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Complementary metal-oxide semiconductor transistor logic using strained SI/SIGE heterostructure layers

Assignee: GlobalFoundries Inc
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Filing: 1994-05-20
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Granted: 1996-07-09
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Expires: 2014-05-20
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Abstract

Abstract A method and a layered planar heterostructure comprising one of or both n and p-channel field effect transistors is described incorporating a plurality of semiconductor layers on a semiconductor substrate wherein one layer is silicon or silicon germanium under tensile strain and one layer is silicon germanium under compressive strain whereby n channel field effect transistors may be formed with a silicon or silicon germanium layer under tension and p-channel field effect transistors may be formed with a silicon germanium layer under compression. The plurality of layers may be common to both subsequently formed p and n-channel field effect transistors which may be interconnected to form CMOS circuits. The invention overcomes the problem of forming separate and different layered structures for p and n-channel field effect transistors for CMOS circuitry on ULSI chips.

Inventors

  • 👤 Khaled E. Ismail
  • 👤 Frank Stern

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 03:52
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D84/00; H10D84/01; H10D84/02; H10D84/80; H10D84/82; H10D84/83; H10D84/85

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 194 words
A layered structure for forming both n and p channel field effect transistors therein comprising: a single crystalline substrate, a first layer of relaxed Si 1-x Ge x formed epitaxially on said substrate where the Ge fraction x is in the range from 0.20 to 0.5, a second layer of n doped Si 1-x Ge x formed epitaxially on said first layer, a third layer of undoped Si 1-x Ge x formed epitaxially on said second layer, a fourth layer selected from the group consisting of silicon and silicon-germanium formed epitaxially on said third layer whereby said fourth layer is under tensile strain, a fifth layer of relaxed Si 1-x Ge x formed epitaxially on said fourth layer, a sixth layer of Si 1-y Ge y formed epitaxially on said fifth layer where the Ge fraction y is in the range from 0.5 to 1.0 and where y-x>0.2 whereby said sixth layer is under compressive strain, a seventh layer of relaxed Si 1-x Ge x formed epitaxially on said sixth layer, an eighth layer of silicon formed epitaxially on said seventh layer, and a ninth layer of dielectric material formed over said eighth layer.
Claim 2
Dependent Claim 194 words
A layered structure for forming both n and p channel field effect transistors therein comprising: a single crystalline substrate, a first layer of relaxed Si 1-x Ge x formed epitaxially on said substrate where the Ge fraction x is in the range from 0.20 to 0.5, a second layer of n doped Si 1-x Ge x formed epitaxially on said first layer, a third layer of undoped Si 1-x Ge x formed epitaxially on said second layer, a fourth layer selected from the group consisting of silicon and silicon-germanium formed epitaxially on said third layer whereby said fourth layer is under tensile strain, a fifth layer of relaxed Si 1-x Ge x formed epitaxially on said fourth layer, a sixth layer of Si 1-y Ge y formed epitaxially on said fifth layer where the Ge fraction y is in the range from 0.5 to 1.0 and where y-x>0.2 whereby said sixth layer is under compressive strain, a seventh layer of relaxed Si 1-x Ge x formed epitaxially on said sixth layer, an eighth layer of silicon formed epitaxially on said seventh layer, and a ninth layer of dielectric material formed over said eighth layer.
Claim 3
Dependent Claim 28 words
The layered structure of claim 1 further including a tenth layer of polysilicon formed over said ninth layer of dielectric material and patterned lithographically to form gate electrodes.
Claim 4
Dependent Claim 37 words
The layered structure of claim 2 further including p regions passing from said sixth layer through said eighth layer on either side of at least one of said gate electrodes to form a p-channel field effect transistor.
Claim 5
Dependent Claim 20 words
The layered structure of claim 2 further including P-type source and drain regions located at least in said sixth layer.
Claim 6
Dependent Claim 37 words
The layered structure of claim 2 further including n regions passing from said fourth layer through said eighth layer on either side of at least one of said gate electrodes to form an n-channel field effect transistor.
Claim 7
Dependent Claim 20 words
The layered structure of claim 2 further including n-type source and drain regions located at least in said fourth layer.
Claim 8
Dependent Claim 37 words
The layered structure of claim 3 further including n regions passing from said fourth layer through said eighth layer on either side of at least one of said gate electrodes to form an n-channel field effect transistor.
Claim 9
Dependent Claim 29 words
The layered structure of claim 7 further including means for interconnecting said gate electrodes, said p regions and said n regions to form complementary metal oxide semiconductor (CMOS) logic.
Claim 10
Dependent Claim 32 words
The layered structure of claim 5 wherein said first layer further includes p type regions below the area of n channel transistors to prevent parasitic currents in or below said first layer.
Claim 11
Dependent Claim 32 words
The layered structure of claim 3 wherein said first layer further includes n type regions below the area of p channel transistors to prevent parasitic currents in or below said first layer.
Claim 12
Dependent Claim 28 words
The layered structure of claim 1 further including a tenth layer of metal formed over said ninth layer of dielectric material and patterned lithographically to form gate electrodes.

References Cited (Backward Citations)

US4710788A Cited
US5006912A Cited
JPS63308966A Cited
DE3731000A1 Cited
US5241197A Cited
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US5155571A Cited
JPH05114708A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-07-09 2000-01-08 2000-07-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-07-09 2004-01-08 2004-07-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-07-09 2008-01-08 2008-07-09 $7700.00 Window Closed / Lapsed

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