US5509815A — Solder medium for circuit interconnection

Claim 1

Independent Claim 140 words

An electronic device comprising a pair of components with mating contact pads, said contact pads being in juxtaposed alignment each to another, and mating solder joints electrically and mechanically interconnecting said mating contact pads, wherein each of said solder joints is a high-aspect-ratio subdivided solder joint structure comprising a plurality of subdivided solder paths between said mating contact pads, said solder joints being formed by embedding a plurality of solder wires longitudinally in an insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices, the length of said slices being determined by a spacing between said mating pads, said ratio between the length of each wire and its diameter being at least 2:1.

Claim 2

Dependent Claim 140 words

An electronic device comprising a pair of components with mating contact pads, said contact pads being in juxtaposed alignment each to another, and mating solder joints electrically and mechanically interconnecting said mating contact pads, wherein each of said solder joints is a high-aspect-ratio subdivided solder joint structure comprising a plurality of subdivided solder paths between said mating contact pads, said solder joints being formed by embedding a plurality of solder wires longitudinally in an insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices, the length of said slices being determined by a spacing between said mating pads, said ratio between the length of each wire and its diameter being at least 2:1.

Claim 3

Dependent Claim 13 words

The device of claim 1, in which said ratio is at least 4:1.

Claim 4

Dependent Claim 11 words

The device of claim 1, in which said ratio is ≧30:1.

Claim 5

Dependent Claim 22 words

The device of claim 1, in which the length of each wire is within a range of from 1 to 500 mils

Claim 6

Dependent Claim 15 words

The device of claim 1, in which the diameter of each wire is ≦10 μm.

Claim 7

Dependent Claim 15 words

The device of claim 5, in which the diameter of each wire is ≦100 nanometers.

Claim 8

Dependent Claim 18 words

The device of claim 1, in which said solder paths number is at least 4 per contact pad.

Claim 9

Dependent Claim 16 words

The device of claim 7, in which said solder paths number is ≧30 per contact pad.

Claim 10

Independent Claim 175 words

A method of fabricating an electronic device including interconnecting one component of said electronic device to another component of said device, said components having aligned mating contact pads, which comprises placing a thin electrically insulating body between the surfaces of said mating pads, said body being formed by embedding a plurality of solder wires longitudinally in an insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices to obtain said body, the length of said slices being determined by a spacing between said mating pads, and wherein the placement of the body is such that opposite ends of at least some of said plurality of solder wires contact the surfaces of the mating pads, at least two of said wires contacting each pair of said mating pads, and applying heat energy to fuse those ends of the wires to the pads which are being contacted by the wires.

Claim 11

Independent Claim 175 words

A method of fabricating an electronic device including interconnecting one component of said electronic device to another component of said device, said components having aligned mating contact pads, which comprises placing a thin electrically insulating body between the surfaces of said mating pads, said body being formed by embedding a plurality of solder wires longitudinally in an insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices to obtain said body, the length of said slices being determined by a spacing between said mating pads, and wherein the placement of the body is such that opposite ends of at least some of said plurality of solder wires contact the surfaces of the mating pads, at least two of said wires contacting each pair of said mating pads, and applying heat energy to fuse those ends of the wires to the pads which are being contacted by the wires.

Claim 12

Dependent Claim 22 words

The method of claim 9, in which the ratio between the length of each wire and its diameter is at least 2:1.

Claim 13

Dependent Claim 13 words

The method of claim 9, in which said ratio is at least 8:1.

Claim 14

Dependent Claim 13 words

The method of claim 9, in which said ratio is at least 30:1.

Claim 15

Dependent Claim 15 words

The method of claim 9, in which the diameter of each wire is ≦50 μm.

Claim 16

Dependent Claim 15 words

The method of claim 13 in which the diameter of each wire is ≦100 nanometers.

Claim 17

Dependent Claim 22 words

The method of claim 9, in which the length of each wire is within a range of from 1 to 500 mils.

Claim 18

Independent Claim 157 words

A method of fabricating an electronic device including interconnecting one component of said electronic device to another component of said device, said components having aligned mating contact pads, which comprises placing a thin electrically insulating body between the surfaces of said mating pads, said body having a plurality of solder wires embedded in an insulating matrix such that opposite ends of at least some wires contact the surfaces of the mating pads, at least two of said wires contacting each pair of said mating pads, and applying heat energy to fuse those ends of the wires to the pads which are being contacted by the wires, and wherein said wires are formed by magnetically aligning solder-coated magnetic particles within a sheet of compliant or dissolvable matrix into a plurality of columns arranged transversely to the major surfaces of the sheet, and fusing the solder of individual particles forming continuously electrically conductive wires extending traversely of the sheet.

Claim 19

Independent Claim 157 words

A method of fabricating an electronic device including interconnecting one component of said electronic device to another component of said device, said components having aligned mating contact pads, which comprises placing a thin electrically insulating body between the surfaces of said mating pads, said body having a plurality of solder wires embedded in an insulating matrix such that opposite ends of at least some wires contact the surfaces of the mating pads, at least two of said wires contacting each pair of said mating pads, and applying heat energy to fuse those ends of the wires to the pads which are being contacted by the wires, and wherein said wires are formed by magnetically aligning solder-coated magnetic particles within a sheet of compliant or dissolvable matrix into a plurality of columns arranged transversely to the major surfaces of the sheet, and fusing the solder of individual particles forming continuously electrically conductive wires extending traversely of the sheet.

Claim 20

Dependent Claim 30 words

The method of claim 9, in which prior to said placing of the insulating body, the insulating matrix is removed from around the ends of the plurality of solder wires.

Claim 21

Dependent Claim 31 words

The method of claim 9, in which prior to said placing of the insulating body, the ends of the wires are built-up to project above the major surfaces of said body.

Claim 22

Dependent Claim 23 words

The method of claim 9, in which said matrix material is dissolved away and the elongated solder wires are further melted and fused.

Claim 23

Dependent Claim 113 words

A solder medium for interconnecting mating pads of circuit components, which comprises a sheet of an insulating matrix material and a plurality of solder-containing wires distributed throughout the matrix transversely to opposite major surfaces of the sheet, wherein said sheet is formed by embedding the plurality of solder-containing wires longitudinally in the insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder-containing wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices, the length of said slices being determined by a spacing between said mating pads, each of said wires having a high-aspect of length-to-diameter ratio.

Claim 24

Dependent Claim 113 words

A solder medium for interconnecting mating pads of circuit components, which comprises a sheet of an insulating matrix material and a plurality of solder-containing wires distributed throughout the matrix transversely to opposite major surfaces of the sheet, wherein said sheet is formed by embedding the plurality of solder-containing wires longitudinally in the insulating matrix, deforming said insulating matrix so as to elongate said insulating matrix and to reduce the diameter of said plurality of solder-containing wires, and cutting said elongated insulating matrix transverse to its longitudinal axis into slices, the length of said slices being determined by a spacing between said mating pads, each of said wires having a high-aspect of length-to-diameter ratio.

Claim 25

Dependent Claim 14 words

The solder medium of claim 20, in which said ratio is at least 2:1.

Claim 26

Dependent Claim 14 words

The solder medium of claim 20, in which said ratio is at least 8:1.

Claim 27

Dependent Claim 12 words

The solder medium of claim 20 in which said ratio is ≧30:1.

Claim 28

Dependent Claim 23 words

The solder medium of claim 20, in which the length of each wire falls within a range of from 1 to 500 mils.

Claim 29

Dependent Claim 16 words

The solder medium of claim 20, in which the diameter of each wire is ≦50 μm.

Claim 30

Dependent Claim 13 words

The solder medium of claim 25, in which said diameter is ≦100 nanometers.

Claim 31

Dependent Claim 24 words

The solder medium of claim 20, in which the wires are distributed in a density allowing at least 2 solder connections per contact pad.

Claim 32

Dependent Claim 18 words

The solder medium of claim 27, in which said density of solder connections is ≧30 per contact pad.

Claim 33

Independent Claim 112 words

A method of preparing a solder medium for use in circuit interconnections wherein contact pads on one component of a circuit are connected to mating pads on another component of the circuit, which comprises forming an elongated body, said elongated body being formed by longitudinally embedding a plurality of solder wires in an electrically insulating plastically deformable matrix to form an embedded body, deforming the embedded body longitudinally so as to elongate the embedded body and to reduce the diameter of the solder wires, and cutting said elongated embedded body transverse to its longitudinal axis into slices the length of said slices being determined by a spacing between said mating contact pads.

Claim 34

Independent Claim 112 words

A method of preparing a solder medium for use in circuit interconnections wherein contact pads on one component of a circuit are connected to mating pads on another component of the circuit, which comprises forming an elongated body, said elongated body being formed by longitudinally embedding a plurality of solder wires in an electrically insulating plastically deformable matrix to form an embedded body, deforming the embedded body longitudinally so as to elongate the embedded body and to reduce the diameter of the solder wires, and cutting said elongated embedded body transverse to its longitudinal axis into slices the length of said slices being determined by a spacing between said mating contact pads.

Claim 35

Dependent Claim 40 words

The method of claim 29, in which the density of the solder wires in the slice is such that, when the slice is positioned between the components, there are at least two wires in contact with the mating contact pads.

Claim 36

Dependent Claim 18 words

The method of claim 29, in which the thickness of each slice ranges from 1 to 500 mils.

Claim 37

Dependent Claim 15 words

The method of claim 29, in which said deformation step is repeated at least once.

Claim 38

Dependent Claim 40 words

The method of claim 29, in which prior to said deforming step, said embedded body is combined with at least one more embedded body and embedded in a further volume of said plastically deformable matrix forming a larger embedded body.

Claim 39

Dependent Claim 19 words

The method of claim 33, in which the deformation of said larger embedded body is repeated at least once.

Claim 40

Dependent Claim 44 words

The method of claim 29, in which said longitudinally deformed body is combined with at least one more deformed body and embedded in a further amount of said plastically deformable matrix forming a combined embedded body, and deforming longitudinally the combined embedded body further.

Claim 41

Dependent Claim 19 words

The method of claim 35, in which said deformation of the combined embedded body is repeated at least once.

Claim 42

Dependent Claim 21 words

The method of claim 35, in which said formation and deformation of the combined embedded body is repeated at least once.

Claim 43

Dependent Claim 22 words

The method of claim 29, in which the ratio between the length of each wire and its diameter is at least 2:1.

Claim 44

Dependent Claim 13 words

The method of claim 38, in which said ratio is at least 8:1.

Claim 45

Dependent Claim 11 words

The method of claim 38, in which said ratio is ≧30:1.

Claim 46

Dependent Claim 15 words

The method of claim 38, in which the diameter of each wire is ≦50 μm.

Claim 47

Dependent Claim 16 words

The method of claim 41, in which the diameter of each wire is ≦100 one nanometers.

Claim 48

Independent Claim 138 words

A method of preparing a solder medium for use in circuit interconnections wherein contact pads on one component of a circuit are connected to mating pads on another component of the circuit, which comprises forming an elongated body having a plurality of elongated solder wires supported within a matrix of an insulating material, said wires extended longitudinally of the body and being separated each from another by said matrix, and cutting said elongated embedded body transverse to its longitudinally axis into slices, the length of said slices being determined by a spacing between said mating contact pads, and wherein said elongated body is formed by embedding a plurality of solder particles in a matrix of an electrically insulating material forming a composite structure into an elongated structure in which said particles are deformed into elongated wires or ribbons.

Claim 49

Independent Claim 138 words

A method of preparing a solder medium for use in circuit interconnections wherein contact pads on one component of a circuit are connected to mating pads on another component of the circuit, which comprises forming an elongated body having a plurality of elongated solder wires supported within a matrix of an insulating material, said wires extended longitudinally of the body and being separated each from another by said matrix, and cutting said elongated embedded body transverse to its longitudinally axis into slices, the length of said slices being determined by a spacing between said mating contact pads, and wherein said elongated body is formed by embedding a plurality of solder particles in a matrix of an electrically insulating material forming a composite structure into an elongated structure in which said particles are deformed into elongated wires or ribbons.

Claim 50

Dependent Claim 59 words

The method of claim 43, in which said elongated structure is combined with at least one more elongated structure and embedded in a further volume of said plastically deformable matrix forming an embedded body, and the embedded body is further deformed longitudinally so as to elongate the embedded body and to further reduce the diameter of the solder wires.

Claim 51

Dependent Claim 20 words

The method of claim 29, in which said matrix material is selected from plastically deformable materials and easily dissolvable materials.

Claim 52

Dependent Claim 26 words

The method of claim 45, in which said matrix material is selected from the group of compliant materials consisting of thermoplastic polymers, plasticized rubber and clay.

Claim 53

Dependent Claim 39 words

The method of claim 45, in which said matrix material is selected from the group of dissolvable materials consisting of gelatine, glucose, fructose and honey based materials, and of polyvinyl alcohol, polyacrylamide, polyvinyl pyrrolidinone, buthylvinyl alcohol and polyvinyl acetate.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1999-04-23	1999-10-23	2000-04-23	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2003-04-23	2003-10-23	2004-04-23	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2007-04-23	2007-10-23	2008-04-23	$7700.00	Window Closed / Lapsed

Solder medium for circuit interconnection

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