Patent US5512780A successfully refreshed from Google Patents.
US5512780A
Expired / Lapsed
US
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Inorganic chip-to-package interconnection circuit
Assignee: Sun Microsystems Inc
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Filing: 1994-09-09
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Granted: 1996-04-30
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Expires: 2014-09-09
Abstract
Abstract An inorganic chip-to-package interconnection circuit is described. The circuit has a set of electrical conductors that are held together by a set of insulating inorganic tie bars. The circuit constitutes a high-density chip-to-package interconnection circuit that does not absorb vapor or volatile gases. A variety of methods for forming the circuit are described. Advantageously, the methods utilize known processing techniques.
Inventors
- 👤 Howard L. Davidson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/479; H10W70/60; H10W70/67; H10W70/688; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
45 words
A chip-to-package interconnection circuit comprising: a plurality of electrical conductors in a predetermined configuration; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in said predetermined configuration, wherein each of said tie bars is between 25 and 50 microns thick.
Claim 2
Dependent Claim
45 words
A chip-to-package interconnection circuit comprising: a plurality of electrical conductors in a predetermined configuration; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in said predetermined configuration, wherein each of said tie bars is between 25 and 50 microns thick.
Claim 3
Dependent Claim
45 words
A chip-to-package interconnection circuit comprising: a plurality of electrical conductors in a predetermined configuration; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in said predetermined configuration, wherein each of said tie bars is between 30 and 70 microns wide.
Claim 4
Dependent Claim
45 words
A chip-to-package interconnection circuit comprising: a plurality of electrical conductors in a predetermined configuration; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in said predetermined configuration, wherein each of said tie bars is between 30 and 70 microns wide.
Claim 5
Dependent Claim
131 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor, said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a housing fixture positioned over said first surface of said base housing, said housing fixture defining an interior volume vacuum environment; a plurality of electrical conductors positioned within said interior volume vacuum environment, said plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 25 and 50 microns thick.
Claim 6
Dependent Claim
131 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor, said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a housing fixture positioned over said first surface of said base housing, said housing fixture defining an interior volume vacuum environment; a plurality of electrical conductors positioned within said interior volume vacuum environment, said plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 25 and 50 microns thick.
Claim 7
Dependent Claim
131 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor, said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a housing fixture positioned over said first surface of said base housing, said housing fixture defining an interior volume vacuum environment; a plurality of electrical conductors positioned within said interior volume vacuum environment, said plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 30 and 70 microns wide.
Claim 8
Dependent Claim
131 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor, said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a housing fixture positioned over said first surface of said base housing, said housing fixture defining an interior volume vacuum environment; a plurality of electrical conductors positioned within said interior volume vacuum environment, said plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 30 and 70 microns wide.
Claim 9
Dependent Claim
98 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 25 and 50 microns thick.
Claim 10
Dependent Claim
98 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 25 and 50 microns thick.
Claim 11
Dependent Claim
98 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor, said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 30 and 70 microns wide.
Claim 12
Dependent Claim
98 words
A semiconductor package, comprising: a base housing including a first surface and a second surface, said first surface including a semiconductor positioned thereon and electrical contact pads positioned adjacent to said semiconductor, said second surface including external pins, said housing including hermetic feedthroughs electrically connecting said electrical contact pads to said external pins; a plurality of electrical conductors electrically connecting said semiconductor and said electrical contact pads; and a plurality of insulating inorganic tie bars supporting said plurality of electrical conductors in a predetermined configuration, wherein each of said tie bars is between 30 and 70 microns wide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-30 | 1999-10-30 | 2000-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-30 | 2003-10-30 | 2004-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-30 | 2007-10-30 | 2008-04-30 | $7700.00 | Window Closed / Lapsed |