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US5530288A Expired / Lapsed US ⏱️ 0.0 years remaining

Passive interposer including at least one passive electronic component

Assignee: International Business Machines Corp
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Filing: 1994-10-12
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Granted: 1996-06-25
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Expires: 2014-10-12
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Abstract

Abstract An interposer including a first face and second face opposite the first face and at least one electrically conductive plane. The at least one electrically conductive plane functions as a power, ground, or signal plane. At least one electrically insulating plane is positioned on opposite sides of the at least one electrically conductive plane. A plurality of plated through holes are formed through the at least one electrically conductive planes and the at least two electrically insulating planes. The through holes are selectively electrically joined to the at least one electrically conductive plane. At least one passive electronic structure is positioned within the interposer structure.

Inventors

  • 👤 David B. Stone

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 10:30
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K1/162; H05K1/165; H10; H10W; H10W44/00; H10W44/401; H10W44/501; H10W44/601; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/00; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/093; H05K2201/09309; H05K2201/095; H05K2201/096; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/04; H05K2203/0455; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10S; Y10S257/00; Y10S257/924

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 92 words
An interposer, comprising: a first face and a second face opposite said first face; at least one electrically conductive plane functioning as a power, ground, or signal plane; an electrically insulating plane positioned on opposite sides of said at least one electrically conductive plane; a plurality of plated through holes formed through the at least one electrically conductive plane and the at least one electrically insulating plane, said through holes being selectively joined to said at least one electrically conductive plane; and at least one passive electronic component positioned within the interposer.
Claim 2
Dependent Claim 92 words
An interposer, comprising: a first face and a second face opposite said first face; at least one electrically conductive plane functioning as a power, ground, or signal plane; an electrically insulating plane positioned on opposite sides of said at least one electrically conductive plane; a plurality of plated through holes formed through the at least one electrically conductive plane and the at least one electrically insulating plane, said through holes being selectively joined to said at least one electrically conductive plane; and at least one passive electronic component positioned within the interposer.
Claim 3
Dependent Claim 30 words
An interposer according to claim 1, wherein said at least one passive electronic component is selected from the group consisting of an inductor a resistor, a capacitor, and a conductor.
Claim 4
Dependent Claim 197 words
An electronic package, comprising: an interposer, comprising: a first face and a second face opposite said first face; at least one electrically conductive plane functioning as a power, ground, or signal plane; an electrically insulating plane positioned on each side of said at least one electrically conductive plane; a plurality of plated through holes formed through the at least one electrically conductive plane and the electrically insulating planes, said through holes being selectively joined to said at least one electrically conductive plane; and at least one passive electronic component positioned within the interposer; at least one first component mounted to said first face of said interposer, said at least one first component including a plurality of ground, power, and signal sites electrically connected to said plated through holes of said interposer; and at least one second component mounted to said second face of said interposer, said at least one second component including a plurality of ground, power, and signal sites electrically connected to said plated through holes of said interposer; wherein said interposer provides selective connections between said ground, power, and signal sites of said at least one first component and said at least one second component.
Claim 5
Dependent Claim 197 words
An electronic package, comprising: an interposer, comprising: a first face and a second face opposite said first face; at least one electrically conductive plane functioning as a power, ground, or signal plane; an electrically insulating plane positioned on each side of said at least one electrically conductive plane; a plurality of plated through holes formed through the at least one electrically conductive plane and the electrically insulating planes, said through holes being selectively joined to said at least one electrically conductive plane; and at least one passive electronic component positioned within the interposer; at least one first component mounted to said first face of said interposer, said at least one first component including a plurality of ground, power, and signal sites electrically connected to said plated through holes of said interposer; and at least one second component mounted to said second face of said interposer, said at least one second component including a plurality of ground, power, and signal sites electrically connected to said plated through holes of said interposer; wherein said interposer provides selective connections between said ground, power, and signal sites of said at least one first component and said at least one second component.
Claim 6
Dependent Claim 42 words
An electronic package according to claim 3, wherein said at least one first component and said at least one second component are selected from the group consisting of a chip carrier, an interposer, a circuit board, a circuit card, and a chip.
Claim 7
Dependent Claim 26 words
An electronic package according to claim 3, wherein said at least one first component and said at least one second component are any surface mountable components.
Claim 8
Dependent Claim 31 words
An electronic package according to claim 3, wherein said at least one first component and said at least one second component are attached to said interposer with a surface mount process.
Claim 9
Dependent Claim 47 words
An electronic package according to claim 3, wherein said at least one first component and said at least one second component are mounted on said interposer with a surface mount process selected from the group consisting of solder joints, BGA, conductive adhesive, conductive film, thermal compression bonding.
Claim 10
Dependent Claim 31 words
An electronic package according to claim 3, wherein said at least one passive electronic component is selected from the group consisting of an inductor a resistor, a capacitor, and a conductor.
Claim 11
Dependent Claim 47 words
An interposer, comprising: alternating electrically conducting and insulating planes; a plurality of plated through holes formed through the electrically conductive and electrically insulating planes; and a plane including at least one passive electronic component selected from the group consisting of a resistor, a capacitor, and an inductor.
Claim 12
Dependent Claim 47 words
An interposer, comprising: alternating electrically conducting and insulating planes; a plurality of plated through holes formed through the electrically conductive and electrically insulating planes; and a plane including at least one passive electronic component selected from the group consisting of a resistor, a capacitor, and an inductor.

References Cited (Backward Citations)

US4349862A Cited
US4811082A Cited
US4803595A Cited
US4744008A Cited
US5101323A Cited
US5177594A Cited
US5258648A Cited
US5272600A Cited
US5404044A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-06-25 1999-12-25 2000-06-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-06-25 2003-12-25 2004-06-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-06-25 2007-12-25 2008-06-25 $7700.00 Window Closed / Lapsed

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