Patent US5516403A successfully refreshed from Google Patents.
US5516403A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reversing orientation of sputtering screen to avoid contamination
Assignee: Applied Materials Inc
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Filing: 1994-12-16
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Granted: 1996-05-14
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Expires: 2014-12-16
Abstract
Abstract A sputtering apparatus deposits a layer of material on a substrate. The apparatus includes a screening member, such as a plate collimator or a tube collimator, located between the target and substrate. A motor drive reverses the respective positions of the two opposite sides of the screening device which respectively face the substrate and the target.
Inventors
- 👤 John Forster
- 👤 James S. Van Gogh
- 👤 Avi Tepman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 03:33
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; H01J37/3411; H01J37/3447; H10; H10P; H10P14/00; H10P14/20; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/56; C23C14/564
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
122 words
A sputtering chamber for depositing material on a semiconductor substrate, the chamber comprising: a sputtering target; a substrate support for receiving a semiconductor substrate thereon; a target flux screening member, positioned between the target and the substrate support, having first and second opposite sides and having at least one opening extending between said first and second sides; and a motor drive mechanism, coupled to said target flux screening member, for orienting the screening member so that the first and second sides face the target and the substrate support, respectively in a first orientation, and for subsequently reversing the orientation of the screening member so that the first and second sides face the substrate support and the target, respectively in a second orientation.
Claim 2
Dependent Claim
122 words
A sputtering chamber for depositing material on a semiconductor substrate, the chamber comprising: a sputtering target; a substrate support for receiving a semiconductor substrate thereon; a target flux screening member, positioned between the target and the substrate support, having first and second opposite sides and having at least one opening extending between said first and second sides; and a motor drive mechanism, coupled to said target flux screening member, for orienting the screening member so that the first and second sides face the target and the substrate support, respectively in a first orientation, and for subsequently reversing the orientation of the screening member so that the first and second sides face the substrate support and the target, respectively in a second orientation.
Claim 3
Dependent Claim
53 words
The sputtering chamber of claim 1, wherein said motor drive mechanism includes an axle extending from said target flux screening member; and a motor connected to the axle so that the rotation of the axle by the motor changes the orientation of the screening member from the first orientation to the second orientation.
Claim 4
Dependent Claim
31 words
The sputtering chamber of claim, wherein said first and second sides have a common axis of symmetry; and said axle is perpendicular to the axis of the first and second sides.
Claim 5
Dependent Claim
13 words
The sputtering chamber of claim 1, wherein said screening member is a tube.
Claim 6
Dependent Claim
14 words
The sputtering chamber of claim 1, wherein said screening member is a plate collimator.
Claim 7
Dependent Claim
29 words
The sputtering chamber of claim 1, wherein said motor drive mechanism alternates positions of said first side and said second side after each substrate is processed in the chamber.
Claim 8
Dependent Claim
33 words
The sputtering apparatus of claim 1, wherein said motor drive mechanism alternates the positions of said first side and said second side after every predetermined number of substrates is processed in the chamber.
Claim 9
Dependent Claim
33 words
The sputtering apparatus of claim 1, wherein said motor drive mechanism alternates the positions of said first side and said second side between two deposition steps performed on the substrate in the chamber.
Claim 10
Independent Claim
99 words
A method of sputter depositing material on a semiconductor substrate, comprising: providing a sputtering target and a semiconductor substrate within the chamber; positioning a target flux screening member between the target and the substrate support, said screening member having first and second opposite sides and having at least one opening extending between said first and second sides; initially orienting the screening member so that the first and second sides face the target and the substrate support, respectively; and then subsequently orienting the screening member so that the first and second sides face the substrate support and the target, respectively.
Claim 11
Independent Claim
99 words
A method of sputter depositing material on a semiconductor substrate, comprising: providing a sputtering target and a semiconductor substrate within the chamber; positioning a target flux screening member between the target and the substrate support, said screening member having first and second opposite sides and having at least one opening extending between said first and second sides; initially orienting the screening member so that the first and second sides face the target and the substrate support, respectively; and then subsequently orienting the screening member so that the first and second sides face the substrate support and the target, respectively.
Claim 12
Dependent Claim
26 words
The method of claim 9, wherein the positioning step includes attaching the screening member to an axle; and the subsequent orienting step includes rotating the axle.
Claim 13
Dependent Claim
39 words
The method of claim 9, further including the step of periodically reversing the orientation of the first and second sides of the screening member by periodically performing either the initial orienting step or the subsequent orienting step, in alternation.
Claim 14
Dependent Claim
29 words
The method of claim 11, wherein the periodically reversing step further includes reversing the orientations of the first and second sides after each substrate is processed in the chamber.
Claim 15
Dependent Claim
32 words
The method of claim 11, wherein the periodically reversing step further includes reversing the orientations of the first and second sides after a predetermined number of substrates is processed in the chamber.
Claim 16
Dependent Claim
34 words
The method of claim 11, further comprising the steps of: after the initial orienting step, sputter depositing material on the substrate; and after the subsequent reversing step, sputter depositing additional material on the substrate.
Claim 17
Dependent Claim
12 words
The method of claim 9, wherein the screening member is a tube.
Claim 18
Dependent Claim
13 words
The method of claim 9, wherein the screening member is a plate collimator.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-14 | 1999-11-13 | 2000-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-14 | 2003-11-13 | 2004-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-14 | 2007-11-13 | 2008-05-14 | $7700.00 | Window Closed / Lapsed |