Patent US5521433A successfully refreshed from Google Patents.
US5521433A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC card including a substrate having improved strength and heat radiation properties
Assignee: Mitsubishi Electric Corp
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Filing: 1995-03-22
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Granted: 1996-05-28
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Expires: 2015-03-22
Abstract
Abstract An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.
Inventors
- 👤 Teru Hirata
- 👤 Shigeo Onoda
- 👤 Tetsuro Washida
- 👤 Yasuhiro Murasawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:29
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07728; G06K19/02; G06K19/0773; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H05K1/036; H05K1/05; H05K1/056; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/0275; H05K2201/0281
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
48 words
An IC card, comprising: a substrate having a metal fiber resin material layer including a mixture of a resin and metal fibers and a conductive pattern electrically insulated from said metal fiber resin material layer; an IC mounted on said substrate; and a sheathing member sheathing said substrate.
Claim 2
Dependent Claim
48 words
An IC card, comprising: a substrate having a metal fiber resin material layer including a mixture of a resin and metal fibers and a conductive pattern electrically insulated from said metal fiber resin material layer; an IC mounted on said substrate; and a sheathing member sheathing said substrate.
Claim 3
Dependent Claim
24 words
The IC card according to claim 1 wherein a resist film is interposed between said metal fiber resin material layer and said conductive pattern.
Claim 4
Dependent Claim
35 words
The IC card according to claim 1 wherein said sheathing member includes a frame made of said metal fiber resin material for holding said substrate, and panels attached to said frame opposed to said substrate.
Claim 5
Dependent Claim
19 words
The IC card according to claim 3 wherein said metal fiber resin material layer and said frame are unitary.
Claim 6
Dependent Claim
24 words
The IC card according to claim 1 wherein said substrate has a metal layer on which said metal fiber resin material layer is disposed.
Claim 7
Dependent Claim
54 words
The IC card according to claim 1 wherein said sheathing member is a resin material molded into a shape of a card, said substrate includes a metal layer on which said metal fiber resin material layer is deposited, wherein at least a part of said metal layer is exposed outside of said IC card.
Claim 8
Dependent Claim
49 words
The IC card according to claim 6 wherein said metal layer and said conductive pattern are electrically connected to each other and a terminal portion for contacting a connecting terminal of an external device is located in a part of said metal layer exposed outside of said IC card.
Claim 9
Dependent Claim
49 words
The IC card according to claim 6 including a connector connected to one end of said substrate and a thick-walled portion of said metal layer located on at least one other end of said substrate, and wherein said substrate has a center of gravity shifted toward said thick-walled portion.
Claim 10
Dependent Claim
47 words
An IC card comprising: a substrate having a conductive pattern; an IC mounted on said substrate; a frame made of a metal fiber resin material including a mixture of a resin and metal fibers holding said substrate; and panels attached to said frame opposed to said substrate.
Claim 11
Dependent Claim
47 words
An IC card comprising: a substrate having a conductive pattern; an IC mounted on said substrate; a frame made of a metal fiber resin material including a mixture of a resin and metal fibers holding said substrate; and panels attached to said frame opposed to said substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-28 | 1999-11-27 | 2000-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-28 | 2003-11-27 | 2004-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-28 | 2007-11-27 | 2008-05-28 | $7700.00 | Window Closed / Lapsed |