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US5508631A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor test chip with on wafer switching matrix

Assignee: Microsemi Semiconductor ULC
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Filing: 1994-10-27
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Granted: 1996-04-16
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Expires: 2014-10-27
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Abstract

Abstract A semiconductor test chip has an array of active semiconductor devices to be individually tested, a number of test lines for connection to external test circuitry, an enabling circuit associated with each device for selectively connecting it to the test lines, an input for receiving an instruction identifying a device that it is desired to test, and a decoder incorporated into the chip for receiving the instruction from the input. The decoder is connected by enabling lines to the individual test devices so that on receipt of an instruction the decoder enables the identified test device such that it becomes connected to the test lines. This circuit is more efficient and less cumbersome than the prior art.

Inventors

  • 👤 Tajinder Manku
  • 👤 Wenyi Song

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 08:42
CPC Classifications
G; G06; G06F; G06F11/00; G06F11/22; G06F11/26; G06F11/273; G06F11/2733; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2884

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 265 words
A semiconductor test chip comprising: a) a matrix of active semiconductor devices that can be individually tested, each active semiconductor device having a plurality n of terminals, where n is an integer greater than 2; b) a group of n device measurement lines for connection to external test circuitry, n-1 of said device measurement lines being permanently connected to terminals on said active semiconductor devices, and a remaining one of said device measurement lines being connected to a remaining terminal of each active semiconductor device through switch means associated with each said active semiconductor device; c) input means for receiving an instruction identifying a said active semiconductor device that it is desired to test; d) decoder means comprising a row decoder and a column decoder incorporated into said chip, said row and column decoders each having enabling lines corresponding to rows and columns of said matrix respectively, and said row and column decoders identifying, in accordance with a said received instruction, a row and column respectively of said active semiconductor device that it is desired to test by activating the corresponding enabling lines thereof; and e) a logic gate associated with each said active semiconductor device and receiving at its inputs said enabling lines corresponding to the row and column of its active semiconductor device, said logic gate activating the switch means of its associated active semiconductor device in response to enablement of the enabling lines connected to its inputs to connect the remaining terminal of its associated active semiconductor device to the remaining device measurement line and thereby activate said associated active semiconductor device.
Claim 2
Dependent Claim 265 words
A semiconductor test chip comprising: a) a matrix of active semiconductor devices that can be individually tested, each active semiconductor device having a plurality n of terminals, where n is an integer greater than 2; b) a group of n device measurement lines for connection to external test circuitry, n-1 of said device measurement lines being permanently connected to terminals on said active semiconductor devices, and a remaining one of said device measurement lines being connected to a remaining terminal of each active semiconductor device through switch means associated with each said active semiconductor device; c) input means for receiving an instruction identifying a said active semiconductor device that it is desired to test; d) decoder means comprising a row decoder and a column decoder incorporated into said chip, said row and column decoders each having enabling lines corresponding to rows and columns of said matrix respectively, and said row and column decoders identifying, in accordance with a said received instruction, a row and column respectively of said active semiconductor device that it is desired to test by activating the corresponding enabling lines thereof; and e) a logic gate associated with each said active semiconductor device and receiving at its inputs said enabling lines corresponding to the row and column of its active semiconductor device, said logic gate activating the switch means of its associated active semiconductor device in response to enablement of the enabling lines connected to its inputs to connect the remaining terminal of its associated active semiconductor device to the remaining device measurement line and thereby activate said associated active semiconductor device.
Claim 3
Dependent Claim 19 words
A semiconductor test chip as claimed in claim 1, wherein said switch means comprises at least one transmission gate.
Claim 4
Dependent Claim 48 words
A semiconductor test chip as claimed in claim 2, wherein said n-1 device measurement lines are permanently connected respectively to a source, drain and substrate of each said MOSFET, and the remaining device measurement line is connected through said transmission gate to a gate of each said MOSFET.
Claim 5
Dependent Claim 26 words
A semiconductor test chip as claimed in claim 3, wherein said logic gate also controls a transistor to enable and disable its associated semiconductor active device.
Claim 6
Dependent Claim 47 words
A semiconductor test chip as claimed in claim 2, wherein each said active semiconductor device is a MOSFET, and said logic gate also controls a transistor connected to a gate of said MOSFET for enabling said MOSFET when said logic gate activates said switch means associated therewith.
Claim 7
Dependent Claim 38 words
A semiconductor test chip as claimed in claim 5, wherein two of said n-1 device measurement lines, one being low impedance and the other being high impedance, are permanently connected to a same terminal of each said MOSFET.
Claim 8
Dependent Claim 26 words
A semiconductor test chip as claimed in claim 6, wherein said two of said n-1 device measurement lines are connected to a drain of said MOSFET.
Claim 9
Dependent Claim 40 words
A semiconductor test chip as claimed in claim 1, wherein said logic gate is a NOR gate, each said active semiconductor device is a MOSFET, and said switch means is a transmission gate connected to a drain of said MOSFET.
Claim 10
Dependent Claim 68 words
A semiconductor test chip as claimed in claim 8, further comprising, for each active semiconductor device, an operational amplifier having a first input connected to the remaining device measurement line, a second input connected through a second transmission gate to a drain of said MOSFET, and an output connected to said first-mentioned transmission gate, said logic circuit controlling both said transmission gates of each said active semiconductor device.

References Cited (Backward Citations)

US4800332A Cited
US4864165A Cited
US4719411A Cited
US5309091A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-04-16 1999-10-16 2000-04-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-04-16 2003-10-16 2004-04-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-04-16 2007-10-16 2008-04-16 $7700.00 Window Closed / Lapsed

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