US5503016A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vertically mounted accelerometer chip
Assignee: Measurement Specialties Inc
•
Filing: 1994-02-01
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Granted: 1996-04-02
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Expires: 2014-02-01
Abstract
Abstract Micro-machined accelerometer chips have a sensitive axis perpendicular to the principle surface of the device. In an application where the desired sensing direction is in the plane of a supporting printed circuit board, the accelerometer cannot be mounted directly on the printed circuit board and instead is mounted on a wall perpendicular to the printed circuit board. This requirement to wall-mount the sensor is eliminated by using an accelerometer chip packaged with a signal conditioning circuit in a multi layer ceramic chip carrier. Electrical connections are contained within the layers of the ceramic and terminate at a side surface of the chip carrier. Thus the accelerometer chip sits perpendicular to the printed circuit board and the ceramic chip carrier is attached directly thereto.
Inventors
- 👤 Edward F. Koen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 21:12
CPC Classifications
G; G01; G01P; G01P1/00; G01P1/02; G01P1/023; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; H; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
90 words
A transducer assembly comprising: a transducer chip having an axis of sensitivity, the axis of sensitivity being perpendicular to a principal surface of the transducer chip; a chip package housing the transducer chip; and a circuit board, wherein a side surface of the chip package is mounted directly to a surface of the circuit board, the side surface of the package being perpendicular to the principal surface of the transducer chip, so that the axis of sensitivity lies parallel to a plane defined by the surface of the circuit board.
Claim 2
Dependent Claim
90 words
A transducer assembly comprising: a transducer chip having an axis of sensitivity, the axis of sensitivity being perpendicular to a principal surface of the transducer chip; a chip package housing the transducer chip; and a circuit board, wherein a side surface of the chip package is mounted directly to a surface of the circuit board, the side surface of the package being perpendicular to the principal surface of the transducer chip, so that the axis of sensitivity lies parallel to a plane defined by the surface of the circuit board.
Claim 3
Dependent Claim
13 words
The assembly of claim 1, wherein the transducer chip is a micro-machined accelerometer.
Claim 4
Dependent Claim
26 words
The assembly of claim 1 wherein the chip package is a multi-layer ceramic chip carrier defining an interior recess in which the transducer chip is fixed.
Claim 5
Dependent Claim
48 words
The assembly of claim 1, further comprising a plurality of conductive elements connected to the transducer chip and extending through the chip package to a side surface thereof perpendicular to the principal surface of the transducer chip, the conductive elements connecting to contact pads on the circuit board.
Claim 6
Dependent Claim
22 words
The assembly of claim 4, wherein the conductive elements each include a conductive pad formed on the side surface of the package.
Claim 7
Dependent Claim
32 words
The assembly of claim 1, further comprising a plurality of attachment pads formed on the side surface of the package, the attachment pads being bonded to the surface of the circuit board.
Claim 8
Dependent Claim
18 words
The assembly of claim 3, further comprising a lid located over the recess and attached to the package.
Claim 9
Dependent Claim
27 words
The assembly of claim 3, further comprising an integrated circuit mounted in the recess in the package, the integrated circuit being electrically connected to the transducer chip.
Claim 10
Dependent Claim
22 words
The assembly of claim 1, wherein the chip package is a plastic lead frame package in which the transducer chip is affixed.
Claim 11
Independent Claim
131 words
A method of mounting a transducer on a circuit board, comprising the steps of: providing a transducer having an axis of sensitivity perpendicular to a principal surface of the transducer; providing a package having conductive traces extending on a side surface of the package; fixing the transducer in the package, so that the axis of sensitivity lies parallel to a plane defined by the side surface of the package and the principal surface of the transducer is perpendicular to the side surface of the package; and mounting the package on a surface of the circuit board, the side surface of the package being in direct contact with the surface of the circuit board, and the conductive traces being in electrical contact with associated traces on the surface of the circuit board.
Claim 12
Independent Claim
131 words
A method of mounting a transducer on a circuit board, comprising the steps of: providing a transducer having an axis of sensitivity perpendicular to a principal surface of the transducer; providing a package having conductive traces extending on a side surface of the package; fixing the transducer in the package, so that the axis of sensitivity lies parallel to a plane defined by the side surface of the package and the principal surface of the transducer is perpendicular to the side surface of the package; and mounting the package on a surface of the circuit board, the side surface of the package being in direct contact with the surface of the circuit board, and the conductive traces being in electrical contact with associated traces on the surface of the circuit board.
Claim 13
Dependent Claim
87 words
A transducer assembly for mounting on a circuit board comprising: a transducer chip having an axis of sensitivity perpendicular to a principal surface thereof; a chip package in which the transducer chip is affixed, the chip package having a side surface lying in a plane parallel to the axis of sensitivity and being perpendicular to the principal surface of the transducer chip; and a plurality of attachment points on the side surface of the chip package adapted to mounting the side surface directly to the circuit board.
Claim 14
Dependent Claim
87 words
A transducer assembly for mounting on a circuit board comprising: a transducer chip having an axis of sensitivity perpendicular to a principal surface thereof; a chip package in which the transducer chip is affixed, the chip package having a side surface lying in a plane parallel to the axis of sensitivity and being perpendicular to the principal surface of the transducer chip; and a plurality of attachment points on the side surface of the chip package adapted to mounting the side surface directly to the circuit board.
Claim 15
Dependent Claim
13 words
The assembly of claim 11, wherein the transducer chip is a micro-machined accelerometer.
Claim 16
Dependent Claim
26 words
The assembly of claim 11, wherein the chip package is a multi-layer ceramic chip carrier defining an interior recess in which the transducer chip is fixed.
Claim 17
Dependent Claim
39 words
The assembly of claim 11, further comprising a plurality of conductive elements contacting the transducer chip and extending through the chip package to the side surface thereof, the conductive elements adapted to contacting contact pads on the circuit board.
Claim 18
Dependent Claim
23 words
The assembly of claim 14, wherein the conductive elements each include a conductive pad formed on the side surface of the chip package.
Claim 19
Dependent Claim
19 words
The assembly of claim 13, further comprising a lid located over the recess and attached to the chip package.
Claim 20
Dependent Claim
28 words
The assembly of claim 13, further comprising an integrated circuit mounted in the recess in the chip package, the integrated circuit being electrically connected to the transducer chip.
Claim 21
Dependent Claim
15 words
The assembly of claim 11, wherein the chip package is a plastic lead frame package.
References Cited (Backward Citations)
DE2720484A1
Cited
JPS6012750A
Cited
US4700973A
Cited
JPS6390774A
Cited
US5163325A
Cited
US5060504A
Cited
US5012316A
Cited
US5044201A
Cited
US5043791A
Cited
US5109341A
Cited
WO1991011722A1
Cited
US5221400A
Cited
US5249465A
Cited
US5241861A
Cited
US5261694A
Cited
US5269187A
Cited
US5233873A
Cited
US5233874A
Cited
US5233871A
Cited
EP0557917A1
Cited
US5394326A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-04-02 | 1999-10-02 | 2000-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-04-02 | 2003-10-02 | 2004-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-04-02 | 2007-10-02 | 2008-04-02 | $7700.00 | Window Closed / Lapsed |