US5012316A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multiaxial transducer interconnection apparatus
Assignee: Cardiac Pacemakers Inc
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Filing: 1989-03-28
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Granted: 1991-04-30
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Expires: 2009-03-28
Abstract
Abstract A multiaxial transducer interconnection apparatus. The apparatus comprises first, second and third substrate modules each having a plurality of electrical tracks thereon. A portion of the electrical tracks is structured and arranged to interconnect the substrate modules in an orthogonal relationship to each other. The plurality of tracks on each substrate module is further arranged to form a pattern identical to the plurality of tracks on the other substrate modules. The substrate modules each include a mounting region whereon transducer die elements are mounted. One alternate embodiment of the invention would include a base upon which the modules would mount. Another alternate invention of the invention employs a chip carrier to support the multiaxial transducer of the invention.
Inventors
- 👤 Emanuel H. Silvermint
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:44
CPC Classifications
A; A61; A61N; A61N1/00; A61N1/18; A61N1/32; A61N1/36; A61N1/362; A61N1/365; A61N1/36514; A61N1/36542; G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; G01P15/18; H; H01; H01R; H01R12/00; H01R12/70; H01R12/71; H01R12/712; H01R12/714
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
74 words
A mounting apparatus for multiaxial transducer including at least two transducer die elements having bonding pads comprising: (a) a base having at least two orthogonal mounting surfaces; and (b) at least two identical substrate modules electrically interconnected to each other, each having a plurality of identical tracks, and each of which is mounted to a respective one of the mounting surfaces each including a mounting region for mounting respective one of the die elements.
Claim 2
Dependent Claim
74 words
A mounting apparatus for multiaxial transducer including at least two transducer die elements having bonding pads comprising: (a) a base having at least two orthogonal mounting surfaces; and (b) at least two identical substrate modules electrically interconnected to each other, each having a plurality of identical tracks, and each of which is mounted to a respective one of the mounting surfaces each including a mounting region for mounting respective one of the die elements.
Claim 3
Dependent Claim
19 words
The mounting apparatus of claim 1 which further comprises an IC chip carrier upon which the base is mounted.
Claim 4
Dependent Claim
84 words
A multiaxial transducer interconnection apparatus comprising first and second substrate modules each having a plurality of electrical tracks thereon, wherein the plurality of electrical tracks on each substrate module are structured and arranged to electrically interconnect the substrate modules in an orthogonal relationship to each other, wherein the plurality of tracks on the first substrate module is identically fabricated to form a pattern identical to the plurality of tracks on the second substrate module and wherein the substrate modules each include a mounting region.
Claim 5
Dependent Claim
84 words
A multiaxial transducer interconnection apparatus comprising first and second substrate modules each having a plurality of electrical tracks thereon, wherein the plurality of electrical tracks on each substrate module are structured and arranged to electrically interconnect the substrate modules in an orthogonal relationship to each other, wherein the plurality of tracks on the first substrate module is identically fabricated to form a pattern identical to the plurality of tracks on the second substrate module and wherein the substrate modules each include a mounting region.
Claim 6
Dependent Claim
94 words
A multiaxial transducer interconnection apparatus comprising first, second and third substrate modules each having a plurality of electrical tracks deposited thereon, wherein a the plurality of electrical tracks on each substrate module is structured and arranged to electrically interconnect the substrate modules in an orthogonal relationship to each other, wherein the plurality of tracks on the first, second and third substrate modules are identically fabricated when they are deposited to form identical circuit patterns to the plurality of tracks on the other substrate modules, and wherein the substrate modules each include a mounting region.
Claim 7
Dependent Claim
94 words
A multiaxial transducer interconnection apparatus comprising first, second and third substrate modules each having a plurality of electrical tracks deposited thereon, wherein a the plurality of electrical tracks on each substrate module is structured and arranged to electrically interconnect the substrate modules in an orthogonal relationship to each other, wherein the plurality of tracks on the first, second and third substrate modules are identically fabricated when they are deposited to form identical circuit patterns to the plurality of tracks on the other substrate modules, and wherein the substrate modules each include a mounting region.
Claim 8
Dependent Claim
56 words
The apparatus of claim 4 further including first, second and third transducer die elements, each having a sensitivity axis, wherein the first, second and third transducer die elements are each mounted on respective one of the mounting regions and arranged so as to orient each sensitivity axis in an orthogonal relationship to the other sensitivity axes.
Claim 9
Dependent Claim
54 words
The apparatus of claim 3 further including first and second transducer die elements, each having a sensitivity axis, wherein the first and second transducer die elements are each mounted on respective one of the mounting regions and arranged so as to orient each sensitivity axis in a orthogonal relationship to the other sensitivity axis.
Claim 10
Dependent Claim
16 words
The apparatus of claim 1 wherein the first, second and third transducer die elements are accelerometers.
Claim 11
Dependent Claim
14 words
The apparatus of claim 6 wherein the first and second die elements are accelerometers.
Claim 12
Dependent Claim
14 words
The apparatus of claim 3 wherein the substrate modules are fabricated from ceramic material.
Claim 13
Dependent Claim
34 words
The apparatus of claim 3 wherein the plurality of electrical tracks of each module further comprise at least two tracks for carrying electrical power and at least to tracks for carrying an electrical signal.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-29 | 1994-10-29 | 1995-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-29 | 1998-10-29 | 1999-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-29 | 2002-10-29 | 2003-04-30 | $7700.00 | Window Closed / Lapsed |