Patent US5525402A successfully refreshed from Google Patents.
US5525402A
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US
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Ceramic substrate and manufacturing method thereof
Assignee: Panasonic Holdings Corp
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Filing: 1995-02-24
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Granted: 1996-06-11
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Expires: 2015-02-24
Abstract
Abstract The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
Inventors
- 👤 Yoshifumi Nakamura
- 👤 Yoshihiro Bessho
- 👤 Satoru Yuhaku
- 👤 Yasuhiko Hakotani
- 👤 Minehiro Itagaki
- 👤 Kazuhiro Miura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 18:53
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/46; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/035; H05K2201/0364; H05K2201/0367; H05K3/4611; H05K3/4626; H05K3/4629; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24802; Y10T428/24917; Y10T428/24926
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
39 words
A ceramic substrate having a plurality of bumps and a plurality of via-holes, wherein the bumps are made of a sintered body of a bump forming paste and the bumps have a diameter larger than that of the via-holes.
Claim 2
Dependent Claim
39 words
A ceramic substrate having a plurality of bumps and a plurality of via-holes, wherein the bumps are made of a sintered body of a bump forming paste and the bumps have a diameter larger than that of the via-holes.
Claim 3
Dependent Claim
18 words
A ceramic substrate according to claim 1, the plurality of bumps each have a form of a pillar.
Claim 4
Dependent Claim
27 words
A ceramic substrate according to claim 1, wherein at least one of the plurality of via-holes is filled with a sintered body of the bump forming paste.
Claim 5
Dependent Claim
32 words
A ceramic substrate according to claim 3, wherein the bump forming paste is a conductive paste including at least one component selected from the group consisting of Ag, Pd, Pt and Cu.
Claim 6
Dependent Claim
38 words
A ceramic substrate according to claim 3, wherein the bump forming paste is a metal oxide paste including CuO as a major component and the bumps are made of reduced and sintered body of the bump forming paste.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-11 | 1999-12-11 | 2000-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-11 | 2003-12-11 | 2004-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-11 | 2007-12-11 | 2008-06-11 | $7700.00 | Window Closed / Lapsed |