Patent US5537738A successfully refreshed from Google Patents.
US5537738A
Expired / Lapsed
US
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Methods of mechanical and electrical substrate connection
Assignee: Micron Technology Inc
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Filing: 1995-02-10
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Granted: 1996-07-23
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Expires: 2015-02-10
Abstract
Abstract The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads. The method includes adjusting a wire bonder's tear length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection. Further steps include making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder, and then severing the bond wire adjacent said wedge bond. The adjusted tear length of the wire bonder results in a tail of severed bond wire which projects from said wedge bond and said individual bond pad. Subsequent steps include positioning the first and second planar substrates with their inwardly facing surfaces facing each other, aligning the matching bond pad patterns of the first and second planar substrates, and pressing the first and second planar substrates against each other. The bond wire tail deforms between the bond pads of the first and second planar substrates to conductively bond therebetween.
Inventors
- 👤 David A. Cathey
- 👤 Charles Watkins
- 👤 Derek Gochnour
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:59
CPC Classifications
H; H01; H01J; H01J9/00; H01J9/24; H01J9/26; H10; H10W; H10W90/00; H01J9/241; H01J9/261; H01J9/32; H01J9/36; H10W70/00; H10W70/60; H10W70/611; H10W90/401; H01J2329/00; H01J2329/86; H01J2329/8625; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H05K3/36; H05K3/368; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5524; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
185 words
A method of attaching and electrically connecting first and second planar substrates, the first and second planar substrates having inwardly-facing surfaces with matching patterns of bond pads, the method comprising: adjusting a wire bonder's tear length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection; making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder; severing the bond wire adjacent said wedge bond, the adjusted tear length of the wire bonder resulting in a tail of severed bond wire which projects from said wedge bond and said individual bond pad; positioning the first and second planar substrates with their inwardly-facing surfaces facing each other; aligning the matching bond pad patterns of the first and second planar substrates, the bond wire tail being interposed between the bond pads of the first and second planar substrates; and pressing the first and second planar substrates against each other, the bond wire tail deforming between the bond pads of the first and second planar substrates to conductively bond therebetween.
Claim 2
Independent Claim
185 words
A method of attaching and electrically connecting first and second planar substrates, the first and second planar substrates having inwardly-facing surfaces with matching patterns of bond pads, the method comprising: adjusting a wire bonder's tear length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection; making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder; severing the bond wire adjacent said wedge bond, the adjusted tear length of the wire bonder resulting in a tail of severed bond wire which projects from said wedge bond and said individual bond pad; positioning the first and second planar substrates with their inwardly-facing surfaces facing each other; aligning the matching bond pad patterns of the first and second planar substrates, the bond wire tail being interposed between the bond pads of the first and second planar substrates; and pressing the first and second planar substrates against each other, the bond wire tail deforming between the bond pads of the first and second planar substrates to conductively bond therebetween.
Claim 3
Dependent Claim
49 words
A method as recited in claim 1 and further comprising: performing successive repetitions of making a wedge bond and of severing the bond wire adjacent said wedge bond; and said successive repetitions being performed prior to the step of pressing the first and second planar substrates against each other.
Claim 4
Dependent Claim
70 words
A method as recited in claim 1 and further comprising: performing successive repetitions of making a wedge bond and of severing the bond wire adjacent said wedge bond; said successive repetitions being performed prior to the step of pressing the first and second planar substrates against each other; each of said successive repetitions being interposed by a step of interconnecting between spaced individual conductors with wire from the wire bonder.
Claim 5
Dependent Claim
18 words
A method as recited in claim 1 and further comprising using aluminum alloy wire in the wire bonder.
Claim 6
Dependent Claim
17 words
A method as recited in claim 1 wherein one of the planar substrates is a semiconductor die.
Claim 7
Dependent Claim
16 words
A method as recited in claim 1 wherein the first planar substrate is a semiconductor die.
Claim 8
Dependent Claim
16 words
A method as recited in claim 1 wherein the second planar substrate is a semiconductor die.
Claim 9
Dependent Claim
25 words
A method as recited in claim 1 and further comprising applying heat during the pressing step to bond between the first and second planar substrates.
Claim 10
Dependent Claim
25 words
A method as recited in claim 1 and further comprising applying vibration during the pressing step to bond between the first and second planar substrates.
Claim 11
Dependent Claim
20 words
A method as recited in claim 1 wherein the tear length is adjusted to a length of about 2 microns.
Claim 12
Dependent Claim
26 words
A method as recited in claim 1 and being void of any separate adhesive interconnect between the bond pads of the first and second planar substrates.
Claim 13
Independent Claim
203 words
A method of attaching and electrically connecting first and second planar substrates, the first and second planar substrates having inwardly-facing surfaces with matching patterns of bond pads, the method comprising: adjusting a wire bonder's tear length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection; making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder; severing the bond wire adjacent said wedge bond, the adjusted tear length of the wire bonder resulting in a tail of severed bond wire which projects from said wedge bond and said individual bond pad, the tail having an outermost end which is displaced from both the bond pad and the wedge bond; positioning the first and second planar substrates with their inwardly-facing surfaces facing each other; aligning the matching bond pad patterns of the first and second planar substrates, the bond wire tail being interposed between the bond pads of the first and second planar substrates; and pressing the first and second planar substrates against each other, the bond wire tail deforming between the bond pads of the first and second planar substrates to conductively bond therebetween.
Claim 14
Independent Claim
203 words
A method of attaching and electrically connecting first and second planar substrates, the first and second planar substrates having inwardly-facing surfaces with matching patterns of bond pads, the method comprising: adjusting a wire bonder's tear length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection; making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder; severing the bond wire adjacent said wedge bond, the adjusted tear length of the wire bonder resulting in a tail of severed bond wire which projects from said wedge bond and said individual bond pad, the tail having an outermost end which is displaced from both the bond pad and the wedge bond; positioning the first and second planar substrates with their inwardly-facing surfaces facing each other; aligning the matching bond pad patterns of the first and second planar substrates, the bond wire tail being interposed between the bond pads of the first and second planar substrates; and pressing the first and second planar substrates against each other, the bond wire tail deforming between the bond pads of the first and second planar substrates to conductively bond therebetween.
Claim 15
Dependent Claim
49 words
A method as recited in claim 12 and further comprising: performing successive repetitions of making a wedge bond and of severing the bond wire adjacent said wedge bond; and said successive repetitions being performed prior to the step of pressing the first and second planar substrates against each other.
Claim 16
Dependent Claim
70 words
A method as recited in claim 12 and further comprising: performing successive repetitions of making a wedge bond and of severing the bond wire adjacent said wedge bond; said successive repetitions being performed prior to the step of pressing the first and second planar substrates against each other; each of said successive repetitions being interposed by a step of interconnecting between spaced individual conductors with wire from the wire bonder.
Claim 17
Dependent Claim
18 words
A method as recited in claim 12 and further comprising using aluminum alloy wire in the wire bonder.
Claim 18
Dependent Claim
17 words
A method as recited in claim 12 wherein one of the planar substrates is a semiconductor die.
Claim 19
Dependent Claim
16 words
A method as recited in claim 12 wherein the first planar substrate is a semiconductor die.
Claim 20
Dependent Claim
16 words
A method as recited in claim 12 wherein the second planar substrate is a semiconductor die.
Claim 21
Dependent Claim
25 words
A method as recited in claim 12 and further comprising applying heat during the pressing step to bond between the first and second planar substrates.
Claim 22
Dependent Claim
25 words
A method as recited in claim 12 and further comprising applying vibration during the pressing step to bond between the first and second planar substrates.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-23 | 2000-01-22 | 2000-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-23 | 2004-01-22 | 2004-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-23 | 2008-01-22 | 2008-07-23 | $7700.00 | Window Closed / Lapsed |