US5355102A
Expired / Lapsed
US
⏱️ 0.0 years remaining
HDI impedance matched microwave circuit assembly
Assignee: Lockheed Martin Corp
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Filing: 1992-04-14
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Granted: 1994-10-11
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Expires: 2012-04-14
Abstract
Abstract Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching, minimizes impedance discontinuities and substantially increases the yield of good circuits.
Inventors
- 👤 William P. Kornrumpf
- 👤 Robert J. Wojnarowski
- 👤 Charles W. Eichelberger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 23:26
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H03; H03H; H03H7/00; H03H7/38; H10W70/00; H10W70/099; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W90/00
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
177 words
A electronic system comprising: a substrate having a first surface; a ground plane conductor disposed on said first surface; an electronic component disposed on a surface of said ground plane conductor, said component having a first surface facing away from said ground plane conductor and a terminal disposed on said first surface of said electronic component, said electronic component having an impedance as seen at said terminal; a dielectric layer overlying and bonded to at least portions of said ground plane conductor and said first surface of said electronic component; and at least one signal conductor disposed in ohmic electrical contact with said terminal of said electronic component and spaced from at least some portions of said electronic component by said dielectric layer, and extending from over said component to over said first surface of said substrate; and said ground plane conductor being spaced from said signal conductor by said dielectric layer to form with said signal conductor a transmission line having an impedance which matches the impedance of said electronic component as seen at said terminal.
Claim 2
Dependent Claim
177 words
A electronic system comprising: a substrate having a first surface; a ground plane conductor disposed on said first surface; an electronic component disposed on a surface of said ground plane conductor, said component having a first surface facing away from said ground plane conductor and a terminal disposed on said first surface of said electronic component, said electronic component having an impedance as seen at said terminal; a dielectric layer overlying and bonded to at least portions of said ground plane conductor and said first surface of said electronic component; and at least one signal conductor disposed in ohmic electrical contact with said terminal of said electronic component and spaced from at least some portions of said electronic component by said dielectric layer, and extending from over said component to over said first surface of said substrate; and said ground plane conductor being spaced from said signal conductor by said dielectric layer to form with said signal conductor a transmission line having an impedance which matches the impedance of said electronic component as seen at said terminal.
Claim 3
Dependent Claim
16 words
The electronic system recited in claim 1 wherein: said transmission line is a microstrip transmission line.
Claim 4
Dependent Claim
18 words
The electronic system recited in claim 1 wherein: said electronic component is bonded to said ground plane conductor.
Claim 5
Dependent Claim
44 words
The electronic system recited in claim 1 wherein: said dielectric layer has a thickness and a dielectric constant and said signal conductor has a size which is related with the dielectric constant of said dielectric to provide said transmission line with said matching impedance.
Claim 6
Dependent Claim
20 words
The electronic system recited in claim 1 wherein: said substrate includes a cavity in which said electronic component is disposed.
Claim 7
Dependent Claim
35 words
The electronic system recited in claim 1 wherein: said component is disposed with the first surface thereof lying substantially in a common plane with an adjacent portion of said surface of said ground plane conductor.
Claim 8
Dependent Claim
24 words
The electronic system recited in claim 1 wherein: a portion of said first surface of said electronic component is free of said dielectric layer.
Claim 9
Dependent Claim
21 words
The electronic system recited in claim 7 wherein: said dielectric layer is present only under said at least one signal conductor.
Claim 10
Dependent Claim
13 words
The electronic system recited in claim 1 wherein: said substrate is electrically conductive.
Claim 11
Dependent Claim
172 words
The electronic system comprising: a substrate having a first surface; an electronic component disposed on said substrate, said component having a first surface facing away from said first surface of said substrate and a terminal disposed on said first surface of said electronic component, said electronic component having an impedance as seen at said terminal; a dielectric layer overlying and bonded to at least portions of said first surfaces of said substrate and said electronic component; a window in said dielectric layer in the form of an aperture; at least one signal conductor disposed in ohmic electrical contact with said terminal of said electronic component and spaced from at least some portions of said electronic component by said dielectric layer, and extending from over said component to over said first surface of said substrate; and a ground conductor spaced from said signal conductor by said dielectric layer to form with said signal conductor a transmission line having an impedance which matches the impedance of said electronic component as seen at said terminal.
Claim 12
Dependent Claim
172 words
The electronic system comprising: a substrate having a first surface; an electronic component disposed on said substrate, said component having a first surface facing away from said first surface of said substrate and a terminal disposed on said first surface of said electronic component, said electronic component having an impedance as seen at said terminal; a dielectric layer overlying and bonded to at least portions of said first surfaces of said substrate and said electronic component; a window in said dielectric layer in the form of an aperture; at least one signal conductor disposed in ohmic electrical contact with said terminal of said electronic component and spaced from at least some portions of said electronic component by said dielectric layer, and extending from over said component to over said first surface of said substrate; and a ground conductor spaced from said signal conductor by said dielectric layer to form with said signal conductor a transmission line having an impedance which matches the impedance of said electronic component as seen at said terminal.
Claim 13
Dependent Claim
29 words
The electronic system recited in claim 10 wherein: said window encompasses a portion of said component having characteristics which are adversely affected by the presence of overlying dielectric layers.
Claim 14
Dependent Claim
15 words
The electronic system recited in claim 11 wherein: said window has a simple geometric configuration.
Claim 15
Dependent Claim
55 words
The electronic system recited in claim 11 wherein: said window has a simple geometric outline except for locations in which said a portion of said at least one signal conductor is disposed inside said simple geometric outline, the outline of said window following said signal conductors where they are disposed within said simple geometric outline.
Claim 16
Dependent Claim
109 words
In a method of fabricating a high density interconnect structure including providing an electronic component having contact pads thereon, providing one or more polymer dielectric layers disposed over the component, bonded to the component and having apertures, providing one or more patterned conductive layers disposed on the dielectric layers and extending into selected ones of said apertures into ohmic contact with selected contact pads, the improvement comprising: forming a window in the dielectric layer of said high density interconnect structure over at least a portion of said electronic component to define an exposed portion of said component, and leaving said exposed portion free of direct contact with solid material.
Claim 17
Dependent Claim
109 words
In a method of fabricating a high density interconnect structure including providing an electronic component having contact pads thereon, providing one or more polymer dielectric layers disposed over the component, bonded to the component and having apertures, providing one or more patterned conductive layers disposed on the dielectric layers and extending into selected ones of said apertures into ohmic contact with selected contact pads, the improvement comprising: forming a window in the dielectric layer of said high density interconnect structure over at least a portion of said electronic component to define an exposed portion of said component, and leaving said exposed portion free of direct contact with solid material.
Claim 18
Dependent Claim
32 words
The electronic system recited in claim 14 which comprises: forming said window to expose a portion of said component having characteristics which are adversely affected by the presence of overlying dielectric layers.
Claim 19
Dependent Claim
56 words
The electronic system recited in claim 15 which comprises: forming said window with a simple geometric outline except for locations in which one or more of said patterned conductive layers is disposed within said simple geometric outline, the outline of said window following said patterned conductive layers where they are disposed within said simple geometric outline.
Claim 20
Dependent Claim
22 words
The electronic system recited in claim 15 which comprises: allowing the dielectric layer to remain continuous over the remainder of said structure.
Claim 21
Dependent Claim
17 words
The electronic system recited in claim 17 which comprises: forming said window with a simple geometric configuration.
Claim 22
Dependent Claim
56 words
The electronic system recited in claim 17 which comprises: forming said window with a simple geometric outline except for locations in which one or more of said patterned conductive layers is disposed within said simple geometric outline, the outline of said window following said patterned conductive layers where they are disposed within said simple geometric outline.
Claim 23
Dependent Claim
17 words
The electronic system recited in claim 15 which comprises: forming said window with a simple geometric configuration.
Claim 24
Dependent Claim
26 words
The method recited in claim 14 comprising the step of: disposing one of said patterned conductive layers in a position to create a microwave transmission line.
Claim 25
Dependent Claim
30 words
The method recited in claim 21 wherein the step of disposing comprises: configuring said one of said patterned conductive layers to provide said microwave transmission line with a specified impedance.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-10-10 | 1998-04-11 | 1998-10-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-10-10 | 2002-04-11 | 2002-10-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-10-10 | 2006-04-11 | 2006-10-11 | $7700.00 | Window Closed / Lapsed |