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US5541007A
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US
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Aluminum alloy wiring layer and aluminum alloy sputtering target
Assignee: Ryoka Matthey Corp
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Filing: 1994-07-19
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Granted: 1996-07-30
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Expires: 2014-07-19
Abstract
Abstract An aluminum alloy wiring layer comprising 0.01 to 1.0 wt. % of scandium, or 0.01 to 1.0 wt. % of scandium and 0.01 to 3.0 wt. % of at least one element selected from the group consisting of silicon, titanium, copper, boron, hafnium and rare-earth elements other than scandium, and the balance aluminum having a purity of not less than 99.99%. A process for producing the same and an aluminum alloy sputtering target used therefor are also disclosed. The aluminum alloy wiring layer of the present invention is suitable as an advanced large-scale integrated circuit.
Inventors
- 👤 Tadao Ueda
- 👤 Kazunari Takemura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 01:40
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/40; C; C22; C22C; C22C21/00; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/44; H10W20/4403; H10W20/4405; H10W20/4407; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528; Y10T428/12736
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
117 words
An aluminum alloy wiring layer consisting essentially of 0.01 to 1.0 wt % of scandium and the balance aluminum having a purity of not less than 99.99%, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling treatment at a reduction ratio of 50 to 90%, heating the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 2
Dependent Claim
117 words
An aluminum alloy wiring layer consisting essentially of 0.01 to 1.0 wt % of scandium and the balance aluminum having a purity of not less than 99.99%, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling treatment at a reduction ratio of 50 to 90%, heating the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 3
Dependent Claim
19 words
An aluminum alloy wiring layer according to claim 1, wherein the scandium content is 0.05 to 0.6 wt. %.
Claim 4
Dependent Claim
144 words
An aluminum alloy wiring layer consisting essentially of 0.01 to 1.0 wt. % of scandium, 0.01 to 3.0 wt. % of at least one element selected from the group consisting of silicon, titanium, copper, boron, hafnium and rare-earth elements other than scandium, and the balance aluminum having a purity of not less than 99.99%, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling treatment at a reduction ratio of 50 to 90%, heated the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 5
Dependent Claim
144 words
An aluminum alloy wiring layer consisting essentially of 0.01 to 1.0 wt. % of scandium, 0.01 to 3.0 wt. % of at least one element selected from the group consisting of silicon, titanium, copper, boron, hafnium and rare-earth elements other than scandium, and the balance aluminum having a purity of not less than 99.99%, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling treatment at a reduction ratio of 50 to 90%, heated the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 6
Dependent Claim
19 words
An aluminum alloy wiring layer according to claim 3, wherein the scandium content is 0.05 to 0.6 wt. %.
Claim 7
Dependent Claim
128 words
An aluminum alloy sputtering target consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99%, and having an average grain size of 0.1 to 0.5 mm, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling treatment at a reduction ratio of 50 to 90%, heating the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 8
Dependent Claim
128 words
An aluminum alloy sputtering target consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99%, and having an average grain size of 0.1 to 0.5 mm, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling treatment at a reduction ratio of 50 to 90%, heating the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 9
Dependent Claim
19 words
An aluminum alloy sputtering target according to claim 5, wherein the scandium content is 0.05 to 0.6 wt. %.
Claim 10
Dependent Claim
143 words
An aluminum alloy sputtering target consisting essentially of 0.01 to 1.0 wt. % of scandium, 0.01 to 3.0 wt. % of at least one element selected from the group consisting of silicon, titanium, copper, boron, hafnium and rare-earth elements other than scandium, and the balance aluminum having a purity of not less than 99.99%, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling-treatment at a reduction ratio of 50 to 90%, heating the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 11
Dependent Claim
143 words
An aluminum alloy sputtering target consisting essentially of 0.01 to 1.0 wt. % of scandium, 0.01 to 3.0 wt. % of at least one element selected from the group consisting of silicon, titanium, copper, boron, hafnium and rare-earth elements other than scandium, and the balance aluminum having a purity of not less than 99.99%, obtained by sputtering an aluminum alloy target produced by the steps of heating an alloy consisting essentially of 0.01 to 1.0 wt. % of scandium and the balance aluminum having a purity of not less than 99.99% at 500° to 550° C. for 10 to 15 hours, subjecting the heated alloy to rolling-treatment at a reduction ratio of 50 to 90%, heating the rolled alloy at 400° to 450° C. for 30 to 60 minutes, and cutting the alloy into a shape suitable for use in a sputtering apparatus.
Claim 12
Dependent Claim
19 words
An aluminum alloy sputtering target according to claim 7, wherein the scandium content is 0.05 to 0.6 wt. %.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-30 | 2000-01-29 | 2000-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-30 | 2004-01-29 | 2004-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-30 | 2008-01-29 | 2008-07-30 | $7700.00 | Window Closed / Lapsed |