US5520752A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composite solders
Assignee: United States Department of the Army
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Filing: 1994-06-20
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Granted: 1996-05-28
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Expires: 2014-06-20
Abstract
Abstract A solder composition and method of soldering using composite solders comprising a solder alloy and intermetallic filler particles. The intermetallic filler particles are lead-free, have high strength, wet and disperse well in solder joints, remain uniformly distributed and resist degradation on long-term aging. When added to commercial bulk or paste solders, the intermetallic particles reduce the lead content of solder joints by consuming volume in lead-tin solder, and improve the mechanical properties of the solder by inhibiting localized shear deformation and interfering with crack growth.
Inventors
- 👤 George K. Lucey, Jr.
- 👤 James A. Wasynczuk
- 👤 Roger B. Clough
- 👤 Jennie S. Hwang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:12
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262; B23K35/02; B23K35/0222; B23K35/0244; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12486
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
128 words
A soldering compound, comprising a lead-free solder alloy component selected from the group consisting of Sn--Ag--In; Sn--Ag--In--Bi; Sn--Ag--Bi; and Sn--Ag--Bi--Cu, the solder alloy component having Sn in amount of about 86 to about 97%, Ag in an an amount of about 0.3 to about 4.5%, In in an amount of 0.00 to about 9.3, Bi in an amount of 0.00 to about 4.8%, and Cu in an amount of 0.00 to about 5% on a weight basis, and the balance being an intermetallic filler selected from the group consisting of Cu 3 Sn, Cu 6 Sn 5 , Ni 3 Sn 2 , Ni 3 Sn 4 , Ni 3 Sn 7 , AuSn, AuSn 2 , AuSn 4 , FeSn, FeSn 2 , and Ag 3 Sn.
Claim 2
Dependent Claim
128 words
A soldering compound, comprising a lead-free solder alloy component selected from the group consisting of Sn--Ag--In; Sn--Ag--In--Bi; Sn--Ag--Bi; and Sn--Ag--Bi--Cu, the solder alloy component having Sn in amount of about 86 to about 97%, Ag in an an amount of about 0.3 to about 4.5%, In in an amount of 0.00 to about 9.3, Bi in an amount of 0.00 to about 4.8%, and Cu in an amount of 0.00 to about 5% on a weight basis, and the balance being an intermetallic filler selected from the group consisting of Cu 3 Sn, Cu 6 Sn 5 , Ni 3 Sn 2 , Ni 3 Sn 4 , Ni 3 Sn 7 , AuSn, AuSn 2 , AuSn 4 , FeSn, FeSn 2 , and Ag 3 Sn.
Claim 3
Dependent Claim
18 words
The compound of claim 1, wherein the solder alloy component comprises 87-89% Sn, 2.7-3.9% Ag, and 3.3-9.3% In.
Claim 4
Dependent Claim
20 words
The compound of claim 1, wherein the solder alloy component comprises 89-93% Sn, 2.4-3.6% Ag, 1.5-8.8% In, and 1.5-4.8% Bi.
Claim 5
Dependent Claim
21 words
The compound of claim 1, wherein the solder alloy component comprises 86-94% Sn, 0.3-0.7% Ag, 2.5-5 9.0% In, and 3.0-5.0% Cu.
Claim 6
Dependent Claim
18 words
The compound of claim 1, wherein the solder alloy component comprises 87-97% Sn, 2.5-4.5% Ag, and 1.0-4.8% Bi.
Claim 7
Dependent Claim
20 words
The compound of claim 1, wherein the solder alloy component comprises 90-94% Sn, 0.3-0.5% Ag, 2.0-3.0% Bi, and 3.0-5.0% Cu.
Claim 8
Dependent Claim
17 words
The compound of claim 1, wherein the intermetallic filler comprises 30% by volume of the solder compound.
Claim 9
Dependent Claim
19 words
The solder compound of claim 1 wherein said solder alloy component is in the form of a bulk solder.
Claim 10
Dependent Claim
19 words
The solder compound of claim 1 wherein said solder alloy component is in the form of a paste solder.
References Cited (Backward Citations)
US2004372A
Cited
US2250099A
Cited
US3563732A
Cited
US3827884A
Cited
US4778772A
Cited
JPS54152493A
Cited
US4409333A
Cited
US4824009A
Cited
US4453977A
Cited
US4518662A
Cited
US4650548A
Cited
US4832809A
Cited
US5011658A
Cited
US5094700A
Cited
US5066544A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-28 | 1999-11-27 | 2000-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-28 | 2003-11-27 | 2004-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-28 | 2007-11-27 | 2008-05-28 | $7700.00 | Window Closed / Lapsed |