US5536974A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with light reflecting substrate area
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1993-05-21
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Granted: 1996-07-16
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Expires: 2013-05-21
Abstract
Abstract A semiconductor device having a high packaging yield is disclosed. A light directed to a light reflection area (20) formed on a packaging substrate (10) is reflected with an accurate angle. A light directed to a second light reflection area (50) formed on a semiconductor chip (40) is also reflected with an accurate angle. A relative inclination between the packaging substrate (10) and the semiconductor chip (40) is measured based on the reflection angles of the reflected lights.
Inventors
- 👤 Masanori Nishiguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 12:22
CPC Classifications
H; H10; H10W; H10W46/00; H05; H05K; H05K13/00; H05K13/08; H05K13/081; H05K13/0812; H05K13/0815; H10P; H10P72/00; H10P72/50; H10P72/53; H10W72/00; H10W72/071; H10W72/072; H10W46/601
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
114 words
A packaging substrate for mounting a semiconductor, the substrate comprising: a substrate layer; metal film disposed over at least a portion of said substrate layer; and an insulation film having a thickness d formed at least on said metal film and defining a surface having at least one semiconductor chip packaging area, said metal layer and said insulation film cooperating to define at least one light reflecting area within a boundary of said at least one semiconductor chip packaging area, the thickness d of said insulation film satisfying the following relation: (λ/2)×m=n×d where λ is a wavelength of incident light, m is an integer and n is a refractive index of said insulation film.
Claim 2
Dependent Claim
114 words
A packaging substrate for mounting a semiconductor, the substrate comprising: a substrate layer; metal film disposed over at least a portion of said substrate layer; and an insulation film having a thickness d formed at least on said metal film and defining a surface having at least one semiconductor chip packaging area, said metal layer and said insulation film cooperating to define at least one light reflecting area within a boundary of said at least one semiconductor chip packaging area, the thickness d of said insulation film satisfying the following relation: (λ/2)×m=n×d where λ is a wavelength of incident light, m is an integer and n is a refractive index of said insulation film.
Claim 3
Dependent Claim
27 words
A packaging substrate according to claim 1 wherein a second insulation film different from said insulation film is formed between said packaging substrate and said metal film.
Claim 4
Dependent Claim
48 words
A packaging substrate according to claim 2 wherein said second insulation film is of single-layer structure made of PI (polyimide), BCB (benzocyclobutene) or SOG (spin-on-glass) or of multi-layer structure of a combination of said materials, and said second insulation film has a thickness of 5 μm or larger.
Claim 5
Dependent Claim
23 words
A packaging substrate according to claim 1 wherein said light reflecting area is arranged at a center of a semiconductor chip packaging area.
Claim 6
Dependent Claim
16 words
A packaging substrate according to claim 4 wherein said light reflecting area is of cross shape.
Claim 7
Dependent Claim
30 words
A packaging substrate according to claim 1 wherein at least one pair of light reflecting areas are provided and arranged symmetrically about a center of a semiconductor chip packaging area.
Claim 8
Dependent Claim
49 words
A packaging substrate according to claim 6 wherein two pairs of said light reflecting areas are arranged symmetrically, about the center of gravity of a semiconductor chip packaging area, and two straight lines connecting centers of the pairs of said light reflecting areas are substantially normal to each other.
Claim 9
Dependent Claim
25 words
A packaging substrate according to claim 1 wherein said light reflecting area is arranged in a band at periphery of a semiconductor chip packaging area.
Claim 10
Dependent Claim
37 words
A packaging substrate according to claim 1 wherein at least first and second light reflecting areas are provided, a portion of said second light reflecting area partially overlapping with a portion of said first light reflecting area.
Claim 11
Dependent Claim
30 words
A packaging substrate according to claim 9 wherein said second light reflecting area has a second metal film and a second transparent insulation film formed on said second metal film.
Claim 12
Dependent Claim
46 words
A packaging substrate according to claim 10 wherein a thickness d of said second transparent insulation film meets the following relation; (λ/2)×m=n×d where λ is a wavelength of an incident light m is an integer and n is a refractive index of said third insulation film.
Claim 13
Dependent Claim
24 words
A packaging substrate according to claim 9 wherein said second light reflecting area is arranged at a center of a semiconductor chip packaging area.
Claim 14
Dependent Claim
17 words
A packaging substrate according to claim 12 wherein said second light reflecting areas are of cross shape.
Claim 15
Dependent Claim
30 words
A packaging substrate according to claim 9 wherein at least one pair of said second light reflecting areas are arranged symmetrically about a center of a semiconductor chip packaging area.
Claim 16
Dependent Claim
49 words
A packaging substrate according to claim 14 wherein two pairs of said second light reflecting areas are arranged symmetrically about a center of a semiconductor chip packaging area, and two straight lines connecting centers of the pairs of said second light reflecting areas are substantially normal to each other.
Claim 17
Dependent Claim
24 words
A semiconductor device according to claim 1 wherein said light reflecting area is arranged at a peripheral portion of a semiconductor chip packaging area.
Claim 18
Dependent Claim
59 words
A substrate member having a main surface for receiving a semiconductor chip to be mounted thereon, comprising: a ceramic substrate having a main surface; an insulation film formed directly on said main surface; a light reflecting pattern formed on said insulation film on a region for receiving the semiconductor chip; and a transparent film covering said light reflecting pattern.
Claim 19
Dependent Claim
59 words
A substrate member having a main surface for receiving a semiconductor chip to be mounted thereon, comprising: a ceramic substrate having a main surface; an insulation film formed directly on said main surface; a light reflecting pattern formed on said insulation film on a region for receiving the semiconductor chip; and a transparent film covering said light reflecting pattern.
Claim 20
Dependent Claim
59 words
A substrate member having a main surface for receiving a semiconductor chip to be mounted thereon, comprising: a packaging substrate; and a light reflecting pattern selectively formed on a region of said packaging substrate for receiving the semiconductor chip, the light reflecting pattern including a metal film and a transparent insulation film formed at least on the metal film.
Claim 21
Dependent Claim
59 words
A substrate member having a main surface for receiving a semiconductor chip to be mounted thereon, comprising: a packaging substrate; and a light reflecting pattern selectively formed on a region of said packaging substrate for receiving the semiconductor chip, the light reflecting pattern including a metal film and a transparent insulation film formed at least on the metal film.
References Cited (Backward Citations)
JPS56114343A
Cited
JPS5768058A
Cited
EP0126621B1
Cited
US4640888A
Cited
JPS60239050A
Cited
WO1989008926A1
Cited
US5022580A
Cited
US4899921A
Cited
US5153707A
Cited
EP0462596A1
Cited
US5214272A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-16 | 2000-01-15 | 2000-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-16 | 2004-01-15 | 2004-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-16 | 2008-01-15 | 2008-07-16 | $7700.00 | Window Closed / Lapsed |