US5536906A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for integrated circuits
Assignee: Texas Instruments Inc
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Filing: 1993-07-23
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Granted: 1996-07-16
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Expires: 2013-07-23
Abstract
Abstract In one form of the invention, a package for integrated circuits and devices (42), (46) is disclosed, the package including: a package base (44), the base having a first top surface; a layer of material (43) on the first top surface of the base (44) wherein the material (43) is patterned to cover a portion of the base, and wherein the layer of material (43) forms a substrate having a second top surface; a microstrip transmission line (45) on the second top surface; and a plastic encapsulant (50), wherein the encapsulant covers the first top surface of the base.
Inventors
- 👤 Glen R. Haas, Jr.
- 👤 John E. Barnett, Jr.
- 👤 Stephen R. Nelson
- 👤 Douglas J. Darrow
- 👤 Susan V. Bagen
- 👤 Henry Breit
- 👤 James Forster
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:01
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W44/00; H10W44/20; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/5475; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
81 words
A package for integrated circuits and devices comprising: a package base, said base having a first top surface; a layer of material on said first top surface of said base wherein said material is patterned to cover a portion of said base, and wherein said layer of material forms a substrate having a second top surface; a microstrip transmission line on said second top surface; and a plastic encapsulant, wherein said plastic encapsulant covers said first top surface of said base.
Claim 2
Dependent Claim
81 words
A package for integrated circuits and devices comprising: a package base, said base having a first top surface; a layer of material on said first top surface of said base wherein said material is patterned to cover a portion of said base, and wherein said layer of material forms a substrate having a second top surface; a microstrip transmission line on said second top surface; and a plastic encapsulant, wherein said plastic encapsulant covers said first top surface of said base.
Claim 3
Dependent Claim
11 words
The package of claim 1 wherein said material is a ceramic.
Claim 4
Dependent Claim
15 words
The package of claim 2 wherein said ceramic is alumina (Al 2 O 3 ).
Claim 5
Dependent Claim
27 words
The package of claim 1 further comprising a leadframe, wherein said base is attached to said leadframe, and said plastic encapsulant covers a portion of said leadframe.
Claim 6
Dependent Claim
34 words
The package of claim 4 wherein said layer of material is deposited on said portion of said leadframe covered by said plastic encapsulant, whereby adhesion between said plastic encapsulant and said leadframe is enhanced.
Claim 7
Dependent Claim
16 words
The package of claim 1 wherein said integrated circuits and devices are mounted on said base.
Claim 8
Dependent Claim
10 words
The package of claim 1 wherein said base comprises Cu.
Claim 9
Dependent Claim
12 words
The package of claim 1 wherein said base is clad with Mo.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-16 | 2000-01-15 | 2000-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-16 | 2004-01-15 | 2004-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-16 | 2008-01-15 | 2008-07-16 | $7700.00 | Window Closed / Lapsed |