US5545589A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
Assignee: Panasonic Holdings Corp
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Filing: 1994-01-27
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Granted: 1996-08-13
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Expires: 2014-01-27
Abstract
Abstract According to the present invention, a method for forming bumps for electrically connecting electrode pads of a semiconductor device to terminal electrodes formed on a surface of a circuit board respectively, the semiconductor device being mounted facedown on the surface of the circuit board, includes: step a of forming the bumps on the electrode pad of the semiconductor device: step b of placing facedown the semiconductor device on a flat foundation so that the bumps contact with a grind sheet which is fixed to the flat foundation and which has abrasive grind; and step c of conducting ultrasonic vibration on the flat foundation while pressing the semiconductor device against the flat foundation, thereby forming a rugged side in a front end portion of each of the bumps.
Inventors
- 👤 Yoshihiro Tomura
- 👤 Yoshihiro Bessho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 23:08
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/20; H10W72/01251; H10W72/071; H10W72/072; H10W72/07251; H10W72/07253; H10W72/074; H10W72/221; H10W72/222; H10W72/223; H10W72/231; H10W72/234; H10W72/241; H10W72/245; H10W72/251; H10W72/252; H10W72/255; H10W72/261; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
123 words
A method for forming bumps for electrically connecting electrode pads of a semiconductor device to terminal electrodes formed on a surface of a circuit board respectively, said semiconductor device being mounted facedown on said surface of said circuit board, comprising: step a of forming said bumps on said electrode pad of said semiconductor device; step b of placing facedown said semiconductor device on a flat foundation so that said bumps contact with a grind sheet which is fixed to said flat foundation and which has abrasive grind; and step c of conducting ultrasonic vibration on said flat foundation while pressing said semiconductor device against said flat foundation, thereby forming a plurality of irregularities in a front end portion of each of said bumps.
Claim 2
Independent Claim
123 words
A method for forming bumps for electrically connecting electrode pads of a semiconductor device to terminal electrodes formed on a surface of a circuit board respectively, said semiconductor device being mounted facedown on said surface of said circuit board, comprising: step a of forming said bumps on said electrode pad of said semiconductor device; step b of placing facedown said semiconductor device on a flat foundation so that said bumps contact with a grind sheet which is fixed to said flat foundation and which has abrasive grind; and step c of conducting ultrasonic vibration on said flat foundation while pressing said semiconductor device against said flat foundation, thereby forming a plurality of irregularities in a front end portion of each of said bumps.
Claim 3
Dependent Claim
38 words
A method according to claim 1, wherein said step c includes a step of leveling said bumps to make said bumps a uniform height, said bumps being leveled when said semiconductor device is pressed against said flat foundation.
Claim 4
Dependent Claim
30 words
A method according to claim 1, wherein said bumps are made of a material selected from the group consisting of Au, Cu, Al, solder, or an alloy of these metals.
Claim 5
Dependent Claim
24 words
A method according to claim 1, wherein, in said step a, said bumps are formed on said electrode pads by a ball bonding method.
Claim 6
Dependent Claim
23 words
A method according to claim 1, wherein, in said step a, said bumps are formed by a soldering method or a plating method.
Claim 7
Independent Claim
166 words
A method for mounting a semiconductor device having electrode pads on a surface, on a circuit board having terminal electrodes on a surface, comprising: step a of forming bumps on said electrode pads of said semiconductor device; step b of placing facedown said semiconductor device on a flat foundation so that said bumps contact with a grind sheet which is fixed to said flat foundation and which has abrasive grind; step c of conducting ultrasonic vibration on said flat foundation while pressing said semiconductor device against said flat foundation, thereby forming a plurality of irregularities in a front end portion of each of said bumps; step d of applying a conductive adhesive material to the front end portion of each of said bumps in which a plurality of irregularities is formed; step e of facedown mounting said semiconductor device on said circuit board so that said bumps contact with said terminal electrodes; and step f of curing said conductive adhesive material to form a bonding layer.
Claim 8
Independent Claim
166 words
A method for mounting a semiconductor device having electrode pads on a surface, on a circuit board having terminal electrodes on a surface, comprising: step a of forming bumps on said electrode pads of said semiconductor device; step b of placing facedown said semiconductor device on a flat foundation so that said bumps contact with a grind sheet which is fixed to said flat foundation and which has abrasive grind; step c of conducting ultrasonic vibration on said flat foundation while pressing said semiconductor device against said flat foundation, thereby forming a plurality of irregularities in a front end portion of each of said bumps; step d of applying a conductive adhesive material to the front end portion of each of said bumps in which a plurality of irregularities is formed; step e of facedown mounting said semiconductor device on said circuit board so that said bumps contact with said terminal electrodes; and step f of curing said conductive adhesive material to form a bonding layer.
Claim 9
Dependent Claim
38 words
A method according to claim 6, wherein said step c includes a step of leveling said bumps to make said bumps a uniform height, said bumps being leveled when said semiconductor device is pressed against said flat foundation.
Claim 10
Dependent Claim
30 words
A method according to claim 6, wherein said bumps are made of a material selected from the group consisting of Au, Cu, Al, solder, or an alloy of these metals.
Claim 11
Dependent Claim
24 words
A method according to claim 6, wherein, in said step a, said bumps are formed on said electrode pads by a ball bonding method.
Claim 12
Dependent Claim
23 words
A method according to claim 6, wherein, in said step a, said bumps are formed by a soldering method or a plating method.
Claim 13
Dependent Claim
16 words
A method according to claim 6, wherein said bonding layer is made of a conductive adhesive.
Claim 14
Dependent Claim
17 words
A method according to claim 6, wherein said bonding layer is made of an anisotropic conductive material.
Claim 15
Dependent Claim
28 words
A method according to claim 6 including a step of forming another rugged side at least in a portion of a surface of each of said terminal electrodes.
References Cited (Backward Citations)
US3698075A
Cited
US3737986A
Cited
US3995845A
Cited
US4172907A
Cited
US4442966A
Cited
US4622098A
Cited
JPS62154648A
Cited
JPS62285446A
Cited
EP0316912A2
Cited
US5108950A
Cited
US5014111A
Cited
US5090119A
Cited
EP0352020A2
Cited
JPH0234949A
Cited
JPH02177546A
Cited
JPH036828A
Cited
JPH0318826A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-13 | 2000-02-12 | 2000-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-13 | 2004-02-12 | 2004-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-13 | 2008-02-12 | 2008-08-13 | $7700.00 | Window Closed / Lapsed |