Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
123 words
A method liar fabricating an electron emission apparatus comprising the steps of: providing an insulating substrate; forming a layer of an electrically resistive material on said substrate; depositing a layer of conductive material on said resistive layer and forming therefrom a conductive mesh structure and conductive plates, said conductive plates being formed within mesh spaces defined by the conductors of said mesh structure; forming an electrically insulating layer on said conductive plates; forming a conductive layer on said insulating layer overlying said conductive plates; forming apertures in said conductive layer over said conductive plates, said apertures extending through said insulating layer: and forming microtip emitters on said conductive plates, each emitter formed within a corresponding one of said apertures in said conductive layer.
Claim 2
Independent Claim
123 words
A method liar fabricating an electron emission apparatus comprising the steps of: providing an insulating substrate; forming a layer of an electrically resistive material on said substrate; depositing a layer of conductive material on said resistive layer and forming therefrom a conductive mesh structure and conductive plates, said conductive plates being formed within mesh spaces defined by the conductors of said mesh structure; forming an electrically insulating layer on said conductive plates; forming a conductive layer on said insulating layer overlying said conductive plates; forming apertures in said conductive layer over said conductive plates, said apertures extending through said insulating layer: and forming microtip emitters on said conductive plates, each emitter formed within a corresponding one of said apertures in said conductive layer.
Claim 3
Dependent Claim
21 words
The method in accordance with claim 1 wherein said step of forming a mesh structure includes forming substantially square mesh spaces.
Claim 4
Dependent Claim
34 words
The method in accordance with claim 1 wherein said step of forming apertures in said conductive layer over said conductive plates includes forming an equal number of apertures over each of said conductive plates.
Claim 5
Dependent Claim
40 words
The method in accordance with claim 1 wherein said step of forming conductive plates within mesh spaces defined by the conductors of said mesh structure includes forming each of said conductive plates to be substantially equally spaced from said conductors.
Claim 6
Dependent Claim
42 words
The method in accordance with claim 1 wherein said step of forming conductive plates within mesh spaces defined by the conductors of said mesh structure includes forming each of said conductive plates to have a substantially equal resistance paths to said conductors.
Claim 7
Dependent Claim
28 words
The method in accordance with claim 1 wherein said step of forming apertures in said conductive layer over said conductive plates includes forming said apertures as an array.
Claim 8
Dependent Claim
26 words
The method in accordance with claim 1 wherein said step of forming apertures in said conductive layer over said conductive plates includes forming generally circular apertures.
Claim 9
Dependent Claim
19 words
The method in accordance with claim 1 wherein said step of forming microtip emitters includes forming generally cone-shaped emitters.
Claim 10
Dependent Claim
29 words
The method in accordance with claim 1 wherein said step of forming a layer of an electrically resistive material on said substrate includes forming a layer of amorphous silicon.
Claim 11
Dependent Claim
19 words
The method in accordance with claim 1 wherein said step of forming microtip emitters includes forming emitters comprising molybdenum.
Claim 12
Dependent Claim
40 words
The method in accordance with claim 1 wherein said step of forming a conductive layer on said insulating layer overlying said conductive plates includes forming a layer of a material selected from the group comprising aluminum, chromium, molybdenum and niobium.
Claim 13
Dependent Claim
38 words
The method in accordance with claim 1 wherein said step of depositing a layer of conductive material on said resistive layer includes depositing a layer of a material selected from the group comprising aluminum, chromium, molybdenum and niobium.
Claim 14
Dependent Claim
29 words
The method in accordance with claim 1 wherein said step of forming a conductive layer on said insulating layer overlying said conductive plates includes forming a layer of niobium.
Claim 15
Independent Claim
133 words
A method for fabricating an electron emission apparatus comprising the steps of: providing an insulating substrate; depositing a first layer of conductive material on said substrate and forming a mesh structure therefrom, said mesh structure defining mesh spaces; forming a layer of an electrically resistive material on said substrate overlying said mesh structure; depositing a second layer of conductive material on said resistive layer and forming conductive plates therefrom overlying said mesh spaces; forming an electrically insulating layer on said conductive plates; forming a conductive layer on said insulating layer overlying said conductive plates; forming apertures in said conductive layer over said conductive plates, said apertures extending through said insulating layer; and forming microtip emitters on said conductive plates, each emitter formed within a corresponding one of said apertures in said conductive layer.
Claim 16
Independent Claim
133 words
A method for fabricating an electron emission apparatus comprising the steps of: providing an insulating substrate; depositing a first layer of conductive material on said substrate and forming a mesh structure therefrom, said mesh structure defining mesh spaces; forming a layer of an electrically resistive material on said substrate overlying said mesh structure; depositing a second layer of conductive material on said resistive layer and forming conductive plates therefrom overlying said mesh spaces; forming an electrically insulating layer on said conductive plates; forming a conductive layer on said insulating layer overlying said conductive plates; forming apertures in said conductive layer over said conductive plates, said apertures extending through said insulating layer; and forming microtip emitters on said conductive plates, each emitter formed within a corresponding one of said apertures in said conductive layer.
Claim 17
Dependent Claim
34 words
The method in accordance with claim 14 wherein said step of forming apertures in said conductive layer over said conductive plates includes forming an equal number of apertures over each of said conductive plates.
Claim 18
Dependent Claim
41 words
The method in accordance with claim 14 wherein said step of forming conductive plates from said second layer of conductive material overlying said mesh spaces includes forming each of said conductive plates to be substantially equally spaced from said mesh structure.
Claim 19
Dependent Claim
43 words
The method in accordance with claim 14 wherein said step of forming conductive plates from said second layer of conductive material overlying said mesh spaces includes forming each of said conductive plates to have a substantially equal resistance paths to said mesh structure.
Claim 20
Dependent Claim
26 words
The method in accordance with claim 14 wherein said step of forming apertures in said conductive layer over said conductive plates includes forming generally circular apertures.
Claim 21
Dependent Claim
19 words
The method in accordance with claim 14 wherein said step of forming microtip emitters includes forming generally cone-shaped emitters.
Claim 22
Dependent Claim
33 words
The method in accordance with claim 14 wherein said step of forming a layer of an electrically resistive material on said substrate overlying said mesh structure includes forming a layer of amorphous silicon.