US5537083A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectromechanical signal processors
Assignee: University of California, San Diego
•
Filing: 1994-08-30
•
Granted: 1996-07-16
•
Expires: 2014-08-30
Abstract
Abstract A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.
Inventors
- 👤 Liwei Lin
- 👤 Clark T. Nguyen
- 👤 Roger T. Howe
- 👤 Albert P. Pigano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:18
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/02244; H03H9/02259; H03H9/02275; H03H9/02338; H03H9/02362; H03H9/02377; H03H9/46; H03H9/462
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
85 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second rigid mass; and a second flexible structure mechanically movably connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, whereby said first and second rigid masses are mechanically coupled but able to move independently.
Claim 2
Dependent Claim
85 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second rigid mass; and a second flexible structure mechanically movably connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, whereby said first and second rigid masses are mechanically coupled but able to move independently.
Claim 3
Dependent Claim
39 words
The micromechanical signal processor of claim 1, wherein said first and second masses have dimples protruding from a surface opposed to a flat portion of said substrate to prevent stiction between said first and second masses and said substrate.
Claim 4
Dependent Claim
24 words
The micromechanical signal processor of claim 1 wherein said first and second masses and said first and second flexible structures are thin film structures.
Claim 5
Dependent Claim
16 words
The micromechanical signal processor of claim 3 wherein said masses and flexible structures include polycrystalline silicon.
Claim 6
Dependent Claim
59 words
A micromechanical signal processor of claim 3 further including: an electrode electrostatically coupled to said mass; and a shell mounted on said substrate and hermetically sealing said first and second masses and said first and second flexible structures in a low pressure environment, whereby a quality factor of a resonance of said rigid mass and flexible structure is increased.
Claim 7
Dependent Claim
18 words
The micromechanical signal processor of claims 1 further including a first electrode electrostatically coupled to said second mass.
Claim 8
Dependent Claim
17 words
The micromechanical signal processor of claim 6 wherein said first electrode and said second mass are interdigitated.
Claim 9
Dependent Claim
18 words
The micromechanical signal processor of claim 6 further including a second electrode electrostatically coupled to said first mass.
Claim 10
Dependent Claim
17 words
The micromechanical signal processor of claim 8 wherein said second electrode and said first mass are interdigitated.
Claim 11
Dependent Claim
37 words
The micromechanical signal processor of claim 6 wherein said second flexible structure connects said second mass to said substrate, further including a third electrode electrically connected to said first electrode and electrostatically coupled to said second mass.
Claim 12
Dependent Claim
21 words
The micromechanical signal processor of claim 1 further comprising a third flexible structure mechanically connecting said second mass to said substrate.
Claim 13
Dependent Claim
33 words
The micromechanical signal processor of claim 1 wherein said first and second masses move in-phase at a first resonant frequency, and said first and second masses move out-of-phase at a second resonant frequency.
Claim 14
Dependent Claim
85 words
The micromechanical signal processor of claim 1 wherein said second flexible structure includes a first pair of bars substantially parallel to a separation axis between said first and second masses, a second pair of bars substantially transverse to said separation axis, each of said second pair of bars spanning said first pair of bars, said first mass being connected to a first one of said second pair of bars, and said second mass being connected to a second one of said second pair of bars.
Claim 15
Dependent Claim
104 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second rigid mass; a second flexible structure mechanically connecting said second mass to said substrate and allowing said second mass to move relative to said substrate; a third flexible structure mechanically connecting said first mass to said second mass, coupling motions of said first and second masses while allowing said first mass to move relative to said second mass; and a first electrode electrostatically coupled to said first mass.
Claim 16
Dependent Claim
104 words
A micromechanical signal processor comprising: a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second rigid mass; a second flexible structure mechanically connecting said second mass to said substrate and allowing said second mass to move relative to said substrate; a third flexible structure mechanically connecting said first mass to said second mass, coupling motions of said first and second masses while allowing said first mass to move relative to said second mass; and a first electrode electrostatically coupled to said first mass.
Claim 17
Dependent Claim
18 words
The micromechanical signal processor of claim 14 further including a second electrode electrostatically coupled to said second mass.
Claim 18
Dependent Claim
43 words
The micromechanical signal processor of claim 14 wherein said third flexible structure includes a third mass, a fourth flexible structure mechanically connecting said first mass to said third mass, and a fifth flexible structure mechanically connecting said third mass to said second mass.
Claim 19
Dependent Claim
43 words
The micromechanical signal processor of claim 16 wherein said third flexible structure further includes a sixth flexible structure mechanically connecting said first mass and said second mass, and only being mechanically connected to said third mass via said fourth and fifth flexible structures.
Claim 20
Dependent Claim
24 words
The micromechanical signal processor of claim 17 wherein said sixth flexible structure lies substantially in the same plane as said first and second masses.
Claim 21
Dependent Claim
35 words
The micromechanical signal processor of claim 17 wherein said sixth flexible structure lies substantially in a first plane, and said first and second masses lie substantially in a second plane displaced from said first plane.
Claim 22
Dependent Claim
21 words
The micromechanical signal processor of claim 16 further including a sixth flexible structure mechanically connecting said third mass to said substrate.
Claim 23
Dependent Claim
27 words
The micromechanical signal processor of claim 14 wherein said first electrode has a plurality of fingers interdigitated with a plurality of fingers extending from said first mass.
Claim 24
Dependent Claim
25 words
The micromechanical signal processor of claim 14 wherein said first and second rigid masses and said first, second and third flexible structures include polycrystalline silicon.
Claim 25
Independent Claim
108 words
A method for fabricating a tunable micromechanical signal processor on a substrate, comprising the steps of: fabricating a mass; fabricating a flexible structure mechanically connecting said mass to said substrate and allowing said mass to move relative to said substrate; fabricating a first electrode electrostatically coupled to said mass; fabricating a plurality of trim weights attached by a plurality of microbridges to said mass; and destroying a first group of said microbridges so as to detach a second group of said trim weights from said mass, leaving a remaining third group of said trim weights attached to said mass, whereby a resonance characteristic of said mass is altered.
Claim 26
Independent Claim
108 words
A method for fabricating a tunable micromechanical signal processor on a substrate, comprising the steps of: fabricating a mass; fabricating a flexible structure mechanically connecting said mass to said substrate and allowing said mass to move relative to said substrate; fabricating a first electrode electrostatically coupled to said mass; fabricating a plurality of trim weights attached by a plurality of microbridges to said mass; and destroying a first group of said microbridges so as to detach a second group of said trim weights from said mass, leaving a remaining third group of said trim weights attached to said mass, whereby a resonance characteristic of said mass is altered.
References Cited (Backward Citations)
US2803800A
Cited
US3490056A
Cited
US3517349A
Cited
US3533022A
Cited
US3634787A
Cited
US4282498A
Cited
US4517486A
Cited
US5025346A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-16 | 2000-01-15 | 2000-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-16 | 2004-01-15 | 2004-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-16 | 2008-01-15 | 2008-07-16 | $7700.00 | Window Closed / Lapsed |