Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
194 words
A layered structure for forming both n and p channel field effect transistors therein comprising: a single crystalline substrate, a first layer of relaxed Si 1-x Ge x formed epitaxially on said substrate where the Ge fraction x is in the range from 0.20 to 0.5, a second layer of n doped Si 1-x Ge x formed epitaxially on said first layer, a third layer of undoped Si 1-x Ge x formed epitaxially on said second layer, a fourth layer selected from the group consisting of silicon and silicon-germanium formed epitaxially on said third layer whereby said fourth layer is under tensile strain, a fifth layer of relaxed Si 1-x Ge x formed epitaxially on said fourth layer, a sixth layer of Si 1-y Ge y formed epitaxially on said fifth layer where the Ge fraction y is in the range from 0.5 to 1.0 and where y-x>0.2 whereby said sixth layer is under compressive strain, a seventh layer of relaxed Si 1-x Ge x formed epitaxially on said sixth layer, an eighth layer of silicon formed epitaxially on said seventh layer, and a ninth layer of dielectric material formed over said eighth layer.
Claim 2
Dependent Claim
194 words
A layered structure for forming both n and p channel field effect transistors therein comprising: a single crystalline substrate, a first layer of relaxed Si 1-x Ge x formed epitaxially on said substrate where the Ge fraction x is in the range from 0.20 to 0.5, a second layer of n doped Si 1-x Ge x formed epitaxially on said first layer, a third layer of undoped Si 1-x Ge x formed epitaxially on said second layer, a fourth layer selected from the group consisting of silicon and silicon-germanium formed epitaxially on said third layer whereby said fourth layer is under tensile strain, a fifth layer of relaxed Si 1-x Ge x formed epitaxially on said fourth layer, a sixth layer of Si 1-y Ge y formed epitaxially on said fifth layer where the Ge fraction y is in the range from 0.5 to 1.0 and where y-x>0.2 whereby said sixth layer is under compressive strain, a seventh layer of relaxed Si 1-x Ge x formed epitaxially on said sixth layer, an eighth layer of silicon formed epitaxially on said seventh layer, and a ninth layer of dielectric material formed over said eighth layer.
Claim 3
Dependent Claim
28 words
The layered structure of claim 1 further including a tenth layer of polysilicon formed over said ninth layer of dielectric material and patterned lithographically to form gate electrodes.
Claim 4
Dependent Claim
37 words
The layered structure of claim 2 further including p regions passing from said sixth layer through said eighth layer on either side of at least one of said gate electrodes to form a p-channel field effect transistor.
Claim 5
Dependent Claim
20 words
The layered structure of claim 2 further including P-type source and drain regions located at least in said sixth layer.
Claim 6
Dependent Claim
37 words
The layered structure of claim 2 further including n regions passing from said fourth layer through said eighth layer on either side of at least one of said gate electrodes to form an n-channel field effect transistor.
Claim 7
Dependent Claim
20 words
The layered structure of claim 2 further including n-type source and drain regions located at least in said fourth layer.
Claim 8
Dependent Claim
37 words
The layered structure of claim 3 further including n regions passing from said fourth layer through said eighth layer on either side of at least one of said gate electrodes to form an n-channel field effect transistor.
Claim 9
Dependent Claim
29 words
The layered structure of claim 7 further including means for interconnecting said gate electrodes, said p regions and said n regions to form complementary metal oxide semiconductor (CMOS) logic.
Claim 10
Dependent Claim
32 words
The layered structure of claim 5 wherein said first layer further includes p type regions below the area of n channel transistors to prevent parasitic currents in or below said first layer.
Claim 11
Dependent Claim
32 words
The layered structure of claim 3 wherein said first layer further includes n type regions below the area of p channel transistors to prevent parasitic currents in or below said first layer.
Claim 12
Dependent Claim
28 words
The layered structure of claim 1 further including a tenth layer of metal formed over said ninth layer of dielectric material and patterned lithographically to form gate electrodes.