the optical semiconductor element, and said second step includes the substep of irradiating said location for shrinkage by laser irradiation through said window for the outgoing light beam.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-15 | 1995-01-14 | 1995-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-15 | 1999-01-14 | 1999-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-15 | 2003-01-14 | 2003-07-16 | $7700.00 | Window Closed / Lapsed |